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19-3766; Rev 0; 7/05 KIT ATION EVALU BLE AVAILA 2.6W Stereo Audio Power Amplifier and DirectDrive Headphone Amplifier General Description Features No DC-Blocking Capacitors Required--Provides Industry's Most Compact Notebook Audio Solution PC2001 Compliant 5V Single-Supply Operation Class AB 2.6W Stereo BTL Speaker Amplifiers 110mW DirectDrive Headphone Amplifiers High 90dB PSRR Low-Power Shutdown Mode Industry-Leading Click-and-Pop Suppression Low 0.01% THD+N at 1kHz Short-Circuit and Thermal-Overload Protection Selectable Gain Settings (15dB, 16.5dB, 18dB, and 19.5dB) 8kV ESD-Protected Headphone Driver Outputs Available in Space-Saving, Thermally Efficient Package 28-Pin Thin QFN (5mm x 5mm x 0.8mm) MAX9779 The MAX9779 combines a stereo, 2.6W audio power amplifier and stereo DirectDriveTM 110mW headphone amplifier in a single device. The headphone amplifier uses Maxim's patented DirectDrive architecture that produces a ground-referenced output from a single supply, eliminating the need for large DC-blocking capacitors, saving cost, space, and component height. A high 90dB PSRR and low 0.01% THD+N ensures clean, low-distortion amplification of the audio signal through the Class AB speaker amplifiers. The MAX9779 features a single-supply voltage, a shutdown mode, logic-selectable gain, and a headphone sense input. Industry-leading click-and-pop suppression eliminates audible transients during power and shutdown cycles. The MAX9779 is offered in a space-saving, thermally efficient 28-pin thin QFN (5mm x 5mm x 0.8mm) package. The device has thermal-overload and output short-circuit protection, and is specified over the extended -40C to +85C temperature range. Applications Notebook PCs Tablet PCs Flat-Panel TVs Multimedia Monitors Portable DVD Players LCD Projectors Simplified Block Diagram PART MAX9779ETI+ AB +Denotes Ordering Information TEMP RANGE -40C to +85C PIN-PACKAGE 28 Thin QFN-EP* lead-free package. *EP = Exposed paddle. AB MAX9779 GAIN Pin Configuration appears at end of data sheet. ________________________________________________________________ Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim's website at www.maxim-ic.com. 2.6W Stereo Audio Power Amplifier and DirectDrive Headphone Amplifier MAX9779 ABSOLUTE MAXIMUM RATINGS Supply Voltage (VDD, PVDD, HPVDD, CPVDD to GND)..........+6V GND to PGND.....................................................................0.3V CPVSS, C1N, VSS to GND .........................-6.0V to (GND + 0.3V) HPOUT_ to GND ....................................................................3V Any Other Pin .............................................-0.3V to (VDD + 0.3V) Duration of OUT_ _ Short Circuit to GND or PVDD .....Continuous Duration of OUT_+ Short Circuit to OUT_- .................Continuous Duration of HPOUT_ Short Circuit to GND, VSS or HPVDD .........................................................Continuous Continuous Current (PVDD, OUT_ _, PGND) ........................1.7A Continuous Current (CPVDD, C1N, C1P, CPVSS, VSS, HPVDD, HPOUT_) .......................................................................850mA Continuous Input Current (all other pins) .........................20mA Continuous Power Dissipation (TA = +70C) 28-Pin Thin QFN (derate 20.8mW/C above +70C) ..1667mW Junction Temperature ......................................................+150C Operating Temperature Range ...........................-40C to +85C Storage Temperature Range .............................-65C to +150C Lead Temperature (soldering, 10s) .................................+300C Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ELECTRICAL CHARACTERISTICS (VDD = PVDD = CPVDD = HPVDD = 5V, GND = PGND = CPGND = 0V, SHDN = VDD, CBIAS = 1F, C1 = C2 = 1F, speaker load terminated between OUT_+ and OUT_-, headphone load terminated between HPOUT_ and GND, GAIN1 = GAIN2 = 0V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25C.) (Note 1) PARAMETER GENERAL Supply Voltage Range Headphone Supply Voltage Quiescent Supply Current Shutdown Supply Current Bias Voltage Switching Time Input Resistance Turn-On Time SPEAKER AMPLIFIER (HPS = GND) Output Offset Voltage VOS Measured between OUT_+ and OUT_-, TA = +25C PVDD or VDD = 4.5V to 5.5V (TA = +25C) Power-Supply Rejection Ratio (Note 3) PSRR f = 1kHz, VRIPPLE = 200mVP-P f = 10kHz, VRIPPLE = 200mVP-P 75 1 90 80 55 dB 15 mV VDD, PVDD CPVDD, HPVDD IDD ISHDN VBIAS tSW RIN tSON Gain or input switching Amplifier inputs (Note 2) 10 Inferred from PSRR test Inferred from PSRR test HPS = GND, speaker mode, RL = HPS = VDD, headphone mode, RL = SHDN = GND 1.7 4.5 3.0 14 7 0.2 1.8 10 20 25 30 5.5 5.5 29 13 5 1.9 V V mA A V s k ms SYMBOL CONDITIONS MIN TYP MAX UNITS 2 _______________________________________________________________________________________ 2.6W Stereo Audio Power Amplifier and DirectDrive Headphone Amplifier ELECTRICAL CHARACTERISTICS (continued) (VDD = PVDD = CPVDD = HPVDD = 5V, GND = PGND = CPGND = 0V, SHDN = VDD, CBIAS = 1F, C1 = C2 = 1F, speaker load terminated between OUT_+ and OUT_-, headphone load terminated between HPOUT_ and GND, GAIN1 = GAIN2 = 0V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25C.) (Note 1) PARAMETER SYMBOL THD+N = 1%, f = 1kHz, TA = +25C CONDITIONS RL = 8 RL = 4 RL = 3 MIN 0.9 TYP 1.4 2.3 2.6 0.01 0.02 90 80 200 75 1.4 GAIN1 = 0, GAIN2 = 0 Gain (Maximum Volume Setting) AVMAX(SPKR) GAIN1 = 1, GAIN2 = 0 GAIN1 = 0, GAIN2 = 1 GAIN1 = 1, GAIN2 = 1 HEADPHONE AMPLIFIER (HPS = VDD) Output Offset Voltage Power-Supply Rejection Ratio (Note 3) VOS PSRR TA = +25C HPVDD = 3V to 5.5V, TA = +25C f = 1kHz, VRIPPLE = 200mVP-P f = 10kHz, VRIPPLE = 200mVP-P Output Power Total Harmonic Distortion Plus Noise Signal-to-Noise Ratio Noise Capacitive-Load Drive Crosstalk Off-Isolation Slew Rate ESD Gain SR ESD AV IEC air discharge GAIN2 = 0, GAIN1 = X GAIN2 = 1, GAIN1 = X POUT THD+N = 1%, f = 1kHz, TA = +25C RL = 32 RL = 16 40 60 2 75 73 63 50 mW 110 0.007 0.03 95 12 200 88 74 0.4 8 0 3 dB V/s kV dB % dB VRMS pF dB 7 mV 15 16.5 18 19.5 dB % dB VRMS pF dB V/s W MAX UNITS MAX9779 Output Power (Note 4) POUT Total Harmonic Distortion Plus Noise Signal-to-Noise Ratio Noise Capacitive-Load Drive Crosstalk Slew Rate THD+N SNR Vn CL SR RL = 8, POUT = 500mW, f = 1kHz RL = 4, POUT = 1W, f = 1kHz RL = 8, POUT = 500mW, BW = 22Hz to 22kHz BW = 22Hz to 22kHz, A-weighted No sustained oscillations L to R, R to L, f = 10kHz THD+N SNR Vn CL RL = 32, POUT = 20mW, f = 1kHz RL = 16, POUT = 75mW, f = 1kHz RL = 32, POUT = 50mW, BW = 22Hz to 22kHz BW = 22Hz to 22kHz No sustained oscillations L to R, R to L, f = 10kHz Any unselected input to any active input, f = 10kHz, input referred _______________________________________________________________________________________ 3 2.6W Stereo Audio Power Amplifier and DirectDrive Headphone Amplifier MAX9779 ELECTRICAL CHARACTERISTICS (continued) (VDD = PVDD = CPVDD = HPVDD = 5V, GND = PGND = CPGND = 0V, SHDN = VDD, CBIAS = 1F, C1 = C2 = 1F, speaker load terminated between OUT_+ and OUT_-, headphone load terminated between HPOUT_ and GND, GAIN1 = GAIN2 = 0V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25C.) (Note 1) PARAMETER CHARGE PUMP Charge-Pump Frequency LOGIC INPUT (SHDN, GAIN1, GAIN2) Logic-Input High Voltage Logic-Input Low Voltage Logic-Input Current LOGIC-INPUT HEADPHONE (HPS) Logic-Input High Voltage Logic-Input Low Voltage Logic-Input Current VIH VIL IIN 10 2 0.8 V V A VIH VIL IIN 2 0.8 1 V V A fOSC 500 550 600 kHz SYMBOL CONDITIONS MIN TYP MAX UNITS Note 1: Note 2: Note 3: Note 4: All devices are 100% production tested at room temperature. All temperature limits are guaranteed by design. Guaranteed by design. Not production tested. PSRR is specified with the amplifier input connected to GND through CIN. Output power levels are measured with the thin QFN's exposed paddle soldered to the ground plane. 4 _______________________________________________________________________________________ 2.6W Stereo Audio Power Amplifier and DirectDrive Headphone Amplifier MAX9779 Typical Operating Characteristics (Measurement BW = 22Hz to 22kHz, TA = +25C, unless otherwise noted.) TOTAL HARMONIC DISTORTION PLUS NOISE vs. FREQUENCY (SPEAKER MODE) MAX9779 toc01 TOTAL HARMONIC DISTORTION PLUS NOISE vs. FREQUENCY (SPEAKER MODE) MAX9779 toc02 TOTAL HARMONIC DISTORTION PLUS NOISE vs. FREQUENCY (SPEAKER MODE) VDD = 5V RL = 8 MAX9779 toc03 10 VDD = 5V RL = 3 10 VDD = 5V RL = 4 10 1 OUTPUT POWER = 1.5W 0.1 1 OUTPUT POWER = 1.25W 0.1 1 OUTPUT POWER = 100mW THD+N (%) THD+N (%) THD+N (%) 0.1 0.01 OUTPUT POWER = 500mW 0.001 0.01 OUTPUT POWER = 500mW 0.001 0.01 OUTPUT POWER = 600mW 0.001 0.0001 10 100 1k FREQUENCY (Hz) 10k 100k 0.0001 10 100 1k FREQUENCY (Hz) 10k 100k 0.0001 10 100 1k FREQUENCY (Hz) 10k 100k TOTAL HARMONIC DISTORTION PLUS NOISE vs. OUTPUT POWER (SPEAKER MODE) MAX9779 toc04 TOTAL HARMONIC DISTORTION PLUS NOISE vs. OUTPUT POWER (SPEAKER MODE) MAX9779 toc05 TOTAL HARMONIC DISTORTION PLUS NOISE vs. OUTPUT POWER (SPEAKER MODE) VDD = 5V RL = 8 10 MAX9779 toc06 100 VDD = 5V RL = 3 10 100 VDD = 5V RL = 4 10 100 THD+N (%) THD+N (%) 1 f = 10kHz f = 1kHz 0.1 1 f = 10kHz 0.1 f = 1kHz THD+N (%) 1 f = 10kHz 0.1 f = 1kHz 0.01 f = 20Hz 0.001 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 OUTPUT POWER (W) 0.01 f = 20Hz 0.001 0 0.5 1.0 1.5 2.0 2.5 3.0 OUTPUT POWER (W) 0.01 f = 20Hz 0 0.5 1.0 1.5 0.001 OUTPUT POWER (W) OUTPUT POWER vs. LOAD RESISTANCE (SPEAKER MODE) MAX9779 toc07 POWER DISSIPATION vs. OUTPUT POWER (SPEAKER MODE) MAX9779 toc08 POWER-SUPPLY REJECTION RATIO vs. FREQUENCY (SPEAKER MODE) -10 -20 -30 VRIPPLE = 200mVP-P OUTPUT REFERRED MAX9779 toc09 3.5 3.0 THD+N = 10% OUTPUT POWER (W) 2.5 2.0 THD+N = 1% 1.5 1.0 0.5 0 1 10 LOAD RESISTANCE () 5 VDD = 5V f = 1kHz POUT = POUTL + POUTR 0 POWER DISSIPATION (W) 4 RL = 4 2 RL = 8 PSRR (dB) 2 3 4 3 -40 -50 -60 -70 -80 -90 1 0 100 0 1 OUTPUT POWER (W) -100 10 100 1k FREQUENCY (Hz) 10k 100k _______________________________________________________________________________________ 5 2.6W Stereo Audio Power Amplifier and DirectDrive Headphone Amplifier MAX9779 Typical Operating Characteristics (continued) (Measurement BW = 22Hz to 22kHz, TA = +25C, unless otherwise noted.) CROSSTALK vs. FREQUENCY (SPEAKER MODE) -10 -20 CROSSTALK (dB) -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 10 100 1k FREQUENCY (Hz) 10k 100k 20ms/div VDD = 5V VRIPPLE = 200mVP-P RL = 4 MAX9779 toc10 TURN-ON RESPONSE (SPEAKER MODE) MAX9779 toc11 0 5V/div SHDN OUT_+ AND OUT_- 2V/div LEFT TO RIGHT RIGHT TO LEFT OUT_+ - OUT_RL = 8 100mV/div TURN-OFF RESPONSE (SPEAKER MODE) MAX9779 toc12 TOTAL HARMONIC DISTORTION PLUS NOISE vs. FREQUENCY (HEADPHONE MODE) MAX9779 toc13 TOTAL HARMONIC DISTORTION PLUS NOISE vs. FREQUENCY (HEADPHONE MODE) VDD = 5V RL = 32 AV = 3dB OUTPUT POWER = 45mW THD+N (%) 0.1 MAX9779 toc14 10 5V/div VDD = 5V RL = 16 AV = 3dB OUTPUT POWER = 90mW THD+N (%) 2V/div 0.1 10 SHDN OUT_+ AND OUT_- 1 1 0.01 OUTPUT POWER = 30mW 0.01 OUTPUT POWER = 10mW OUT_+ - OUT_RL = 8 20mV/div 0.001 0.0001 20ms/div 10 100 1k FREQUENCY (Hz) 10k 100k 0.001 0.0001 10 100 1k FREQUENCY (Hz) 10k 100k TOTAL HARMONIC DISTORTION PLUS NOISE vs. FREQUENCY (HEADPHONE MODE) MAX9779 toc15 TOTAL HARMONIC DISTORTION PLUS NOISE vs. FREQUENCY (HEADPHONE MODE) MAX9779 toc16 TOTAL HARMONIC DISTORTION PLUS NOISE vs. OUTPUT POWER (HEADPHONE MODE) VDD = 5V RL = 16 AV = 3dB MAX9779 toc17 10 VDD = 3.3V RL = 16 AV = 3dB OUTPUT POWER = 30mW 10 VDD = 3.3V RL = 32 AV = 3dB OUTPUT POWER = 45mW THD+N (%) 0.1 1000 100 10 THD+N (%) 1 0.1 0.01 1 1 THD+N (%) 0.1 fIN = 10kHz 0.01 OUTPUT POWER = 10mW 0.01 OUTPUT POWER = 10mW 0.001 0.001 0.0001 10 100 1k FREQUENCY (Hz) 10k 100k fIN = 20Hz 0.0001 10 100 1k FREQUENCY (Hz) 10k 100k 0.001 0 25 fIN = 1kHz 50 75 100 OUTPUT POWER (mW) 125 150 6 _______________________________________________________________________________________ 2.6W Stereo Audio Power Amplifier and DirectDrive Headphone Amplifier MAX9779 Typical Operating Characteristics (continued) (Measurement BW = 22Hz to 22kHz, TA = +25C, unless otherwise noted.) TOTAL HARMONIC DISTORTION PLUS NOISE vs. OUTPUT POWER (HEADPHONE MODE) MAX9779 toc18 TOTAL HARMONIC DISTORTION PLUS NOISE vs. OUTPUT POWER (HEADPHONE MODE) MAX9779 toc19 TOTAL HARMONIC DISTORTION PLUS NOISE vs. OUTPUT POWER (HEADPHONE MODE) VDD = 3.3V RL = 32 AV = 3dB MAX9779 toc20 1000 100 10 VDD = 5V RL = 32 AV = 3dB 1000 100 10 THD+N (%) VDD = 3.3V RL = 16 AV = 3dB 1000 100 10 THD+N (%) fIN = 1kHz 1 THD+N (%) 1 0.1 0.01 0.001 0 20 fIN = 1kHz fIN = 10kHz fIN = 20Hz 1 fIN = 1kHz fIN = 20Hz fIN = 20Hz 0.1 0.01 0.001 fIN = 10kHz fIN = 10kHz 0.1 0.01 0.001 40 60 80 100 0 10 20 30 40 50 60 0 10 20 OUTPUT POWER (mW) OUTPUT POWER (mW) 30 40 50 60 70 OUTPUT POWER (mW) 80 90 OUTPUT POWER vs. LOAD RESISTANCE (HEADPHONE MODE) MAX9779 toc21 POWER DISSIPATION vs. OUTPUT POWER (HEADPHONE MODE) MAX9779 toc22 OUTPUT POWER vs. SUPPLY VOLTAGE (HEADPHONE MODE) RL = 16 100 OUTPUT POWER (mW) MAX9779 toc23 180 160 140 OUTPUT POWER (mW) 120 100 80 60 40 20 0 10 100 LOAD RESISTANCE () THD+N = 1% THD+N = 10% 250 225 POWER DISSIPATION (mW) 200 175 150 125 100 75 50 25 0 125 RL = 16 75 RL = 32 50 RL = 32 VDD = 5V f = 1kHz POUT = POUTL + POUTR 0 25 50 75 100 125 150 175 200 225 250 OUTPUT POWER (mW) 25 f = 1kHz 0 3.0 3.5 4.0 4.5 5.0 5.5 SUPPLY VOLTAGE (V) 1000 POWER-SUPPLY REJECTION RATIO vs. FREQUENCY (HEADPHONE MODE) MAX9779 toc24 CROSSTALK vs. FREQUENCY (HEADPHONE MODE) VDD = 5V VRIPPLE = 200mVP-P RL = 32 MAX9779 toc25 0 -10 -20 -30 PSRR (dB) -40 -50 -60 -70 -80 -90 -100 10 0 -20 CROSSTALK (dB) -40 -60 -80 VRIPPLE = 200mVP-P OUTPUT REFERRED RIGHT TO LEFT -100 LEFT TO RIGHT -120 100 1k FREQUENCY (Hz) 10k 100k 10 100 1k FREQUENCY (Hz) 10k 100k _______________________________________________________________________________________ 7 2.6W Stereo Audio Power Amplifier and DirectDrive Headphone Amplifier MAX9779 Typical Operating Characteristics (continued) (Measurement BW = 22Hz to 22kHz, TA = +25C, unless otherwise noted.) OUTPUT POWER vs. CHARGE-PUMP CAPACITANCE AND LOAD RESISTANCE MAX9779 toc26 HEADPHONE OUTPUT SPECTRUM VDD = 5V f = 1kHz VOUT = -60dB RL = 32 MAX9779 toc27 200 180 160 OUTPUT POWER (mW) 140 120 100 80 60 40 20 0 10 20 30 C1 = C2 = 1F 0 -20 MAGNITUDE (dB) -40 -60 -80 -100 -120 -140 VDD = 5V f = 1kHz THD+N = 1% C1 = C2 = 2.2F 40 50 0 5 10 FREQUENCY (Hz) 15 20 LOAD RESISTANCE () TURN-ON RESPONSE (HEADPHONE MODE) MAX9750/51 toc28 TURN-OFF RESPONSE (HEADPHONE MODE) MAX9750/51 toc29 5V/div SHDN SHDN 5V/div HPOUT_ 20mV/div HPOUT_ 20mV/div RL = 32 10ms/div RL = 32 10ms/div SUPPLY CURRENT vs. SUPPLY VOLTAGE MAX9779 toc30 SHUTDOWN SUPPLY CURRENT vs. SUPPLY VOLTAGE MAX9779 toc31 18 16 SUPPLY CURRENT (mA) 14 12 10 8 6 4 2 0 4.50 4.75 5.00 5.25 HPS = VDD HPS = GND 0.35 0.30 SUPPLY CURRENT (A) 0.25 0.20 0.15 0.10 0.05 0 5.50 4.50 4.75 5.00 5.25 5.50 SUPPLY VOLTAGE (V) SUPPLY VOLTAGE (V) 8 _______________________________________________________________________________________ 2.6W Stereo Audio Power Amplifier and DirectDrive Headphone Amplifier Pin Description PIN 1 2 3, 19 4 5 6, 16 7 8 9 10 11 12 13 14 15 17 18 20 21 22 23 24 25 26, 28 27 EP NAME INL N.C. PGND OUTL+ OUTLPVDD CPVDD C1P CPGND C1N CPVSS VSS HPOUTR HPOUTL HPVDD OUTROUTR+ HPS BIAS SHDN GAIN2 GAIN1 VDD GND INR EP Left-Channel Audio Input No Connection. Not internally connected. Power Ground Left-Channel Positive Speaker Output Left-Channel Negative Speaker Output Speaker Amplifier Power Supply Charge-Pump Power Supply Charge-Pump Flying-Capacitor Positive Terminal Charge-Pump Ground Charge-Pump Flying-Capacitor Negative Terminal Charge-Pump Output. Connect to VSS. Headphone Amplifier Negative Power Supply Right-Channel Headphone Output Left-Channel Headphone Output Headphone Positive Power Supply Right-Channel Negative Speaker Output Right-Channel Positive Speaker Output Headphone Sense Input Common-Mode Bias Voltage. Bypass with a 1F capacitor to GND. Shutdown. Drive SHDN low to disable the device. Connect SHDN to VDD for normal operation. Gain Control Input 2 Gain Control Input 1 Power Supply Ground Right-Channel Audio Input Exposed Paddle. Connect EP to GND. FUNCTION MAX9779 _______________________________________________________________________________________ 9 2.6W Stereo Audio Power Amplifier and DirectDrive Headphone Amplifier MAX9779 VDD VOUT VDD / 2 GND IN_ BIAS BIAS OUT_+ CONVENTIONAL DRIVER-BIASING SCHEME +VDD OUT_BIAS GND HPOUT_ GND DirectDrive BIASING SCHEME -VDD Figure 1. MAX9779 Signal Path Figure 2. Traditional Headphone Amplifier Output Waveform vs. DirectDrive Headphone Amplifier Output Waveform Detailed Description The MAX9779 combines a 2.6W BTL speaker amplifier and a 110mW DirectDrive headphone amplifier with integrated headphone sensing and comprehensive click-and-pop suppression. The MAX9779 features fourlevel gain control. The device features high 90dB PSRR, low 0.01% THD+N, industry-leading click-pop performance, and a low-power shutdown mode. Each signal path consists of an input amplifier that sets the gain of the signal path and feeds both the speaker and headphone amplifier (Figure 1). The speaker amplifier uses a BTL architecture, doubling the voltage drive to the speakers and eliminating the need for DCblocking capacitors. The output consists of two signals, identical in magnitude, but 180 out of phase. The headphone amplifiers use Maxim's patented DirectDrive architecture that eliminates the bulky output DC-blocking capacitors required by traditional headphone amplifiers. A charge pump inverts the positive supply (CPVDD), creating a negative supply (CPVSS). The headphone amplifiers operate from these bipolar supplies with their outputs biased about GND (Figure 2). The amplifiers have almost twice the supply range compared to other single-supply amplifiers, nearly quadrupling the available output power. The benefit of the 10 GND bias is that the amplifier outputs no longer have a DC component (typically VDD / 2). This eliminates the large DC-blocking capacitors required with conventional headphone amplifiers, conserving board space and system cost, and improving frequency response. The device features an undervoltage lockout that prevents operation from an insufficient power supply and click-and-pop suppression that eliminates audible transients on startup and shutdown. The amplifiers include thermal-overload and short-circuit protection, and can withstand 8kV ESD strikes on the headphone amplifier outputs (IEC air discharge). An additional feature of the speaker amplifiers is that there is no phase inversion from input to output. DirectDrive Conventional single-supply headphone amplifiers have their outputs biased about a nominal DC voltage (typically half the supply) for maximum dynamic range. Large coupling capacitors are needed to block this DC bias from the headphones. Without these capacitors, a significant amount of DC current flows to the headphone, resulting in unnecessary power dissipation and possible damage to both headphone and headphone amplifier. Maxim's patented DirectDrive architecture uses a charge pump to create an internal negative supply voltage. This ______________________________________________________________________________________ 2.6W Stereo Audio Power Amplifier and DirectDrive Headphone Amplifier allows the MAX9779 headphone amplifier output to be biased about GND, almost doubling the dynamic range while operating from a single supply. With no DC component, there is no need for the large DC-blocking capacitors. Instead of two large capacitors (220F typ), the charge pump requires only two small ceramic capacitors (1F typ), conserving board space, reducing cost, and improving the frequency response of the headphone amplifier. See the Output Power vs. Charge-Pump Capacitance and Load Resistance graph in the Typical Operating Characteristics for details of the possible capacitor values. Previous attempts to eliminate the output-coupling capacitors involved biasing the headphone return (sleeve) to the DC bias voltage of the headphone amplifiers. This method raised some issues: 1) The sleeve is typically grounded to the chassis. Using this biasing approach, the sleeve must be isolated from system ground, complicating product design. 2) During an ESD strike, the amplifier's ESD structures are the only path to system ground. The amplifier must be able to withstand the full ESD strike. 3) When using the headphone jack as a lineout to other equipment, the bias voltage on the sleeve may conflict with the ground potential from other equipment, resulting in large ground-loop current and possible damage to the amplifiers. Low-Frequency Response In addition to the cost and size disadvantages, the DCblocking capacitors limit the low-frequency response of the amplifier and distort the audio signal: 1) The impedance of the headphone load to the DCblocking capacitor forms a highpass filter with the -3dB point determined by: f-3dB = 1 2RLCOUT MAX9779 LOW-FREQUENCY ROLLOFF (RL = 16) 0 -5 ATTENUATION (dB) -10 -15 -20 -25 -30 -35 10 100 FREQUENCY (Hz) 1000 DirectDrive 330F 220F 100F 33F Figure 3. Low-Frequency Attenuation of Common DC-Blocking Capacitor Values 16 headphone with a 100F blocking capacitor is 100Hz, well within the audio band. 2) The voltage coefficient of the capacitor, the change in capacitance due to a change in the voltage across the capacitor, distorts the audio signal. At frequencies around the -3dB point, the reactance of the capacitor dominates, and the voltage coefficient appears as frequency-dependent distortion. Figure 4 shows the THD+N introduced by two different capacitor dielectrics. Note that around the -3dB point, THD+N increases dramatically. The combination of low-frequency attenuation and frequency-dependent distortion compromises audio reproduction. DirectDrive improves low-frequency reproduction in portable audio equipment that emphasizes low-frequency effects such as multimedia laptops, and MP3, CD, and DVD players. Charge Pump The MAX9779 features a low-noise charge pump. The 550kHz switching frequency is well beyond the audio range, and does not interfere with the audio signals. The switch drivers feature a controlled switching speed that minimizes noise generated by turn-on and turn-off transients. Limiting the switching speed of the charge pump minimizes the di/dt noise caused by the parasitic bond wire and trace inductance. Although not typically required, additional high-frequency ripple attenuation can be achieved by increasing the size of C2 (see the Block Diagram). 11 where RL is the impedance of the headphone and COUT is the value of the DC-blocking capacitor. The highpass filter is required by conventional single-ended, single-supply headphone amplifiers to block the midrail DC component of the audio signal from the headphones. Depending on the -3dB point, the filter can attenuate low-frequency signals within the audio band. Larger values of COUT reduce the attenuation but are physically larger, more expensive capacitors. Figure 3 shows the relationship between the size of COUT and the resulting low-frequency attenuation. Note that the -3dB point for a ______________________________________________________________________________________ 2.6W Stereo Audio Power Amplifier and DirectDrive Headphone Amplifier MAX9779 ADDITIONAL THD+N DUE TO DC-BLOCKING CAPACITORS 10 MAX9779 10A VDD 1 SHUTDOWN CONTROL HPS TANTALUM HPOUTL HPOUTR 1k ALUM/ELEC 1k 20 14 13 THD+N (%) 0.1 0.01 0.001 0.0001 10 100 1k FREQUENCY (Hz) 10k 100k Figure 4. Distortion Contributed by DC-Blocking Capacitors Figure 5. HPS Configuration Headphone Sense Input (HPS) The headphone sense input (HPS) monitors the headphone jack and automatically configures the device based upon the voltage applied at HPS. A voltage of less than 0.8V sets the device to speaker mode. A voltage of greater than 2V disables the bridge amplifiers and enables the headphone amplifiers. For automatic headphone detection, connect HPS to the control pin of a 3-wire headphone jack as shown in Figure 5. With no headphone present, the output impedance of the headphone amplifier pulls HPS low. When a headphone plug is inserted into the jack, the control pin is disconnected from the tip contact and HPS is pulled to VDD through a 10A current source. Gain Selection The MAX9779 features an internally set, selectable gain. The GAIN1 and GAIN2 inputs set the maximum gain of the MAX9779 speaker and headphone amplifiers (Table 1). Shutdown The MAX9779 features a 0.2A, low-power shutdown mode that reduces quiescent current consumption and extends battery life. Driving SHDN low disables the drive amplifiers, bias circuitry, and charge pump, and drives BIAS and all outputs to GND. Connect SHDN to VDD for normal operation. Click-and-Pop Suppression Speaker Amplifier The MAX9779 speaker amplifiers feature Maxim's comprehensive, industry-leading click-and-pop suppression. During startup, the click-pop suppression circuitry eliminates any audible transient sources internal to the device. When entering shutdown, both amplifier outputs ramp to GND quickly and simultaneously. BIAS The MAX9779 features an internally generated, powersupply independent, common-mode bias voltage of 1.8V referenced to GND. BIAS provides both click-andpop suppression and sets the DC bias level for the amplifiers. Choose the value of the bypass capacitor as described in the BIAS Capacitor section. No external load should be applied to BIAS. Any load lowers the BIAS voltage, affecting the overall performance of the device. 12 ______________________________________________________________________________________ 2.6W Stereo Audio Power Amplifier and DirectDrive Headphone Amplifier MAX9779 Table 1. MAX9779 Maximum Gain Settings GAIN2 0 0 1 1 GAIN1 0 1 0 1 SPEAKER-MODE GAIN (dB) 15 16.5 18 19.5 HEADPHONE-MODE GAIN (dB) 0 0 3 3 Headphone Amplifier In conventional single-supply headphone amplifiers, the output-coupling capacitor is a major contributor of audible clicks and pops. Upon startup, the amplifier charges the coupling capacitor to its bias voltage, typically half the supply. Likewise, during shutdown, the capacitor is discharged to GND. A DC shift across the capacitor results, which in turn appears as an audible transient at the speaker. Since the MAX9779 does not require outputcoupling capacitors, no audible transient occurs. Additionally, the MAX9779 features extensive click-andpop suppression that eliminates any audible transient sources internal to the device. The Power-Up/Down Waveform in the Typical Operating Characteristics shows that there are minimal spectral components in the audible range at the output upon startup and shutdown. +1 VOUT(P-P) 2 x VOUT(P-P) -1 VOUT(P-P) Applications Information BTL Speaker Amplifiers The MAX9779 features speaker amplifiers designed to drive a load differentially, a configuration referred to as bridge-tied load (BTL). The BTL configuration (Figure 6) offers advantages over the single-ended configuration, where one side of the load is connected to ground. Driving the load differentially doubles the output voltage compared to a single-ended amplifier under similar conditions. Thus, the device's differential gain is twice the closed-loop gain of the input amplifier. The effective gain is given by: A VD = 2 x RF RIN Figure 6. Bridge-Tied Load Configuration Since the differential outputs are biased at midsupply, there is no net DC voltage across the load. This eliminates the need for DC-blocking capacitors required for single-ended amplifiers. These capacitors can be large and expensive, can consume board space, and can degrade low-frequency performance. Power Dissipation and Heatsinking Under normal operating conditions, the MAX9779 can dissipate a significant amount of power. The maximum power dissipation for the TQFN package is given in the Absolute Maximum Ratings under Continuous Power Dissipation, or can be calculated by the following equation: PDISSPKG(MAX) = TJ(MAX) - TA JA Substituting 2 x VOUT(P-P) into the following equation yields four times the output power due to double the output voltage: VRMS = VOUT(P-P) 22 2 V POUT = RMS RL where TJ(MAX) is +150C, TA is the ambient temperature, and JA is the reciprocal of the derating factor in C/W as specified in the Absolute Maximum Ratings section. For example, JA of the thin QFN package is +42C/W. For optimum power dissipation, the exposed paddle of the package should be connected to the ground plane (see the Layout and Grounding section). ______________________________________________________________________________________ 13 2.6W Stereo Audio Power Amplifier and DirectDrive Headphone Amplifier MAX9779 Output Power (Headphone Amplifier) 1000 100 10 THD+N (%) OUTPUTS IN PHASE 1 0.1 0.01 0.001 0 25 50 75 100 125 150 OUTPUT POWER (mW) VDD = 5V RL = 16 AV = 3dB The headphone amplifiers have been specified for the worst-case scenario--when both inputs are in phase. Under this condition, the drivers simultaneously draw current from the charge pump, leading to a slight loss in headroom of VSS. In typical stereo audio applications, the left and right signals have differences in both magnitude and phase, subsequently leading to an increase in the maximum attainable output power. Figure 7 shows the two extreme cases for in and out of phase. In reality, the available power lies between these extremes. OUTPUTS 180 OUT OF PHASE Power Supplies The MAX9779 has different supplies for each portion of the device, allowing for the optimum combination of headroom, power dissipation, and noise immunity. The speaker amplifiers are powered from PV DD . PV DD ranges from 4.5V to 5.5V. The headphone amplifiers are powered from HPVDD and VSS. HPVDD is the positive supply of the headphone amplifiers and ranges from 3V to 5.5V. VSS is the negative supply of the headphone amplifiers. Connect VSS to CPVSS. The charge pump is powered by CPVDD. CPVDD ranges from 3V to 5.5V and should be the same potential as HPVDD. The charge pump inverts the voltage at CPVDD, and the resulting voltage appears at CPVSS. The remainder of the device is powered by VDD. Figure 7. Total Harmonic Distortion Plus Noise vs. Output Power with Inputs In/Out of Phase (Headphone Mode) For 8 applications, the worst-case power dissipation occurs when the output power is 1.1W/channel, resulting in a power dissipation of approximately 1W. In this case, the TQFN package can be used without violating the maximum power dissipation or exceeding the thermal protection threshold. For 4 applications, the TQFN package may require heatsinking or forced air cooling to prevent the device from reaching its thermal limit. The more thermally efficient TQFN package is suggested for speaker loads less than 8. Component Selection Input Filtering The input capacitor (CIN), in conjunction with the amplifier input resistance (RIN), forms a highpass filter that removes the DC bias from an incoming signal (see the Block Diagram). The AC-coupling capacitor allows the amplifier to bias the signal to an optimum DC level. Assuming zero source impedance, the -3dB point of the highpass filter is given by: f-3dB = 1 2RINCIN Output Power (Speaker Amplifier) The increase in power delivered by the BTL configuration directly results in an increase in internal power dissipation over the single-ended configuration. The maximum power dissipation for a given VDD and load is given by the following equation: PDISS(MAX) = 2VDD2 2RL If the power dissipation for a given application exceeds the maximum allowed for a given package, either reduce VDD, increase load impedance, decrease the ambient temperature, or add heatsinking to the device. Large output, supply, and ground PC board traces improve the maximum power dissipation in the package. Thermal-overload protection limits total power dissipation in these devices. When the junction temperature exceeds +160C, the thermal-protection circuitry disables the amplifier output stage. The amplifiers are enabled once the junction temperature cools by 15C. This results in a pulsing output under continuous thermal-overload conditions as the device heats and cools. 14 RIN is the amplifier's internal input resistance value given in the Electrical Characteristics. Choose CIN such that f-3dB is well below the lowest frequency of interest. Setting f-3dB too high affects the amplifier's low-frequency response. Use capacitors with low-voltage coefficient dielectrics, such as tantalum or aluminum electrolytic. Capacitors with high-voltage coefficients, such as ceramics, may result in increased distortion at low frequencies. ______________________________________________________________________________________ 2.6W Stereo Audio Power Amplifier and DirectDrive Headphone Amplifier MAX9779 Table 2. Suggested Capacitor Manufacturers SUPPLIER Taiyo Yuden TDK PHONE 800-348-2496 807-803-6100 FAX 847-925-0899 847-390-4405 www.t-yuden.com www.component.tdk.com WEBSITE BIAS Capacitor BIAS is the output of the internally generated DC bias voltage. The BIAS bypass capacitor, CBIAS, improves PSRR and THD+N by reducing power supply and other noise sources at the common-mode bias node, and also generates the clickless/popless, startup/shutdown DC bias waveforms for the speaker amplifiers. Bypass BIAS with a 1F capacitor to GND. Charge-Pump Capacitor Selection Use capacitors with an ESR less than 100m for optimum performance. Low-ESR ceramic capacitors minimize the output resistance of the charge pump. For best performance over the extended temperature range, select capacitors with an X7R dielectric. Table 4 lists suggested manufacturers. Flying Capacitor (C1) The value of the flying capacitor (C1) affects the load regulation and output resistance of the charge pump. A C1 value that is too small degrades the device's ability to provide sufficient current drive, which leads to a loss of output voltage. Increasing the value of C1 improves load regulation and reduces the charge-pump output resistance to an extent. See the Output Power vs. Charge-Pump Capacitance and Load Resistance graph in the Typical Operating Characteristics. Above 2.2F, the on-resistance of the switches and the ESR of C1 and C2 dominate. Output Capacitor (C2) The output capacitor value and ESR directly affect the ripple at CPVSS. Increasing the value of C2 reduces output ripple. Likewise, decreasing the ESR of C2 reduces both ripple and output resistance. Lower capacitance values can be used in systems with low maximum output power levels. See the Output Power vs. Charge-Pump Capacitance and Load Resistance graph in the Typical Operating Characteristics. CPVDD Bypass Capacitor The CPVDD bypass capacitor (C3) lowers the output impedance of the power supply and reduces the impact of the MAX9779's charge-pump switching transients. Bypass CPVDD with C3, the same value as C1, and place it physically close to CPVDD and PGND (refer to the MAX9779 Evaluation Kit for a suggested layout). Powering Other Circuits from a Negative Supply An additional benefit of the MAX9779 is the internally generated negative supply voltage (CPVSS). CPVSS is used by the MAX9779 to provide the negative supply for the headphone amplifiers. It can also be used to power other devices within a design. Current draw from CPVSS should be limited to 5mA; exceeding this affects the operation of the headphone amplifier. A typical application is a negative supply to adjust the contrast of LCD modules. When considering the use of CPVSS in this manner, note that the charge-pump voltage of CPVSS is roughly proportional to CPVDD and is not a regulated voltage. The charge-pump output impedance plot appears in the Typical Operating Characteristics. Layout and Grounding Proper layout and grounding are essential for optimum performance. Use large traces for the power-supply inputs and amplifier outputs to minimize losses due to parasitic trace resistance, as well as route head away from the device. Good grounding improves audio performance, minimizes crosstalk between channels, and prevents any switching noise from coupling into the audio signal. Connect CPGND, PGND, and GND together at a single point on the PC board. Route CPGND and all traces that carry switching transients away from GND, PGND, and the traces and components in the audio signal path. Connect all components associated with the charge pump (C2 and C3) to the CPGND plane. Connect VSS and CPVSS together at the device. Place the chargepump capacitors (C1, C2, and C3) as close to the device as possible. Bypass HPVDD and PVDD with a 0.1F capacitor to GND. Place the bypass capacitors as close to the device as possible. Use large, low-resistance output traces. As load impedance decreases, the current drawn from the device outputs increase. At higher current, the resistance of the output traces decrease the power delivered to the load. ______________________________________________________________________________________ 15 2.6W Stereo Audio Power Amplifier and DirectDrive Headphone Amplifier MAX9779 For example, when compared to a 0 trace, a 100m trace reduces the power delivered to a 4 load from 2.1W to 2W. Large output, supply, and GND traces also improve the power dissipation of the device. The MAX9779 thin QFN package features an exposed thermal pad on its underside. This pad lowers the package's thermal resistance by providing a direct heat-conduction path from the die to the PC board. Connect the exposed thermal pad to GND by using a large pad and multiple vias to the GND plane. Block Diagram 4.5V TO 5.5V 0.1F VDD 25 6, 16 PVDD MAX9779 CIN 1F LEFT-CHANNEL AUDIO INPUT 4 OUTL+ INL 1 GAIN/ CONTROL BTL AMPLIFIER 5 OUTL4.5V TO 5.5V 0.1F CIN 1F RIGHT-CHANNEL AUDIO INPUT 18 OUTR+ INR 27 GAIN/ CONTROL BTL AMPLIFIER 17 OUTR- BIAS 21 CBIAS 1F GND 28 VDD GAIN1 VDD GAIN2 24 23 HEADPHONE DETECTION GAIN 15 HPVDD 20 HPS 14 HPOUTL 3V TO 5.5V 10F N.C. 2 VDD SHDN 3V TO 5.5V 1F C1 1F C1N 10 CPGND 9 11 CPVSS 12 VSS C2 1F 26 GND 3, 19 PGND 22 SHUTDOWN CONTROL 13 HPOUTR CPVDD 7 C1P 8 CHARGE PUMP 16 ______________________________________________________________________________________ 2.6W Stereo Audio Power Amplifier and DirectDrive Headphone Amplifier Pin Configuration PROCESS: BiCMOS OUTR+ OUTRPGND PVDD BIAS HPS MAX9779 Chip Information TOP VIEW 21 SHDN GAIN2 GAIN1 VDD GND INR GND 20 19 18 17 16 15 14 13 12 HPOUTL HPOUTR VSS CPVSS C1N CPGND C1P 22 23 24 25 26 27 28 1 INL MAX9779 HPVDD 11 10 9 8 2 N.C. 3 PGND 4 OUTL+ 5 OUTL- 6 PVDD 7 CPVDD THIN QFN ______________________________________________________________________________________ 17 2.6W Stereo Audio Power Amplifier and DirectDrive Headphone Amplifier MAX9779 Package Information (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.) D2 D D/2 MARKING k L E/2 E2/2 E (NE-1) X e C L C L b D2/2 0.10 M C A B XXXXX E2 PIN # 1 I.D. DETAIL A e (ND-1) X e e/2 PIN # 1 I.D. 0.35x45 DETAIL B e L1 L C L C L L L e 0.10 C A 0.08 C e C A1 A3 PACKAGE OUTLINE, 16, 20, 28, 32, 40L THIN QFN, 5x5x0.8mm -DRAWING NOT TO SCALE- 21-0140 H 1 2 18 ______________________________________________________________________________________ QFN THIN.EPS 2.6W Stereo Audio Power Amplifier and DirectDrive Headphone Amplifier Package Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.) MAX9779 COMMON DIMENSIONS PKG. 16L 5x5 20L 5x5 28L 5x5 32L 5x5 40L 5x5 SYMBOL MIN. NOM. MAX. MIN. NOM. MAX. MIN. NOM. MAX. MIN. NOM. MAX. MIN. NOM. MAX. EXPOSED PAD VARIATIONS PKG. CODES T1655-1 T1655-2 T1655N-1 T2055-2 T2055-3 T2055-4 T2055-5 T2855-1 T2855-2 T2855-3 T2855-4 T2855-5 T2855-6 T2855-7 T2855-8 T2855N-1 T3255-2 T3255-3 T3255-4 T3255N-1 T4055-1 D2 MIN. NOM. MAX. MIN. E2 NOM. MAX. L 0.15 A A1 A3 b D E e k L L1 N ND NE JEDEC NOTES: DOWN BONDS ALLOWED 0.70 0.75 0.80 0.70 0.75 0.80 0.70 0.75 0.80 0.70 0.75 0.80 0.70 0.75 0.80 0 0.02 0.05 0.20 REF. 0 0.02 0.05 0.20 REF. 0 0.02 0.05 0.20 REF. 0 0.02 0.05 0 0.02 0.05 0.20 REF. 0.15 0.20 0.25 4.90 5.00 5.10 4.90 5.00 5.10 0.40 BSC. 0.25 0.35 0.45 0.20 REF. 0.25 0.30 0.35 0.25 0.30 0.35 0.20 0.25 0.30 0.20 0.25 0.30 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 4.90 5.00 5.10 0.80 BSC. 0.65 BSC. 0.50 BSC. 0.50 BSC. 0.25 - 0.25 - 0.25 - 0.25 3.00 3.00 3.00 3.00 3.00 3.00 3.15 3.15 2.60 3.15 2.60 2.60 3.15 2.60 3.15 3.15 3.00 3.00 3.00 3.00 3.20 3.10 3.20 3.00 3.10 3.20 3.00 3.10 3.20 3.00 3.10 3.20 3.00 3.10 3.20 3.00 3.10 3.20 3.00 3.25 3.25 2.70 3.25 2.70 2.70 3.25 2.70 3.25 3.25 3.10 3.10 3.10 3.10 3.35 3.35 2.80 3.35 2.80 2.80 3.35 2.80 3.35 3.35 3.20 3.20 3.20 3.20 3.15 3.15 2.60 3.15 2.60 2.60 3.15 2.60 3.15 3.15 3.00 3.00 3.00 3.00 3.10 3.10 3.10 3.10 3.10 3.10 3.25 3.25 2.70 3.25 2.70 2.70 3.25 2.70 3.25 3.25 3.10 3.10 3.10 3.10 3.30 3.20 3.20 3.20 3.20 3.20 3.20 3.35 3.35 2.80 3.35 2.80 2.80 3.35 2.80 3.35 3.35 3.20 3.20 3.20 3.20 3.40 ** ** ** ** ** ** 0.40 ** ** ** ** ** ** ** 0.40 ** ** ** ** ** ** NO YES NO NO YES NO YES NO NO YES YES NO NO YES YES NO NO YES NO NO YES 0.30 0.40 0.50 0.45 0.55 0.65 0.45 0.55 0.65 0.30 0.40 0.50 0.40 0.50 0.60 - 0.30 0.40 0.50 16 20 28 32 40 4 5 7 8 10 4 5 7 8 10 WHHB WHHC WHHD-1 WHHD-2 ----- 1. DIMENSIONING & TOLERANCING CONFORM TO ASME Y14.5M-1994. 2. ALL DIMENSIONS ARE IN MILLIMETERS. ANGLES ARE IN DEGREES. 3. N IS THE TOTAL NUMBER OF TERMINALS. 4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JESD 95-1 SPP-012. DETAILS OF TERMINAL #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE TERMINAL #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE. 5. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.25 mm AND 0.30 mm FROM TERMINAL TIP. 6. ND AND NE REFER TO THE NUMBER OF TERMINALS ON EACH D AND E SIDE RESPECTIVELY. 7. DEPOPULATION IS POSSIBLE IN A SYMMETRICAL FASHION. 8. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS. 9. DRAWING CONFORMS TO JEDEC MO220, EXCEPT EXPOSED PAD DIMENSION FOR T2855-1, T2855-3, AND T2855-6. 10. WARPAGE SHALL NOT EXCEED 0.10 mm. 11. MARKING IS FOR PACKAGE ORIENTATION REFERENCE ONLY. 12. NUMBER OF LEADS SHOWN ARE FOR REFERENCE ONLY. 13. LEAD CENTERLINES TO BE AT TRUE POSITION AS DEFINED BY BASIC DIMENSION "e", 0.05. 3.30 3.40 3.20 ** SEE COMMON DIMENSIONS TABLE PACKAGE OUTLINE, 16, 20, 28, 32, 40L THIN QFN, 5x5x0.8mm -DRAWING NOT TO SCALE- 21-0140 H 2 2 Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time. Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 19 (c) 2005 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products, Inc. Heaney |
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