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2SK3153 Silicon N Channel MOS FET High Speed Power Switching REJ03G1078-0300 (Previous: ADE-208-733A) Rev.3.00 Sep 07, 2005 Features * Low on-resistance RDS =65 m typ. * High speed switching * 4 V gate drive device can be driven from 5 V source Outline RENESAS Package code: PRSS0003AD-A (Package name: TO-220FM) D G 1. Gate 2. Drain 3. Source 1 23 S Rev.3.00 Sep 07, 2005 page 1 of 7 2SK3153 Absolute Maximum Ratings (Ta = 25C) Item Drain to source voltage Gate to source voltage Drain current Drain peak current Body-drain diode reverse drain current Avalanche current Avalanche energy Channel dissipation Channel temperature Storage temperature Notes: 1. PW 10 s, duty cycle 1 % 2. Value at Tc = 25C 3. Value at Tch = 25C, Rg 50 Symbol VDSS VGSS ID ID(pulse)Note1 IDR IAP Note3 EAR Note3 Pch Note2 Tch Tstg Ratings 120 20 15 60 15 15 19 30 150 -55 to +150 Unit V V A A A A mJ W C C Electrical Characteristics (Ta = 25C) Item Drain to source breakdown voltage Gate to source breakdown voltage Gate to source leak current Zero gate voltage drain current Gate to source cutoff voltage Static drain to source on state resistance Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Body-drain diode forward voltage Body-drain diode reverse recovery time Note: 4. Pulse test Symbol V(BR)DSS V(BR)GSS IGSS IDSS VGS(off) RDS(on) RDS(on) |yfs| Ciss Coss Crss td(on) tr td(off) tf VDF trr Min 120 20 -- -- 1.0 -- -- 8.5 -- -- -- -- -- -- -- -- -- Typ -- -- -- -- -- 65 80 14 860 360 195 15 95 200 130 0.9 100 Max -- -- 10 10 2.5 85 110 -- -- -- -- -- -- -- -- -- -- Unit V V A A V m m S pF pF pF ns ns ns ns V ns Test Conditions ID = 10 mA, VGS = 0 IG = 100 A, VDS = 0 VGS = 16 V, VDS = 0 VDS = 120 V, VGS = 0 ID = 1 mA, VDS = 10 V ID = 8 A, VGS = 10 VNote4 ID = 8 A, VGS = 4 V Note4 ID = 8 A, VDS = 10 V Note4 VDS = 10 V, VGS = 0, f = 1 MHz ID = 8 A, VGS = 10 V, RL = 3.75 IF = 15 A, VGS = 0 IF = 15 A, VGS = 0 diF/ dt = 50 A/ s Rev.3.00 Sep 07, 2005 page 2 of 7 2SK3153 Main Characteristics Power vs. Temperature Derating 40 1000 300 30 Maximum Safe Operation Area Channel Dissipation Pch (W) Drain Current ID (A) 100 30 PW 20 10 3 1 0.3 D C O 1 10 0 s 0 s 1 m s = pe 10 ra t (T ion c = Operation in 5 this area is C limited by RDS(on) ) s t) m sho 10 (1 2 0 50 100 150 200 Ta = 25C 0.1 0.1 0.3 1 3 10 30 100 300 1000 Case Temperature TC (C) Drain to Source Voltage VDS (V) Typical Output Characteristics 50 Pulse Test VGS = 10 V Typical Transfer Characteristics 20 6V 5V Drain Current ID (A) 30 Drain Current ID (A) 40 4.5 V 16 VDS = 10 V Pulse Test 4V 3.5 V 3V 2.5 V 12 20 8 25C 75C Tc = -25C 10 4 0 2 4 6 8 10 0 1 2 3 4 5 Drain to Source Voltage VDS (V) Drain to Source Saturation Voltage vs. Gate to Source Voltage Drain to Source Saturation Voltage VDS (on) (V) 2.0 Pulse Test Gate to Source Voltage VGS (V) Static Drain to Source on State Resistance vs. Drain Current 1000 Static Drain to Source on State Resistance RDS (on) (m) Pulse Test 300 1.6 1.2 ID = 15 A 0.8 10 A 5A 100 VGS = 4 V 10 V 30 0.4 10 0 4 8 12 16 20 0.1 0.3 1 3 10 30 100 Gate to Source Voltage VGS (V) Drain Current ID (A) Rev.3.00 Sep 07, 2005 page 3 of 7 2SK3153 Static Drain to Source on State Resistance vs. Temperature 200 Pulse Test 160 ID = 15 A 15 A 4V 5 A, 10 A 5 A, 10 A Static Drain to Source on State Resistance RDS (on) (m) Forward Transfer Admittance vs. Drain Current Forward Transfer Admittance yfs (S) 100 30 Tc = -25C 10 3 1 0.3 0.1 0.1 VDS = 10 V Pulse Test 120 25C 75C 80 40 0 -40 VGS = 10 V 0 40 80 120 160 0.3 1 3 10 30 100 Case Temperature TC (C) Body to Drain Diode Reverse Recovery Time 1000 10000 3000 300 Drain Current ID (A) Typical Capacitance vs. Drain to Source Voltage VGS = 0 f = 1 MHz Reverse Recovery Time trr (ns) Capacitance C (pF) 1000 300 Ciss 100 Coss 100 30 10 Crss 30 di / dt = 50 A / s VGS = 0, Ta = 25C 0.3 1 3 10 30 10 0.1 0 10 20 30 40 50 Reverse Drain Current IDR (A) Drain to Source Voltage VDS (V) Dynamic Input Characteristics Drain to Source Voltage VDS (V) ID = 15 A VGS VDD = 120 V 50 V 25 V Switching Characteristics Gate to Source Voltage VGS (V) 20 1000 500 td(off) tf tr td(on) 200 160 16 Switching Time t (ns) 200 100 50 20 10 5 2 1 0.1 0.2 VGS = 10 V, VDD = 30 V PW = 5 s, duty < 1 % 120 12 80 VDD = 120 V 50 V 25 V 8 40 4 VDS 0 20 40 60 80 0 100 0.5 1 2 5 10 20 50 Gate Charge Qg (nc) Drain Current ID (A) Rev.3.00 Sep 07, 2005 page 4 of 7 2SK3153 Reverse Drain Current vs. Source to Drain Voltage Maximum Avalanche Energy vs. Channel Temperature Derating Repetitive Avalanche Energy EAR (mJ) (A) 20 25 IAP= 15 A VDD = 50 V duty < 0.1 % Rg > 50 Pulse Test Reverse Drain Current IDR 16 20 12 10 V VGS = 0 15 8 5V 4 10 5 0 25 0 0.4 0.8 1.2 1.6 2.0 50 75 100 125 150 Source to Drain Voltage VSD (V) Channel Temperature Tch (C) Normalized Transient Thermal Impedance vs. Pulse Width Normalized Transient Thermal Impedance s (t) 3 Tc = 25C 1 D=1 0.5 0.3 0.2 0.1 0.1 0.05 ch - c(t) = s (t) * ch - c ch - c = 4.17C/W, Tc = 25C PDM D= PW T 0.03 0.02 1 0.0 PW T 0.01 10 1s t ho pu lse 100 1m 10 m 100 m 1 10 Pulse Width Avalanche Test Circuit VDS Monitor L IAP Monitor PW (S) Avalanche Waveform EAR = 1 2 * L * IAP2 * VDSS VDSS - VDD V(BR)DSS IAP Rg D. U. T VDD VDS ID Vin 15 V 50 0 VDD Rev.3.00 Sep 07, 2005 page 5 of 7 2SK3153 Switching Time Test Circuit Vin Monitor D.U.T. RL Vin Vin 10 V 50 VDD = 30 V Vout 10% 10% 10% Vout Monitor Switching Time Waveforms 90% 90% td(on) tr 90% td(off) tf Rev.3.00 Sep 07, 2005 page 6 of 7 2SK3153 Package Dimensions JEITA Package Code SC-67 RENESAS Code PRSS0003AD-A Package Name TO-220FM / TO-220FMV MASS[Typ.] 1.8g Unit: mm 10.0 0.3 7.0 0.3 3.2 0.2 2.8 0.2 2.5 0.2 0.6 5.0 0.3 2.0 0.3 1.2 0.2 1.4 0.2 12.0 0.3 4.45 0.3 2.5 0.7 0.1 2.54 0.5 2.54 0.5 0.5 0.1 Ordering Information Part Name 2SK3153-E Quantity 500 pcs Box (Sack) Shipping Container Note: For some grades, production may be terminated. Please contact the Renesas sales office to check the state of production before ordering the product. Rev.3.00 Sep 07, 2005 page 7 of 7 14.0 1.0 17.0 0.3 Sales Strategic Planning Div. Keep safety first in your circuit designs! Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein. 5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use. 6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials. 7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination. Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited. 8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein. RENESAS SALES OFFICES Refer to "http://www.renesas.com/en/network" for the latest and detailed information. Renesas Technology America, Inc. 450 Holger Way, San Jose, CA 95134-1368, U.S.A Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501 Renesas Technology Europe Limited Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K. Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900 Renesas Technology Hong Kong Ltd. 7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel: <852> 2265-6688, Fax: <852> 2730-6071 Renesas Technology Taiwan Co., Ltd. 10th Floor, No.99, Fushing North Road, Taipei, Taiwan Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999 Renesas Technology (Shanghai) Co., Ltd. Unit2607 Ruijing Building, No.205 Maoming Road (S), Shanghai 200020, China Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952 Renesas Technology Singapore Pte. Ltd. 1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632 Tel: <65> 6213-0200, Fax: <65> 6278-8001 Renesas Technology Korea Co., Ltd. Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea Tel: <82> 2-796-3115, Fax: <82> 2-796-2145 http://www.renesas.com Renesas Technology Malaysia Sdn. Bhd. Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: <603> 7955-9390, Fax: <603> 7955-9510 (c) 2005. Renesas Technology Corp., All rights reserved. Printed in Japan. Colophon .3.0 |
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