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Nichia STS-DA1-0151
SPECIFICATIONS FOR NICHIA CHIP TYPE BLUE LED
MODEL : NJSB036LT
NICHIA CORPORATION
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Nichia STS-DA1-0151
1.SPECIFICATIONS
(1) Absolute Maximum Ratings Item Forward Current Pulse Forward Current Allowable Reverse Current Power Dissipation Operating Temperature Storage Temperature Dice Temperature Soldering Temperature Symbol IF IFP IR PD Topr Tstg Tj Tsld Absolute Maximum Rating 450 900 85 1.8 -40 ~ +100 -40 ~ +100 150 Reflow Soldering : 260C Hand Soldering : 350C (Ts=25C) Unit mA mA mA W C C C for 10sec. for 3sec.
IFP Conditions : Pulse Width 10msec. and Duty 1/10
(2) Initial Electrical/Optical Characteristics Item Symbol Forward Voltage VF Luminous Flux v x Chromaticity Coordinate y Please refer to CIE 1931 chromaticity diagram.
Condition IF=350[mA] IF=350[mA] IF=350[mA] IF=350[mA]
Typ. (3.6) (14.5) 0.133 0.075
(Ts=25C) Max. Unit 4.0 V lm -
(3) Ranking Item Rank P8 Rank P7 Rank P6 Rank P5 Rank P4 Symbol Condition Min. 18.0 15.1 12.7 10.7 9.0
Luminous Flux
v
IF=350[mA]
(Ts=25C) Max. Unit 21.4 18.0 lm 15.1 12.7 10.7
Luminous Intensity Measurement allowance is 7%.
Color Rank x y 0.139 0.035 0.129 0.050
(IF=350mA,Ts=25C) Rank W 0.113 0.134 0.080 0.105 0.145 0.072 0.152 0.056
Color Coordinates Measurement allowance is 0.01. Basically, a shipment shall consist of the LEDs of a combination of the above ranks. The percentage of each rank in the shipment shall be determined by Nichia.
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Nichia STS-DA1-0151 (4) Correspondence table of Luminous Flux - Luminous Intensity (Reference) V (lm) IV (cd) 21.4 (35.2) 18.0 (29.6) 15.1 (24.7) 12.7 (20.8) 10.7 (17.5) 9.0 (14.6)
2.INITIAL OPTICAL/ELECTRICAL CHARACTERISTICS
Please refer to "CHARACTERISTICS" on the following pages.
3.OUTLINE DIMENSIONS AND MATERIALS
Please refer to "OUTLINE DIMENSIONS" on the following page. : Ceramics Material as follows ; Package : Silicone Resin (with Diffused) Encapsulating Resin : Au Plating Electrodes : Silicone Resin (with Diffused) Lens
4.PACKAGING
* The LEDs are packed in cardboard boxes after taping. Please refer to "TAPING DIMENSIONS" and "PACKING "on the following pages. The label on the minimum packing unit shows ; Part Number, Lot Number, Ranking, Quantity * In order to protect the LEDs from mechanical shock, we pack them in cardboard boxes for transportation. * The LEDs may be damaged if the boxes are dropped or receive a strong impact against them, so precautions must be taken to prevent any damage. * The boxes are not water resistant and therefore must be kept away from water and moisture. * When the LEDs are transported, we recommend that you use the same packing method as Nichia.
5.LOT NUMBER
The first six digits number shows lot number. The lot number is composed of the following characters; - Year ( 7 for 2007 8 for 2008 ) - Month ( 1 for Jan., 9 for Sep., A for Oct., - Nichia's Product Number - Ranking by Color Coordinates - Ranking by Luminous Flux
B for Nov. )
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Nichia STS-DA1-0151
6.RELIABILITY
(1) TEST ITEMS AND RESULTS
Test Item Resistance to Soldering Heat (Reflow Soldering) Solderability (Reflow Soldering) Thermal Shock Standard Test Method JEITA ED-4701 300 301 JEITA ED-4701 300 303 JEITA ED-4701 300 307 JEITA ED-4701 100 105 JEITA ED-4701 200 203 JEITA ED-4701 200 201 JEITA ED-4701 100 103 JEITA ED-4701 200 202 Test Conditions Tsld=260C, 10sec. (Pre treatment 30C,70%,168hrs.) Tsld=215 5C, 3sec. (Lead Solder) -40C ~ 100C 1min. (10sec.) 1min. (Pre treatment 30C,70%,168hrs.) -40C ~ 25C ~ 100C ~ 25C 30min. 5min. 30min. 5min. 25C ~ 65C ~ -10C 90%RH 24hrs./1cycle Ta=100C Ta=60C, RH=90% Ta=-40C Ta=25C, IF=450mA
Tested with Nichia standard circuit board.
Note 2 times
Number of Damaged 0/22
1 time over 95% 100 cycles
0/22 0/50
Temperature Cycle Moisture Resistance Cyclic High Temperature Storage Temperature Humidity Storage Low Temperature Storage Steady State Operating Life Steady State Operating Life of High Temperature Steady State Operating Life of High Humidity Heat Steady State Operating Life of Low Temperature Permanence of Marking
100 cycles 10 cycles 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 1000 hrs. 500 hrs. 1000 hrs. 1 time
0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/50 0/22
Ta=100C, IF=180mA
Tested with Nichia standard circuit board.
60C, RH=90%, IF=250mA
Tested with Nichia standard circuit board.
Ta=-40C, IF=350mA
Tested with Nichia standard circuit board.
JEITA ED-4701 500 501 JEITA ED-4701 400 403 JEITA ED-4701 300 304
Vibration
Electrostatic Discharges
Solvent : Isopropyl Alcohol Solvent Temperature : 20 ~ 25C Dipping Time : 5 min. 100 ~ 2000 ~ 100Hz Sweep 4min. 200m/s2 3directions, 4cycles R=1.5k, C=100pF Test Voltage=2kV
48min.
0/10
3 times
Negative/Positive
0/22
Thermal resistance of LED with Nichia standard circuit board : Rja 70C/W Nichia standard circuit board : FR4, t=1.6mm, Copper foil, t=0.07mm (2) CRITERIA FOR JUDGING DAMAGE Criteria for Judgement Item Symbol Test Conditions Min. Max. Forward Voltage VF IF=350mA Initial Level Luminous Flux Iv IF=350mA Initial Level 0.7 The test is performed after the board is cooled down to the room temperature.
1.1
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Nichia STS-DA1-0151
7.CAUTIONS
(1) Moisture Proof Package * When moisture is absorbed into the SMT package it may vaporize and expand during soldering. There is a possibility that this can cause exfoliation of the contacts and damage the optical characteristics of the LEDs. For this reason, the moisture proof package is used to keep moisture to a minimum in the package. * The moisture proof package is made of an aluminum moisture proof bag. A package of a moisture absorbent material (silica gel) is inserted into the aluminium moisture proof bag. The silica gel changes its color from blue to pink as it absorbs moisture. (2) Storage * Storage Conditions Before opening the package : The LEDs should be kept at 30C or less and 90%RH or less. The LEDs should be used within a year. When storing the LEDs, moisture proof packaging with absorbent material (silica gel) is recommended. After opening the package : The LEDs should be kept at 30C or less and 70%RH or less. The LEDs should be soldered within 168 hours (7days) after opening the package. If unused LEDs remain, they should be stored in the moisture proof packages, such as sealed containers with packages of moisture absorbent material (silica gel). It is also recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again. * If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following condition. Baking treatment : more than 24 hours at 65 5C * Nichia LED electrodes are gold plated. The gold surface may be affected by environments which contain corrosive substances. Please avoid conditions which may cause the LED to corrode, tarnish or discolor. This corrosion or discoloration may cause difficulty during soldering operations. It is recommended that the User use the LEDs as soon as possible. * Please avoid rapid transitions in ambient temperature, especially in high humidity environments where condensation can occur.
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Nichia STS-DA1-0151 (3) Static Electricity * Static electricity or surge voltage damages the LEDs. It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. * All devices, equipment and machinery must be properly grounded. It is recommended that precautions be taken against surge voltage to the equipment that mounts the LEDs. * When inspecting the final products in which LEDs were assembled, it is recommended to check whether the assembled LEDs are damaged by static electricity or not. It is easy to find static-damaged LEDs by a light-on test or a VF test at a lower current (below 1mA is recommended). * Damaged LEDs will show some unusual characteristics such as the forward voltage becomes lower, or the LEDs do not light at the low current. Criteria : (VF > 2.0V at IF=0.5mA) (4) Application Design Considerations * Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. * Please determine the operating current with consideration of the ambient temperature local to the LED and refer to the plot of Ambient temperature vs. Allowable Forward Current on CHARACTERISTICS in this specifications. Please also take measures to remove heat from the area near the LED to improve the operational characteristics of the LED. * The equation 1 indicates correlation between Tj and Ta, and the equation 2 indicates correlation between Tj and Ts. Tj=Ta + Rja W 1 Tj=Ts1 + Rjs1 W 2 Tj = Dice Temperature : C, Ta = Ambient Temperature : C, Ts1 = Solder Temperature (Cathode Side) : C, Ts1 Point Rja = Heat resistance from Dice to Ambient temperature : C /W, Rjs1 = Heat resistance from Dice to Ts1 measuring point 45C /W, W = Inputting Power (IF VF) : W Anode Cathode
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Nichia STS-DA1-0151 * Warpage of circuit board with soldered LEDs may result in damage or package breakage of the LEDs. Please pay special attention to the orientation of the LEDs as to avoid LED failure caused by bow, twist and warpage of the board. Non-preferable Preferable
Cathode mark
Cathode mark
When mechanical stress from the board affects the soldered LED, place the LED in the preferable location and orientation as shown above. * Depending on the position and direction of LED, the mechanical stress on the LED package can be changed. Refer to the following figure.
Perforated line

Slit Stress : A > B = C > D > E * When separating the circuit boards with soldered LEDs, please use appropriate tools and equipment. Hand brake without these tools and equipment may not be used. * The use of aluminum substrate increases stress to solder joints due to thermal expansion of substrate and subsequently may result in solder joint crack. Users may need to evaluate their specific application to determine any impact due to the use of aluminum substrate.
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Nichia STS-DA1-0151 (5) Handling Precautions * Bare Hand When handling the product, touching encapsulant with bare hands will contaminate its surface that could affects on optical characteristics. In the worst cases, excessive force to the encapsulant by hands might result in catastrophic failure of the LEDs due to wire deformation and/or breakage.
* Tweezers When handling it with tweezers, the product should only be held by the ceramics body, not by the encapsulant. Failure to comply might result in chip-out and/or delamination of encapsulant, and in the worst cases, catastrophic failure of the LEDs due to wire deformation and/or breakage.
* Pick and Place The use of appropriate nozzle for this product is recommended. (For the recommended nozzle size, refer to the figure at right.) Avoid direct contact to the resin lens with the picking up nozzle. Failure to comply might result in catastrophic failure of the LEDs due to wire deformation and/or breakage.
0.4
3
1.9
(Unit : mm)
3.8
* Printed Circuit Board Assembled (PCB with LEDs soldered) Do not stack assembled PCBs together. Since silicone is a soft material, abrasion between two PCB assembled with silicone encapsulated LED might cause catastrophic failure of the LEDs due to damage to encapsulant (such as scratch, chip-out and delamination) and wire (such as deformation and breakage) and LED detachment.
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Nichia STS-DA1-0151 (6) Soldering Conditions * The LEDs can be soldered in place using the reflow soldering method. Nichia cannot make a guarantee on the LEDs after they have been assembled using the dip soldering method. * Recommended soldering conditions
Reflow Soldering Lead Solder Pre-heat Pre-heat time Peak temperature Soldering time Condition 10 sec. Max. refer to Temperature - profile 1. 10 sec. Max. refer to Temperature - profile 2. (N2 reflow is recommended.) 120 ~ 150C 120 sec. Max. 240C Max. Lead-free Solder 180 ~ 200C 120 sec. Max. 260C Max. Temperature Soldering time 350C Max. 3 sec. Max. (one time only) Hand Soldering
Although the recommended soldering conditions are specified in the above table, reflow or hand soldering at the lowest possible temperature is desirable for the LEDs. A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature. Use the conditions shown to the under figure. [Temperature-profile (Surface of circuit board)]
<1 : Lead Solder>
2.5 ~ 5C / sec. Pre-heating 120 ~ 150C 60sec.Max.
Above 200C
<2 : Lead-free Solder>
240C Max. 10sec. Max. 1 ~ 5C / sec. 1 ~ 5C / sec. Pre-heating 180 ~ 200C 60sec.Max.
Above 220C
260C Max. 10sec. Max.
2.5 ~ 5C / sec.
120sec.Max.
120sec.Max.
[Recommended soldering pad design]
4.1 0.6
Use the following conditions shown in the figure.
3.5
(Unit : mm)
* Occasionally there is a brightness decrease caused by the influence of heat or ambient atmosphere during air reflow. It is recommended that the User use the nitrogen reflow method. * Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. * Reflow soldering should not be done more than two times. * When soldering, do not put stress on the LEDs during heating.
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Nichia STS-DA1-0151 (7) Cleaning * It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not. Freon solvents should not be used to clean the LEDs because of worldwide regulations. * Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur. (8) Others * NJSB036L complies with RoHS Directive. * The LED light output is strong enough to injure human eyes. Precautions must be taken to prevent looking directly at the LEDs with unaided eyes for more than a few seconds. * Flashing lights have been known to cause discomfort in people; you can prevent this by taking precautions during use. Also, people should be cautious when using equipment that has had LEDs incorporated into it. * The LEDs described in this brochure are intended to be used for ordinary electronic equipment (such as office equipment, communications equipment, measurement instruments and household appliances). Consult Nichia's sales staff in advance for information on the applications in which exceptional quality and reliability are required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as for airplanes, aerospace, submersible repeaters, nuclear reactor control systems, automobiles, traffic control equipment, life support systems and safety devices). * User shall not reverse engineer by disassembling or analysis of the LEDs without having prior written consent from Nichia. When defective LEDs are found, the User shall inform Nichia directly before disassembling or analysis. * The formal specifications must be exchanged and signed by both parties before large volume purchase begins. * The appearance and specifications of the product may be modified for improvement without notice.
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Nichia STS-DA1-0151
ICI Chromaticity Diagram
0.9
520
0.8
530 510 540 550 560
0.7
0.6
570 500
0.5
580 590
y
0.4
600 610 620 630
0.3
490
0.2
480
0.1
W
470 460
0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8
x
Color Coordinates Measurement allowance is 0.01.
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Forward Voltage vs. Forward Current
Forward Current IFP (mA) Ta=25C Relative Luminous Flux (a.u.) 1000 900 350 100 50
Forward Current vs. Relative Luminous Flux
2.5 2.0 1.5 1.0 0.5 0 0 200 400 600 800 1000 Forward Current IFP (mA) Ta=25C Allowable Forward Current IFP (mA)
Duty Ratio vs. Allowable Forward Current
1000 900 Ta=25C
450 300 200 1 _ Pulse Width < 10msec. 5 10 20 50 100 Duty Ratio (%)
10 2.5
3.0 3.5 4.0 4.5 5.0 Forward Voltage VF (V)
Ambient Temperature vs. Forward Voltage
IFP=350mA Relative Luminous Flux (a.u.) 5.0 Forward Voltage VF (V)
Ambient Temperature vs. Relative Luminous Flux
Allowable Forward Current IF (mA) 2.0 IFP=350mA 1.0
Ambient Temperature vs. Allowable Forward Current
600 500 450 400 300 187 100 0 0 20 40 60 80 100 120 Ambient Temperature Ta (C)
Thermal resistance Rja=70C/W
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4.5 4.0 3.5 3.0
0.5
2.5 -60 -30 0 30 60 90 120 Ambient Temperature Ta (C)
0.2 -60 -30 0 30 60 90 120 Ambient Temperature Ta (C)
Nichia STS-DA1-0151
Model
NJSB036L
NICHIA CORPORATION
Title No.
CHARACTERISTICS
080311811691
Forward Current vs. Chromaticity Coordinate (D)
Relative Emission Intensity (a.u.)
Spectrum
1.2 1.0 0.8 0.6 0.4 0.2 0 350 450 550 Wavelength (nm) 650 Ta=25C IFP=350mA
0.11 0.10 0.09 Ta=25C
20mA(473.9nm) 100mA(472.2nm) 350mA(470.7nm) 450mA(470.4nm) 900mA(469.6nm)
y
0.08 0.07
0.06 0.11 0.12 0.13 0.14 0.15 0.16
x Forward Current vs. Dominant Wavelength
Ambient Temperature vs. Dominant Wavelength
Dominant Wavelength D (nm)
Directivity
1.0
Relative Illuminance (a.u.)
Dominant Wavelength D (nm)
476 474 472 470 468 466 10 100 1000 Forward Current IFP (mA) Ta=25C
476 474 472 470 468 466 -60 -30 0 30 60 90 120 Ambient Temperature Ta (C) IFP=350mA
0 Ta=25C IFP=350mA
10 20
30
40 50 60 70 80
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0.5
0 90
60 30 Radiation Angle
0
0.5
90 1.0
Nichia STS-DA1-0151
Model
NJSB036L
NICHIA CORPORATION
Title No.
CHARACTERISTICS
080311811701
3.5 2.8
0.8 0.2
3.2 0.8
3.5
3.2
Cathode mark
Anode
Cathode
A 2.6
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Protection device
ITEM PACKAGE ENCAPSULATING RESIN ELECTRODES LENS
MATERIALS Ceramics Silicone Resin (with Diffused ) Au Plating Silicone Resin (with Diffused) Nichia STS-DA1-0151
NJSB036L has a protection device built in as a protection circuit against static electricity.
1 K
Model
NJSB036L
Unit mm 8/1 Scale Allow 0.2
NICHIA CORPORATION
Title No.
OUTLINE DIMENSIONS
080307811221
Taping part
1.5+0.1 -0 80.1 20.05 40.1 1.750.1 0.250.05
Reel part
3300.2
17.51 13.51
5.50.05
Cathode mark
12+0.3 - 0.1
2
3.70.1
1 0.8
0.2
13
1.5+0.2 -0
3.70.1
2.850.1 Label
TYPE NxSx036xLT LOT xxxxxxQTY pcs RoHS
XXXX LED
Reel End of tape
No LEDs
LEDs mounting part
No LEDs
801
-14Pull direction Top cover tape Embossed carrier tape Reel Lead Min.160mm (No LEDs) Reel Lead Min.100mm (No LEDs) Reel Lead Min.400mm
3,000pcs/Reel
Taping is based on the JIS C 0806 : Packaging of Electronic Components on Continuous Tapes. (NOTE) When LED surface-mounting machines are used, special nozzles are required.
Model
NxSx036xLT
Unit mm Scale Allow
Nichia STS-DA1-0151
NICHIA CORPORATION
Title No.
TAPING DIMENSIONS
080313811911
Nichia STS-DA1-0151 The reel and moisture absorbent material are put in the moisture proof foil bag and then heat sealed.
Moisture proof foil bag
Reel Label
NICHIA
Seal
XXXX LED
TYPE LOT QTY NxSx036xLT xxxxxxPCS
RoHS
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
NICHIA CORPORATION
Moisture absorbent material
The box is partitioned with the cardboard.
Label
NICHIA
Nichia
LED
XXXX LED
TYPE RANK QTY NxSx036xLT PCS RoHS
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
NICHIA CORPORATION
Packing unit
Moisture proof foil bag Cardboard box Cardboard box S Reel/bag 1reel Quantity/bag (pcs) 3,000 MAX. Reel/box 5reel MAX. Quantity/box (pcs) 15,000 MAX.
Dimensions (mm) 391 379 149 8t
Model
NxSx036xLT
NICHIA CORPORATION
Title No.
PACKING
080313811921
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