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DS5000(T)
DS5000(T) Soft Microcontroller Module
FEATURES
PIN ASSIGNMENT
P1.0 P1.1 P1.2 P1.3 P1.4 P1.5 P1.6 P1.7 RST RXD P3.0 TXD P3.1 INT0 P3.2 INT1 P3.3 T0 P3.4 T1 P3.5 WR P3.6 RD P3.7 XTAL2 XTAL1 GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 VCC P0.0 AD0 P0.1 AD1 P0.2 AD2 P0.3 AD3 P0.4 AD4 P0.5 AD5 P0.6 AD6 P0.7 AD7 EA ALE PSEN P2.7 A15 P2.6 A14 P2.5 A13 P2.4 A12 P2.3 A11 P2.2 A10 P2.1 A9 P2.0 A8
* 8-bit 8051 compatible Microcontroller adapts to task-
at-hand: - 8 or 32K bytes of nonvolatile RAM for program and/or data memory storage - Initial downloading of software in end system via on-chip serial port - Capable of modifying its own program and/or data memory in end use
* Crashproof operation:
- Maintains all nonvolatile resources for 10 years in the absence of VCC - Power-fail reset - Early warning power-fail interrupt - Watchdog timer
* Software Security Feature:
- Executes encrypted software to prevent unauthorized disclosure
* On-chip, full-duplex serial I/O ports * Two on-chip timer/event counters * 32 parallel I/O lines * Compatible with
set and pinout industry standard 8051 instruction
40-PIN ENCAPSULATED PACKAGE
* Optional
Permanently Powered Real-Time Clock (DS5000T)
DESCRIPTION
The DS5000(T) Soft Microcontroller Module is a fully 8051 compatible 8-bit CMOS microcontroller that offers "softness" in all aspects of its application. This is accomplished through the comprehensive use of nonvolatile technology to preserve all information in the absence of system VCC. The internal program/data memory space is implemented using either 8K or 32K bytes of nonvolatile CMOS SRAM. Furthermore, internal data registers and key configuration registers are also nonvolatile. An optional real time clock gives permanently powered timekeeping. The clock keeps time to a hundredth of a second using an on-board crystal.
021998 1/19
DS5000(T)
ORDERING INFORMATION
PART NUMBER DS5000-8-16 DS5000-32-16 DS5000-8-16 DS5000T-32-16 RAM SIZE 8K bytes 32K bytes 8K bytes 32K bytes MAX CRYSTAL SPEED 16 MHz 16 MHz 16 MHz 16 MHz TIMEKEEPING? No No Yes Yes
Operating information is contained in the User's Guide section of the Secure Microcontroller Data Book. This data sheet provides ordering information, pinout, and electrical specification.
DS5000(T) BLOCK DIAGRAM Figure 1
DS5000(T)
VCC VCCO P0.0-0.7
P1.0-1.7
P2.0-2.7
P3.0-3.7
DS5000FP
RST ALE
PSEN EA XTAL1 XTAL2 GND
+3V
021998 2/19
IIIIIII IIIIIII IIIIIII IIIIIII IIIIIII IIIIIII IIIIIII IIIIIII IIIIIII IIIIIII
BYTE-WIDE DATA BUS CE1 R/W CE2
IIIII IIIII IIIII IIIII IIIII IIIII IIIII IIIII
BYTE-WIDE ADDRESS BUS
8K OR 32K SRAM
(DS5000T)
REAL TIME CLOCK
DS5000(T)
PIN DESCRIPTION
PIN NUMBER 1-8 9 10 11 12 13 14 15 16 17 18, 19 20 21-28 29 DESCRIPTION P1.0 - P1.7. General purpose I/O Port 1. 1 RST - Active high reset input. A logic 1 applied to this pin will activate a reset state. This pin is pulled down internally so this pin can be left unconnected if not used. P3.0 RXD. General purpose I/O port pin 3.0. Also serves as the receive signal for the on board UART. This pin should not be connected directly to a PC COM port. P3.1 TXD. General purpose I/O port pin 3.1. Also serves as the transmit signal for the on board UART. This pin should not be connected directly to a PC COM port. P3.2 INT0. General purpose I/O port pin 3.2. Also serves as the active low External Interrupt 0. P3.3 INT1. General purpose I/O port pin 3.3. Also serves as the active low External Interrupt 1. P3.4 T0. General purpose I/O port pin 3.4. Also serves as the Timer 0 input. P3.5 T1. General purpose I/O port pin 3.5. Also serves as the Timer 1 input. P3.6 WR. General purpose I/O port pin. Also serves as the write strobe for Expanded bus operation. P3.7 RD. General purpose I/O port pin. Also serves as the read strobe for Expanded bus operation. XTAL2, XTAL1. Used to connect an external crystal to the internal oscillator. XTAL1 is the input to an inverting amplifier and XTAL2 is the output. GND. Logic ground. P2.0-P2.7. General purpose I/O Port 2. Also serves as the MSB of the Expanded Address bus. PSEN - Program Store Enable. This active low signal is used to enable an external program memory when using the Expanded bus. It is normally an output and should be unconnected if not used. PSEN also is used to invoke the Bootstrap Loader. At this time, PSEN will be pulled down externally. This should only be done once the DS5000(T) is already in a reset state. The device that pulls down should be open drain since it must not interfere with PSEN under normal operation. ALE - Address Latch Enable. Used to de-multiplex the multiplexed Expanded Address/Data bus on Port 0. This pin is normally connected to the clock input on a '373 type transparent latch. When using a parallel programmer, this pin also assumes the PROG function for programming pulses. EA - External Access. This pin forces the DS5000(T) to behave like an 8031. No internal memory (or clock) will be available when this pin is at a logic low. Since this pin is pulled down internally, it should be connected to +5V to use NV RAM. In a parallel programmer, this pin also serves as VPP for super voltage pulses.
30
31
021998 3/19
DS5000(T)
PIN NUMBER 32-39
DESCRIPTION P0.7-P0.0. General purpose I/O Port 0. This port is open-drain and can not drive a logic 1. It requires external pull-ups. Port 0 is also the multiplexed Expanded Address/Data bus. When used in this mode, it does not require pull-ups. VCC - +5 volts.
40
INSTRUCTION SET The DS5000(T) executes an instruction set which is object code compatible with the industry standard 8051 microcontroller. As a result, software development packages which have been written for the 8051 are compatible with the DS5000(T), including cross-assemblers, high-level language compilers, and debugging tools. A complete description for the DS5000(T) instruction set is available in the User's Guide section of the Secure Microcontroller Data Book.
memory. Since the basic addressing capability of the machine is 16 bits, a maximum of 64K bytes of program memory and 64K bytes of data memory can be accessed by the DS5000(T) CPU. The 8K or 32K byte RAM area inside of the DS5000(T) can be used to contain both program and data memory. The Real time Clock (RTC) in the DS5000T is reached in the memory map by setting a SFR bit. The MCON.2 bit (ECE2) is used to select an alternate data memory map. While ECE2=1, all MOVXs will be routed to this alternate memory map. The real time clock is a serial device that resides in this area. A full description of the RTC access and example software is given in the User's Guide section of the Secure Microcontroller Data Book. If the ECE2 bit is set on a DS5000 without a timekeeper, the MOVXs will simply go to a nonexistent memory. Software execution would not be affected otherwise.
MEMORY ORGANIZATION Figure 2 illustrates the address spaces which are accessed by the DS5000(T). As illustrated in the figure, separate address spaces exist for program and data
021998 4/19
DS5000(T)
DS5000(T) LOGICAL ADDRESS SPACES Figure 2
64K - 64K -
32K -
32K -
8K -
8K -
255 127 128
NV RAM PROGRAM MEMORY
0 DATA REGISTERS SPECIAL FUNCTION REGISTERS
0
PROGRAM MEMORY
INTERNAL REGISTERS LEGEND:
= ON-CHIP REGISTERS
= ACCESSED VIA EXPANDED BUS
= NV RAM MEMORY
PROGRAM LOADING The Program Load Modes allow initialization of the NV RAM Program/Data Memory. This initialization may be performed in one of two ways: 1. Serial Program Loading which is capable of performing Bootstrap Loading of the DS5000(T). This feature allows the loading of the application program to be delayed until the DS5000(T) is installed in the end system. Dallas Semiconductor strongly recommends the use of serial program loading because of its versatility and ease of use. 2. Parallel Program Load cycles which perform the initial loading from parallel address/data information presented on the I/O port pins. This mode is timing- set compatible with the 8751H microcontroller programming mode.
The DS5000(T) is placed in its Program Load configuration by simultaneously applying a logic 1 to the RST pin and forcing the PSEN line to a logic 0 level. Immediately following this action, the DS5000(T) will look for a parallel Program Load pulse, or a serial ASCII carriage return (0DH) character received at 9600, 2400, 1200, or 300 bps over the serial port. The hardware configurations used to select these modes of operation are illustrated in Figure 3.
IIIII IIIII IIIII IIIII IIIII IIIII IIIII IIIII IIIII IIIII IIIII IIIII IIIII IIIII
NV RAM DATA MEMORY 0 DATA MEMORY
IIIII IIIII IIIII IIIII IIIII IIIII IIIII IIIII IIIII IIIII IIIII IIIII IIIII II II
RANGE ADDR.
PARTITION ADDR.
II II
021998 5/19
DS5000(T)
PROGRAM LOADING CONFIGURATIONS Figure 3
VCC
GND
VCC
GND
DS5000 PROGRAM ADDRESS A7-A0 P1.7- P1.0 P2.3- P2.0 EA/VPP ALE/PROG PROGRAM CONTROL P2.7 P2.6 P2.5 XTAL1 XTAL2 RST PSEN 11.059 MHz XTAL2 R<2K XTAL1 P0.7- P0.0 P3.7- P3.4 D7-D0 PROGRAM DATA IN/VERIFY DATA OUT P1.7- P1.0 P2.5- P2.0 P2.6 P2.7
DS5000 P0.7- P0.0 P3.7- P3.2
A11-A8
A15-A12 PROGRAM ADDRESS
TXD RXD
DRIVE/ RS232C RCV
R<2K RST PSEN
PARALLEL LOADING
SERIAL LOADING
Table 1 summarizes the selection of the available Parallel Program Load cycles. The timing associated with these cycles is illustrated in the electrical specs.
SERIAL BOOTSTRAP LOADER The Serial Program Load Mode is the easiest, fastest, most reliable, and most complete method of initially loading application software into the DS5000(T) nonvolatile RAM. Communication can be performed over a standard asynchronous serial communications port. A typical application would use a simple RS232C serial interface to program the DS5000(T) as a final production procedure. The hardware configuration which is required for the Serial Program Load mode is illustrated in Figure 3. Port pins 2.7 and 2.6 must be either open or pulled high to avoid placing the DS5000(T) in a parallel load cycle. Although an 11.0592 MHz crystal is shown in Figure 3, a variety of crystal frequencies and loader baud rates are supported, shown in Table 2. The serial loader is designed to operate across a three-wire interface from a standard UART. The receive, transmit, and ground wires are all that are necessary to establish communication with the DS5000(T). The Serial Bootstrap Loader implements an easy-to- use command line interface which allows an application
program in an Intel hex representation to be loaded into and read back from the device. Intel hex is the typical format which existing 8051 cross-assemblers output. The serial loader responds to single character commands which are summarized below: COMMAND C D F K L R T U V W Z P G FUNCTION Return CRC-16 checksum of embedded RAM Dump Intel Hex File Fill embedded RAM block with constant Load 40-bit Encryption Key Load Intel Hex File Read MCON register Trace (Echo) incoming Intel Hex data Clear Security Lock Verify Embedded RAM with incoming Intel Hex Write MCON register Set Security Lock Put a value to a port Get a value from a port
021998 6/19
DS5000(T)
PARALLEL PROGRAM LOAD CYCLES Table 1
MODE Program Security Set Verify Prog Expanded Verify Expanded Prog MCON or Key registers Verify MCON registers RST 1 1 1 1 1 1 1 PSEN 0 0 X 0 0 0 0 PROG 0 0 X 0 1 0 1 EA VPP VPP 1 VPP 1 VPP 1 P2.7 1 1 0 0 0 0 0 P2.6 0 1 0 1 1 1 1 P2.5 X X X 0 0 1 1
The Parallel Program Cycle is used to load a byte of data into a register or memory location within the DS5000(T). The Verify Cycle is used to read this byte back for comparison with the originally loaded value to verify proper load ing. The Security Set Cycle may be used to enable and the Software Security feature of the DS5000(T). One may also enter bytes for the MCON register or for the five encryption registers using the Program MCON cycle. When using this cycle, the absolute register address must be presented at Ports 1 and 2 as in the normal program cycle (Port 2 should be 00H). The MCON contents can likewise be verified using the Verify MCON cycle. When the DS5000(T) first detects a Parallel Program Strobe pulse or a Security Set Strobe pulse while in the Program Load Mode following a Power-On Reset, the internal hardware of the DS5000(T) is initialized so that an existing 4K byte program can be programmed into a DS5000(T) with little or no modification. This initialization automatically sets the Range Address for 8K bytes and maps the lowest 4K byte bank of Embedded RAM
as program memory. The next 4K bytes of Embedded RAM are mapped as Data Memory. In order to program more than 4K bytes of program code, the Program/Verify Expanded cycles can be used. Up to 32K bytes of program code can be entered and verified. Note that the expanded 32K byte Program/ Verify cycles take much longer than the normal 4K byte Program/Verify cycles. A typical parallel loading session would follow this procedure. First, set the contents of the MCON register with the correct range and partition only if using expanded programming cycles. Next, the encryption registers can be loaded to enable encryption of the program/data memory (not required). Then, program the DS5000(T) using either normal or expanded program cycles and check the memory contents using Verify cycles. The last operation would be to turn on the security lock feature by either a Security Set cycle or by explicitly writing to the MCON register and setting MCON.0 to a 1.
021998 7/19
DS5000(T)
SERIAL LOADER BAUD RATES FOR DIFFERENT CRYSTAL FREQUENCIES Table 2
BAUD RATE CRYSTAL FREQ (MHz) 14.7456 11.0592 9.21600 7.37280 5.52960 1.84320 Y Y Y Y Y 300 1200 Y Y Y Y Y Y 2400 Y Y Y Y Y Y 9600 Y Y Y Y Y Y 19200 Y Y Y 57600
ADDITIONAL INFORMATION A complete description for all operational aspects of the DS5000(T), is provided in the User's Guide section of the Secure Microcontroller Data Book.
DEVELOPMENT SUPPORT Dallas Semiconductor offers a kit package for developing and testing user code. The DS5000TK Evaluation
Kit allows the user to download Intel hex formatted code directly to the DS5000(T) from a PC-XT/AT or compatible computer. The kit consists of a DS5000T-32, an interface pod, demo software, and an RS232 connector that attaches to the COM1 or COM2 serial port of a PC. See the Development Tools section of the Secure Microcontroller Data Book for further details.
021998 8/19
DS5000(T)
ABSOLUTE MAXIMUM RATINGS*
Voltage on Any Pin Relative to Ground Operating Temperature Storage Temperature Soldering Temperature -0.3V to +7.0V 0C to 70C -40C to +70C 260C for 10 seconds
* This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability.
DC CHARACTERISTICS
PARAMETER Input Low Voltage Input High Voltage Input High Voltage RST, XTAL1 Output Low Voltage @ IOL=1.6 mA (Ports 1, 2, 3) Output Low Voltage @ IOL=3.2 mA (Ports 0, ALE, PSEN) Output High Voltage @ IOH=-80 A (Ports 1, 2, 3) Output High Voltage @ IOH=-400 A (Ports 0, ALE, PSEN) Input Low Current VIN = 0.45V (Ports 1, 2, 3) Transition Current; 1 to 0 VIN = 2.0V (Ports 1, 2, 3) Input Leakage Current 0.45 < VIN < VCC (Port 0) RST, EA Pulldown Resistor Stop Mode Current Power-Fail Warning Voltage Minimum Operating Voltage Programming Supply Voltage (Parallel Program Mode) Program Supply Current Operating Current DS5000-8K@8 MHz DS5000-32K @ 12 MHz DS5000T-32-16 @ 16 MHz Idle Mode Current @ 12 MHz SYMBOL VIL VIH1 VIH2 VOL1 VOL2 VOH1 VOH2 IIL ITL IL RRE ISM VPFW VCCmin VPP IPP ICC 4.15 4.05 12.5 15 25.2 35.7 45.6 4.5 4.6 4.5 40 2.4 2.4 MIN -0.3 2.0 3.5 0.15 0.15 4.8 4.8 TYP
(tA = 0C to70C; VCC = 5V + 5%)
MAX 0.8 VCC +0.3 VCC +0.3 0.45 0.45 UNITS V V V V V V V -50 -500 +10 125 80 4.75 4.65 13 20 43 48 54 6.2 A A A K A V V V mA mA 2 4 1 1 1 1 1 1 NOTES 1 1 1
ICC
mA
3
021998 9/19
DS5000(T)
AC CHARACTERISTICS EXPANDED BUS MODE TIMING SPECIFICATIONS
# 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 PARAMETER Oscillator Frequency ALE Pulse Width Address Valid to ALE Low Address Hold After ALE Low ALE Low to Valid Instr. In ALE Low to PSEN Low PSEN Pulse Width PSEN Low to Valid Instr. In @12 MHz @16 MHz @12 MHz @16 MHz SYMBOL 1/tCLK tALPW tAVALL tAVAAV tALLVI tALLPSL tPSPW tPSLVI tPSIV tPSIX tPSAV tAVVI tPSLAZ tRDPW tWRPW @12 MHz @16 MHz tRDLDV tRDHDV tRDHDZ @12 MHz @16 MHz @12 MHz @16 MHz tALLVD tAVDV tALLRDL tAVRDL tDVWRL @12 MHz @16 MHz tDVWRH tWRHDV tRDLAZ tRDHALH
(tA = 0C to70C; VCC = 5V + 5%)
MIN 1.0 2tCLK -40 tCLK -40 tCLK -35 4tCLK -150 4tCLK -90 tCLK -25 3tCLK -35 3tCLK -150 3tCLK -90 0 tCLK -20 tCLK -8 5tCLK -150 5tCLK -90 0 6tCLK -100 6tCLK -100 5tCLK -165 5tCLK -105 0 2tCLK -70 8CLK -150 8tCLK -90 9tCLK -165 9tCLK -105 3tCLK -50 4tCLK -130 tCLK -60 7tCLK -150 7tCLK -90 tCLK -50 0 tCLK -40 tCLK +50 3tCLK +50 MAX 16 UNITS MHz ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
Input Instr. Hold after PSEN Going High Input Instr. Float after PSEN Going High Address Hold after PSEN Going High Address Valid to Valid Instr. In @12 MHz @16 MHz PSEN Low to Address Float RD Pulse Width WR Pulse Width RD Low to Valid Data In Data Hold after RD High Data Float after RD High ALE Low to Valid Data In Valid Addr. to Valid Data In ALE Low to RD or WR Low Address Valid to RD or WR Low Data Valid to WR Going Low Data Valid to WR High Data Valid after WR High RD Low to Address Float RD or WR High to ALE High
021998 10/19
DS5000(T)
EXPANDED PROGRAM MEMORY READ CYCLE
2
ALE 6 7 5 8 PSEN 13 3 9 4 11
10
PORT 0
A7-A0
INSTR IN
A7-A0
12
PORT 2
A15-A8
A15-A8
EXPANDED DATA MEMORY READ CYCLE
27
ALE
PSEN 19 21 RD 14
16 18 3 4 26 17 A7-A0 (PCL) INSTR IN
PORT 0
A7-A0 (Rn OR DPL)
DATA IN
22 20
PORT 2
P2.7-P2.0 OR A15-A8 FROM DPH
A15-A8 FROM PCH
021998 11/19
DS5000(T)
EXPANDED DATA MEMORY WRITE CYCLE
27
ALE
PSEN 21 15 WR 23 3 4 24 25
PORT 0
A7-A0 (Rn OR DPL)
DATA OUT
A7-A0 (PCL)
INSTR IN
22
PORT 2
P2.7-P2.0 OR A15-A8 FROM PDH
A15-A8 FROM PCH
EXTERNAL CLOCK TIMING
28 29 30
31 1
021998 12/19
DS5000(T)
AC CHARACTERISTICS (cont'd) EXTERNAL CLOCK DRIVE
# 28 PARAMETER External Clock High Time @12 MHz @16 MHz @12 MHz @16 MHz @12 MHz @16 MHz @12 MHz @16 MHz SYMBOL tCLKHPW tCLKLPW tCLKR tCLKF
(tA = 0C to70C; VCC = 5V + 5%)
MIN 20 15 20 15 20 15 20 15 MAX UNITS ns ns ns ns ns ns ns ns
29 30 31
External Clock Low Time External Clock Rise Time External Clock Fall Time
AC CHARACTERISTICS (cont'd) SERIAL PORT TIMING - MODE 0
# 35 36 37 38 39 PARAMETER Serial Port Cycle Time Output Data Setup to Rising Clock Edge Output Data Hold after Rising Clock Edge Clock Rising Edge to Input Data Valid Input Data Hold after Rising Clock Edge SYMBOL tSPCLK tDOCH tCHDO tCHDV tCHDIV
(tA = 0C to70C; VCC = 5V + 5%)
MIN 12tCLK 10tCLK -133 2tCLK -117 10tCLK -133 0 MAX UNITS s ns ns ns ns
SERIAL PORT TIMING - MODE 0
INSTRUCTION 0 1 2 3 4 5 6 7 8
ALE
CLOCK
35
36 DATA OUT 0 WRITE TO SBUF REGISTER 39 38 INPUT DATA SET RI VALID CLEAR RI VALID VALID VALID VALID VALID VALID 37 1 2 3 4 5 6 7 SET TI
021998 13/19
DS5000(T)
AC CHARACTERISTICS (cont'd) POWER CYCLING TIMING
# 32 33 34 PARAMETER Slew Rate from VCCmin to 3.3V Crystal Start up Time Power-On Reset Delay SYMBOL tF tCSU tPOR
(tA = 0C to70C; VCC = 5V + 5%)
MIN 40 (note 5) 21504 tCLK MAX UNITS s
POWER CYCLE TIMING
VCC VPFW VCCMIN
VLI 32
INTERRUPT SERVICE ROUTINE 33
CLOCK OSC 34
INTERNAL RESET
LITHIUM CURRENT
021998 14/19
DS5000(T)
AC CHARACTERISTICS (cont'd) PARALLEL PROGRAM LOAD TIMING
# 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 PARAMETER Oscillator Frequency Address Setup to PROG Low Address Hold after PROG High Data Setup to PROG Low Data Hold after PROG High P2.7, 2.6, 2.5 Setup to VPP VPP Setup to PROG Low VPP Hold after PROG Low PROG Width Low Data Output from Address Valid Data Output from P2.7 Low Data Float after P2.7 High Delay to Reset/PSEN Active after Power-On Reset/PSEN Active (or Verify Inactive) to VPP High VPP Inactive (Between Program Cycles) Verify Active Time SYMBOL 1/tCLK tAVPRL tPRHAV tDVPRL tPRHDV tP27HVP tVPHPRL tPRHVPL tPRW tAVDV tDVP27L tP27HDZ tPORPV tRAVPH tVPPPC tVFT
(tA = 0C to70C; VCC = 5V + 5%)
MIN 1.0 0 0 0 0 0 0 0 2400 48 1800* 48 1800* 0 21504 1200 1200 48 2400* 48 1800* tCLK tCLK tCLK tCLK tCLK tCLK tCLK tCLK MAX 12.0 UNITS MHz
* Second set of numbers refers to expanded memory programming up to 32K bytes.
021998 15/19
DS5000(T)
PARALLEL PROGRAM LOAD TIMING
P2.3-P2.0 P1.7-P1.0 41
ADDRESS 42
ADDRESS
ADDRESS
49
PORT
DATA
DATA
DATA
43 ALE/PROG
44
51 47 46 VPP EA/VPP 48 54
VIH 45 50 53
P2.7, P2.6, P2.5 ACTIVE 55
+5V VCC 52 53
RST
PSEN
CAPACITANCE
PARAMETER Output Capacitance Input Capacitance SYMBOL CO CI MIN TYP
(test frequency = 1 MHz; tA = 25C)
MAX 10 10 UNITS pF pF NOTES
021998 16/19
DS5000(T)
DS5000(T) TYPICAL ICC VS. FREQUENCY
45.0 16 MHz
40.0
12 MHz 35.0
30.0
8 MHz 25.0
NORMAL OPERATION
Icc CURRENT (mA)
20.0
15.0
10.0 IDLE MODE OPERATION 5.0
0
0.0
5.0
10.0
15.0
FREQUENCY OF OPERATION (MHz) (VCC=+5V, tA=25C)
Normal operation is measured using: 1) 2) 3) 4) External crystals on XTAL1 and 2 All port pins disconnected RST=0 volts and EA=VCC Part performing endless loop writing to internal memory.
Idle mode operation is measured using: 1) 2) 3) 4) External clock source at XTAL1; XTAL2 floating All port pins disconnected RST=0 volts and EA=VCC Part set in IDLE mode by software.
021998 17/19
DS5000(T)
NOTES:
1. All voltages are referenced to ground. 2. Maximum operating ICC is measured with all output pins disconnected; XTAL1 driven with tCLKR, tCLKF=10 ns, VIL = 0.5V; XTAL2 disconnected; EA = RST = PORT0 = VCC. 3. Idle mode ICC is measured with all output pins disconnected; XTAL1 driven with tCLKR, tCLKF = 10 ns, VIL = 0.5V; XTAL2 disconnected; EA = PORT0 = VCC, RST = VSS. 4. Stop mode ICC is measured with all output pins disconnected; EA = PORT0 = VCC; XTAL2 not connected; RST = VSS. 5. Crystal start-up time is the time required to get the mass of the crystal into vibrational motion from the time that power is first applied to the circuit until the first clock pulse is produced by the on-chip oscillator. The user should check with the crystal vendor for the worst case spec on this time.
PACKAGE DRAWING
A 1 A IN. B IN. C IN. D IN. E IN. F IN. G IN. H IN. C I IN. 0.009 0.015 INCHES DIM MIN 2.080 0.680 0.290 0.090 0.030 0.145 0.016 0.590 MAX 2.100 0.700 0.325 0.110 0.060 0.185 0.020 0.610
E
G F 1.900
D
B
I H
021998 18/19
DS5000(T)
DATA SHEET REVISION SUMMARY The following represent the key differences between the dates 07/20/95 to 07/24/96 of the DS5000(T) data sheet. Please review this summary carefully. 1. Correct Figure 3 to show RST active high. 2. Add Data Sheet Revision Summary.
021998 19/19

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