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FPF2223-FPF2225 Integrated Load Switch with Adjustable High Precision Current Limit
June 2008
FPF2223-FPF2225
Features
1.8 to 5.5V Input Voltage Range Typical RDS(ON) = 140m Typical RDS(ON) = 160m
Integrated Load Switch with Adjustable High Precision Current Limit
General Description
@ VIN = 5.5V @ VIN = 3.3V
tm
250-625mA (min) Adjustable Current Limit 5% Current Limit Tolerance @ 625mA (min) 72 (typ) Output Discharge Resistance ESD Protected, Above 8kV HBM and 2kV CDM
The FPF2223-FPF2225 are low RDS(ON) P-Channel MOSFET load switches with high precision current limit value. The input voltage range operates from 1.8V to 5.5V to fulfill today's Ultra Portable Device's supply requirement. Switch control is by a logic input (ON) capable of interfacing directly with low voltage control signal. On-chip pull-down is available for output quick discharge when switch is turned off. For the FPF2224, if the constant current condition still persists after 30ms, these parts will shut off the switch and pull the fault signal pin (FLAGB) low. The FPF2223 has an auto-restart feature, which will turn the switch on again after 450mS if the ON pin is still active. The FPF2224 do not have this auto-restart feature so the switch will remain off until the ON pin is cycled. For the FPF2225, a current limit condition will immediately pull the fault signal pin low and the part will remain in the constantcurrent mode until the switch current falls below the current limit. For the FPF2223 through FPF2225, the current limit is set by an external resistor and the minimum current limit is 250mA.
Applications
PDAs Cell Phones GPS Devices MP3 Players Digital Cameras Peripheral Ports Notebook Computer
Pin 1 BOTTOM TOP
Ordering Information
Part
FPF2223 FPF2224 FPF2225
Current Limit (mA)
250-625 250-625 250-625
Current Limit Blanking Time (mS)
30 30 NA
Auto-Restart Time (mS)
450 NA NA
ON Pin Activity
Active HI Active HI Active HI
(c)2008 Fairchild Semiconductor Corporation
FPF2223-FPF2225 Rev. B
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FPF2223-FPF2225 Integrated Load Switch with Adjustable High Precision Current Limit
Typical Application Circuit
FPF2223/4/5
VIN VOUT FLAGB OFF ON ON GND ISET
TO LOAD
Functional Block Diagram
VIN UVLO
THERMAL SHUTDOWN
CONTROL LOGIC
ON CURRENT LIMIT VOUT ISET Output Discharge FLAGB
GND
FPF2223-FPF2225 Rev. B
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FPF2223-FPF2225 Integrated Load Switch with Adjustable High Precision Current Limit
Pin Configuration
ON 6 GND 5 FLAGB 4
1 ISET 2 VIN 3 VOUT
MicroFET 2x2 6L (BOTTOMVIEW)
Pin Description
Pin
1 2 3 4 5 6
Name
ISET VIN VOUT FLAGB GND ON
Function
Current Limit Set Input : A resistor from ISET to ground sets the current limit for the switch Supply Input: Input to the power switch and the supply voltage for the IC Switch Output: Output of the power switch Fault Output: Active LO, open drain output which indicates an over current, supply under voltage or over temperature state Ground ON/OFF Control Input
Absolute Maximum Ratings
Parameter
VIN, VOUT, ON, FLAGB TO GND ISET TO GND Power Dissipation @ TA = 25C Operating and Storage Junction Temperature Thermal Resistance, Junction to Ambient Electrostatic Discharge Protection HBM MM CDM 8000 400 2000 -65
Min.
-0.3 -0.3
Max.
6 0.3 1.2 125 86
Unit
V V W C C/W V V V
Recommended Operating Range
Parameter
VIN Ambient Operating Temperature, TA
Min.
1.8 -40
Max.
5.5 85
Unit
V C
Electrical Characteristics
VIN = 1.8 to 5.5V, TA = -40 to +85C unless otherwise noted. Typical values are at VIN = 3.3V and TA = 25C.
Parameter
Basic Operation Operating Voltage Quiescent Current VIN Shutdown Current
Symbol
VIN
Conditions
Min.
1.8
Typ.
Max.
5.5
Units
V A A
IOUT=0mA, VIN=VON=1.8V, RSET=36K IQ IOUT=0mA, VIN=VON=3.3V, RSET=36K IOUT=0mA, VIN=VON=5.5V, RSET=36K VON=0V, VIN=5.5V, VOUT=short to GND
45 50 55
75 80 95 2.5
FPF2223-FPF2225 Rev. B
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FPF2223-FPF2225 Integrated Load Switch with Adjustable High Precision Current Limit
Parameter
VOUT Shutdown Current
Symbol
Conditions
VON=0V, VOUT=5.5V, VIN=short to GND VIN=5.5V, IOUT=200mA, TA=25C
Min.
Typ.
140 160 230
Max.
1 185 210 300 265 105
Units
A
On-Resistance
RON
VIN=3.3V, IOUT=200mA, TA=25C VIN=1.8V, IOUT=200mA, TA=25C VIN=3.3V, IOUT=200mA, TA=-40 to +80 C 90 VIN=3.3V, VON=0V, IOUT=10mA
m
Output Discharge Resistance ON Input Logic High Voltage (ON) ON Input Logic Low Voltage (OFF) On Input Leakage FLAGB Output Logic Low Voltage FLAGB Output High Leakage Current Protections Current Limit ILIM VIH VIL
72 0.8 1.4
VIN=1.8V VIN=5.5V VIN=1.8V VIN=5.5V VON = VIN or GND VIN=5.5V, ISINK=100 A VIN=1.8V, ISINK=100 A VIN=5.5V, Switch on
V 0.5 1.0 V A V uA
-1 0.05 0.12
1 0.1 0.25 1
VIN=3.3V, VOUT = 3.0V, RSET=36K, TA=25C Shutdown Threshold Return from Shutdown Hysteresis
627
660 140 130 10
693
mA
Thermal Shutdown Under Voltage Shutdown Under Voltage Shutdown Hysteresis Dynamic Turn On Time Turn Off Time VOUT Rise Time VOUT Fall Time Over Current Blanking Time Auto-Restart Time Current Limit Response Time tON tOFF tRISE tFALL tBLANK tRSTRT UVLO
C 1.75 V mV S nS S nS 60 900 mS mS S
VIN increasing
1.55
1.65 50
RL=500 , CL=0.001uF RL=500 , CL=0.001uF RL=500 , CL=0.001uF RL=500 , CL=0.001uF FPF2223, FPF2224 FPF2223 VIN = VON = 3.3V. Over-Current Condition: RLOAD=VIN/(ILIMx4) 15 225
70 600 40 100 30 450 5
FPF2223-FPF2225 Rev. B
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FPF2223-FPF2225 Integrated Load Switch with Adjustable High Precision Current Limit
Typical Characteristics
80 70
SUPPLY CURRENT (uA)
VON = VIN
90
VON=VIN
80 SUPPLY CURRENT (uA)
VIN=3.3V
60 50 40 30 20 10
1 2 3
85 C 25 C -40 C
o o
o
70
VIN=5.5V
60 50 40 30 20 -40
VIN=1.8V
4
5
6
-15
10
35
o
60
85
SUPPLY VOLTAGE (V)
TJ, JUNCTION TEMPERATURE ( C)
Figure 1. Quiescent Current vs. Input Voltage
Figure 2. Quiescent Current vs. Temperature
1.4 1.2 1.0 0.8 0.6 0.4 0.2 1 2 3 4 5 6
VIH VIL
1.6 1.4 VON SUPPLY VOLTAGE (V)
VIN=5.5V
VON SUPPLY VOLTAGE (V)
1.2 1 0.8 0.6 0.4 0.2 -40
VIN=3.3V
VIN=1.2V
-15
10
35
60
85
VIN, SUPPLY VOLTAGE (V)
TJ, JUNCTION TEMPERATURE (oC)
Figure 3. VON vs. Input Voltage
Figure 4. VON High Voltage vs. Temperature
1.4 1.2 1.0 0.8
VIN=1.2V VIN=5.5V
0.05 0.04
VON SUPPLY VOLTAGE (V)
ON PIN CURRENT (uA)
VIN=3.3V
0.03 0.02
VON = 5.5V
0.6 0.4 0.2 0.0 -40 -15 10 35
o
0.01 0.00 -0.01
VON = 0V
60
85
-40
-15
10
35
o
60
85
TJ, JUNCTION TEMPERATURE ( C)
TJ, JUNCTION TEMPERATURE ( C)
Figure 5. VON Low Voltage vs. Temperature
Figure 6. On Pin Current vs. Temperature
FPF2223-FPF2225 Rev. B
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FPF2223-FPF2225 Integrated Load Switch with Adjustable High Precision Current Limit
Typical Characteristics
800 700
700 690
OUTPUT CURRENT (mA)
OUTPUT CURRENT (mA)
600 500 400 300 200 100 0 0 1 2 3 4 5 6
680 670 660 650 640 630 620 -40
VIN = 3.3V VIN = 5.5V VIN = 1.8V
-15
10
35
o
60
85
VIN-VOUT (V)
TJ, JUNCTION TEMPERATURE ( C)
Figure 7. Current Limit vs. Output Voltage
Figure 8. Current Limit vs. Temperature
320 280 240
340 300 260
VIN=1.8V
RON(mOhms)
RON(mOhms)
200 160 120
85 C 25 C
o
o
220 180 140
VIN=3.3V
VIN=5.5V
-40 C
o
80 40 1.5 2.5 3.5 4.5 5.5
100 60 -40
-15
10
35
o
60
85
VIN, SUPPLY VOLTAGE(V)
TJ, JUNCTION TEMPERATURE ( C)
Figure 9. RON vs. Input Voltage
Figure 10. RON vs. Temperature
1000
TON
TURN-ON/OFF TIMES (uS)
VIN = 3.3V RL = 500 Ohms COUT = 0.11uF
100
TRISE
100
RISE / FALL TIMES (uS)
10
VIN = 3.3V RL = 500 Ohms COUT = 0.11uF
10
TOFF
TFALL
1
1
0.1 -40
-15
10
35
o
60
85
0.1 -40
-15
10
35
o
60
85
TJ, JUNCTION TEMPERATURE ( C)
TJ, JUNCTION TEMPERATURE ( C)
Figure 11. TOFF / TON vs. Temperature
Figure 12. TRISE / TFALL vs. Temperature
FPF2223-FPF2225 Rev. B
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FPF2223-FPF2225 Integrated Load Switch with Adjustable High Precision Current Limit
Typical Characteristics
1000
TRESTART
TBLANK / TRESTART (mS)
VIN 2V/DIV IOUT 10mA/DIV
100
TBLANK
10
VON 2V/DIV VOUT 2V/DIV
1 -40
VIN=3.3V, RL=500 , CIN=10uF, RSET=36K 100 s/DIV Figure 14. Turn On Response
-15
10
35
60
85
TJ, JUNCTION TEMPERATURE (oC)
Figure 13. TBLANK vs Temperature
VIN 2V/DIV IOUT 10mA/DIV VON 2V/DIV VOUT 2V/DIV
VDRV1 5V/DIV IOUT 500mA/DIV VFLAGB 2V/DIV VOUT 2V/DIV TBLANK VIN=5V, CIN=10uF, RL=100 ,COUT=1uF, RSET=36K
VIN=3.3V, RL=500 , CIN=10uF, RSET=36K 500ns/DIV Figure 15. Turn Off Response
10ms/DIV Figure 16. TBLANK Response
VDRV1 5V/DIV IOUT 500mA/DIV VFLAGB 2V/DIV VOUT 2V/DIV
VIN=5V, CIN=10uF, RL=100 ,COUT=1uF, RSET=36K
VON 2V/DIV IOUT 10mA/DIV
TRESTART
VIN 2V/DIV VOUT 2V/DIV
VIN=3.3V, CIN=10uF, RL=1.2 ,COUT=10uF, RSET=36K
100ms/DIV Figure 17. TRESTART Response
100 s/DIV Figure 18. Current Limit Response (Output is loaded with 1.2 resistor and COUT=10 F)
Note1: VDRV signal drives the gate of a NMOS transistor. The NMOS transistor is in series with a 5 resistor and is connected to the output of device. By turning on the transistor, the 5 resistor is loaded to the output and forces the device to go into overcurrent condition.
FPF2223-FPF2225 Rev. B
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FPF2223-FPF2225 Integrated Load Switch with Adjustable High Precision Current Limit
Typical Characteristics
VON 2V/DIV IOUT 500mA/DIV VIN 5V/DIV VOUT 2V/DIV VIN=5V, CIN=10uF, COUT=100uF, RL=1.2 , RSET=36K VON 2V/DIV IOUT 500mA/DIV VIN 5V/DIV VOUT 5V/DIV VIN=5V, CIN=10uF, RL=1.2 , COUT=100uF, RSET=36K
500 s/DIV Figure 19. Current Limit Response (Output is loaded with 1.2 resistor and COUT=100 F)
2ms/DIV Figure 20. Current Limit and Output Discharge Response (Device turns on and off into large capacitive load COUT=100F)
VIN=VON 2V/DIV IOUT 500mA/DIV VIN=VON=3.3V, CIN=10uF, RL=1.2 , COUT=1uF, RSET=36K
VON 2V/DIV IOUT 5A/DIV
VIN=3.3V, CIN=10uF, RL=100 ,COUT=1uF, RSET=36K
VOUT 2V/DIV
VOUT 2V/DIV
50 s/DIV Figure 21. Current Limit Response (Switch is powered into a short - Input and enable pin are tied together)
20 s/DIV Figure 22. Short Circuit Response Time (Output shorted to GND while the switch is in normal operation)
FPF2223-FPF2225 Rev. B
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FPF2223-FPF2225 Integrated Load Switch with Adjustable High Precision Current Limit
Description of Operation
The FPF2223, FPF2224, and FPF2225 are state of the art Adjustable High Precision Current Limit switches that protect systems and loads which can be damaged or disrupted by the application of high currents. The core of each device is a 0.16 P-channel MOSFET and a controller capable of functioning over an input operating range of 1.8- 5.5V. The controller protects or offers current limiting, UVLO(undervoltage lockout) and thermal shutdown protection. The current limit is adjustable from 250mA to 625mA through the selection of an external resistor.
Undervoltage Lockout (UVLO)
The undervoltage lockout turns-off the switch if the input voltage drops below the undervoltage lockout threshold. With the ON pin active the input voltage rising above the undervoltage lockout threshold will cause a controlled turn-on of the switch which limits current over-shoots.
Output Discharge Resistor
The FPF2223/4/5 family contains an 80 on-chip load resistor for quick output discharge when the switch is turned off. This features become more attractive when application requires large output capacitor to be discharge when the switch tunrs off. However, VOUT pin should not be connected directly to the battery source due to the discharge mechanism of the load switch.
On/Off Control
The ON pin is active high, and controls the state of the switch. Applying a continuous high signal will hold the switch in the on state. The switch will move into the OFF state when the active high is removed, or if a fault is encountered. For all versions, an undervoltage on VIN or a junction temperature in excess of 140C overrides the ON control to turn off the switch. In addition, excessive currents will cause the switch to turn off in the FPF2223 and FPF2224. The FPF2223 has an Auto-Restart feature which will automatically turn the switch on again after 450ms. For the FPF2224, the ON pin must be toggled to turn-on the switch again. The FPF2225 does not turn off in response to an over current condition but instead remains operating in a constant current mode so long as ON is active and the thermal shutdown or UVLO have not activated.
Thermal Shutdown
The thermal shutdown protects the die from internally or externally generated excessive temperatures. During an overtemperature condition the FLAGB is activated and the switch is turned-off. The switch automatically turns-on again if temperature of the die drops below the threshold temperature.
Fault Reporting
Upon the detection of an over-current condition, an input UVLO, or an over-temperature condition, the FLAGB signals the fault mode by activating LO. In the event of an over-current condition for the FPF2223 and FPF2224, the FLAGB goes LO at the end of the blanking time while FLAGB goes LO immediately for the FPF2225. If the over-current condition lasts longer than blanking time, FLAGB remains LO through the Auto-Restart Time for the FPF2223 while for the FPF2224, FLAGB is latched LO and ON must be toggled to release it. With the FPF2225, FLAGB is LO during the faults and immediately returns HI at the end of the fault condition. FLAGB is an open-drain MOSFET which requires a pull-up resistor between VIN and FLAGB. During shutdown, the pull-down on FLAGB is disabled to reduce current draw from the supply. A 100K pull up resistor is recommended to be used in the application.
Current Limiting
The current limit ensures that the current through the switch doesn't exceed a maximum value while not limiting at less than a minimum value. The current at which the parts will limit is adjustable through the selection of an external resistor connected to the ISET pin. The FPF2223 and FPF2224 have a blanking time of 30ms (nominal) during which the switch will act as a constant current source. At the end of the blanking time, the switch will be turned-off. The FPF2225 has no current limit blanking period so it will remain in a constant current state until the ON pin is deactivated or the thermal shutdown turns-off the switch.
FPF2223-FPF2225 Rev. B
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FPF2223-FPF2225 Integrated Load Switch with Adjustable High Precision Current Limit
Application Information
The FPF2223, FPF2224, and FPF2225 have adjustable high precision current limit which is set with an external resistor connected between ISET and GND. Please see the layout recommendation section of the application note for the recommended RSET layout. The RSET resistance is selected by using the following equation: 23764 RSET (K )
Setting Current Limit
720 660 600
ILIMIT (mA)
540 480 420 360 300
Max Typ Min
ILIM (Typ) (mA) =
For a particular ILIM(min) value, RSET can be calculated from below formula: RSET (K ) = 23764 ILIM (Min) (mA) + 25 + 4700 ILIM (Min) (mA)
240 34 42 50 58 66 74 82
RSET (KOhms)
Figure 23. ILIM vs RSET
Input Capacitor
To limit the voltage drop on the input supply caused by transient in-rush currents when the switch is turned on into a discharged load capacitor or a short-circuit, a capacitor is recommended to be placed between VIN and GND. A 1uF ceramic capacitor, CIN, placed close to the pins is usually sufficient. Higher values of CIN can be used to further reduce the voltage drop.
FPF222X family has 5% precision at higher load current. The ILIM (Max) and tolerance of current limit value can be determined using Figure 23 (ILIM vs RSET ) and the following formula:
Tolerance (%) = 100 *
ILIM (Typ) - ILIM (Min) ILIM (Typ) ILIM (Typ) * Tolerance (%) 100
Output Capacitor
A 0.1uF capacitor COUT, should be placed between VOUT and GND. This capacitor will prevent parasitic board inductances from forcing VOUT below GND when the switch turns-off. For the FPF2223 and FPF2224, the total output capacitance needs to be kept below a maximum value, COUT(max), to prevent the part from registering an over-current condition and turning-off the switch. The maximum output capacitance can be determined from the following formula: COUT (Max) = ILIM (Max) * tBLANK (Min) VIN
ILIM (Max) =
ILIM (Typ) +
The table and figure below can be used to select RSET: RSET [k ] 36.0 37.5 39.0 40.2 42.2 44.2 49.0 51.1 54.9 61.9 69.8 80.9 Min. Current Limit [mA] 627.0 600.9 576.2 557.7 529.3 503.3 449.5 429.1 396.0 345.3 299.8 250.0 Typ. Current Limit [mA] 660.0 633.7 609.3 591.1 563.1 537.6 485.0 465.0 432.9 383.9 340.5 293.7 Max. Current Limit [mA] 693.0 666.5 642.5 624.5 597.0 572.0 520.4 501.0 469.7 422.5 381.1 337.5 Tol [%] 5.0 5.2 5.4 5.7 6.0 6.4 7.3 7.7 8.5 10.1 11.9 14.9
Power Dissipation
During normal on-state operation, the power dissipated in the device will depend upon the level at which the current limit is set. The maximum allowed setting for the current limit is 625mA and will result in a power dissipation of: P = (ILIM)2 * RDS = (0.625)2 * 0.165 = 64mW If the part goes into current limit, maximum power dissipation will occur when the output is shorted to ground. For the FPF2223, the power dissipation will be scaled by the AutoRestart Time, tRSTRT, and the Over Current Blanking Time, tBLANK. Therefore, the maximum power dissipated is: P (Max) = tBLANK tBLANK + tRSTRT 30 30 + 450 * VIN (Max) * ILIM (Max)
Table 1: RSET Selection Guide =
* 5.5 * 0.693 = 0.238W
FPF2223-FPF2225 Rev. B
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FPF2223-FPF2225 Integrated Load Switch with Adjustable High Precision Current Limit
Take note that this is below the maximum package power dissipation, and the thermal shutdown feature will act as additional safety to protect the part from damage due to excessive heating. The junction temperature is only able to increase to the thermal shutdown threshold. Once this temperature has been reached, toggling ON will not turn-on the switch until the junction temperature drops. For the FPF2225, a short on the output will cause the part to operate in a constant current state dissipating a worst case power of: P (Max) = VIN (MAX) * ILIM (MAX) = 5.5 * 0.693 = 3.8W This large amount of power will activate the thermal shutdown and the part will cycle in and out of thermal shutdown so long as the ON pin is active and the short is present.
The following techniques have been identified to improve the thermal performance of this family of devices. These techniques are listed in order of the significance of their impact. 1. Thermal performance of the load switch can be improved by connecting pin7 of the DAP (Die Attach Pad) to the GND plane of the PCB. 2. Embedding two exposed through-hole vias into the DAP (pin7) provides a path for heat to transfer to the back GND plane of the PCB. A drill size of Round, 14 mils (0.35mm) with 1-ounce copper plating is recommended to result in appropriate solder reflow. A smaller size hole prevents the solder from penetrating into the via, resulting in device lift-up. Similarly, a larger via-hole consumes excessive solder, and may result in voiding of the DAP.
PCB Layout Recommendations
In order to benefit from adjustable, high-precision load switch devices, a high-precision RSET value must be used to set a tight current limit tolerance. Since ILIMIT (current limit value) is determined by the voltage drop across the RSET, a poor PCB layout can introduce parasitic noise on the ISET pin resulting in a minor variation of ILIMIT. To improve the ILIMIT stability, parasitic noise coupling mechanisms from ISET to GND must be minimized. This becomes more critical when ILIMIT is set close to the nominal load current operation where parasitic effects could cause the device to go in and out of current limit and result in an error flag report. Care must be taken to provide a direct current return path between the RSET ground pad and the device ground pad (pin5). Please see current pad #2 in figure below. Figure 25: Two through hole open vias embedded in DAP
1)Power current path 2)RSET current path Figure 24: Eliminate parasitic noise of ISET-GND by providing a separate ground route, unique from the power ground plane
Figure 26: X-Ray result (bottom view with 45o angle) 3. The VIN, VOUT and GND pins will dissipate most of the heat generated during a high load current condition. Using wide traces will help minimize parasitic electrical effects along with minimizing the case to ambient thermal impedance. The layout suggested in Figure 27 provides each pin with adequate copper so that heat may be transferred as efficiently as possible out of the device. The low-power FLAGB and ON pin traces may be laid-out diagonally from the device to maximize the area available to the ground pad. Placing the input and output capacitors as close to the device as possible also contributes to heat dissipation, particularly during high load currents.
Improving Thermal Performance
An improper layout could result in higher junction temperature and triggering the thermal shutdown protection feature. This concern applies when the switch is set at higher current limit value and an over-current condition occurs. In this case, the power dissipation of the switch, from the formula below, could exceed the maximum absolute power dissipation of 1.2W. PD = (VIN - VOUT) x ILIM (Max)
FPF2223-FPF2225 Rev. B
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FPF2223-FPF2225 Integrated Load Switch with Adjustable High Precision Current Limit
Figure 30: Zoom in to Top layer Figure 27: Proper layout of output and ground copper area
FPF22XX Demo board has components and circuitry to demonstrate FPF2223/4/5 load switches functions and features. R4 resistor with 0 value is used for measuring the output current. Load current can be scoped by removing the R4 resistor and soldering a current loop to the R4 footprint. Thermal performance of the board is improved using a few techniques recommended in the layout recommendations section of datasheet.
FPF22XX Demo Board
Figure 28: Top, SST, and AST Layers
Figure 29: Bottom and ASB Layers
FPF2223-FPF2225 Rev. B
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FPF2223-FPF2225 Integrated Load Switch with Adjustable High Precision Current Limit
Dimensional Outline and Pad Layout
FPF2223-FPF2225 Rev. B
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FPF2223-FPF2225 Integrated Load Switch with Adjustable High Precision Current Limit
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* EZSWITCHTM and FlashWriter(R) are trademarks of System General Corporation, used under license by Fairchild Semiconducntor. DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD'S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Preliminary Product Status Formative or In Design First Production Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. I33
No Identification Needed
Full Production
Obsolete
Not In Production
FPF2223-FPF2225 Rev. B
14
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