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| Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet Specification MWT801-S SSC Drawn Ap val pro i Ap val pro Rev. 00 November 2007 www.ZLED.com 1/4-1/2AoE : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet MWT801-S 1. Feat es ur 2. Absolute M aximu Ratings m 3. Electr Char ct o a eristic s 4. 6. 7. 8. 9. Optical charact eristics Outline Dimension Packing Soldering Precautio n for use 5. CIE Chromati Diagra city m 10. Handling of Silicone Re sin LEDs Rev. 00 November 2007 www.ZLED.com 1/4-1/2AoE : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet MWT801-S Description This surface-mount LED comes in PLCC standard package dimension. It has a substrate made up a molded of plastic reflector si g on top ttin of a bent ead frame. The die s l i attached within the reflector cavity and the cavity is encapsulated by epoxy or silicone The package de sign coupled with careful selection of component mate s allow rial these products to perform with high reliability in a larger temperature range -40E to 100E . The high reliability feature s crucial to Automotive i interior and Indoor ESS. cAo MWT801-S Features * Industry Standard PLCC SMT package * High brightness using AlInGaP and InGaN dice technologies * Available in multiple colors * High volume, high reliability Applications * Interior automotive * Electronic Signs and Signals * Office Automation, Electrical Appliances, Industrial Equipment Rev. 09 December 2006 www.ZLED.com 1/4-1/2AoE : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 1. Features * White col o red SMT package * Mate rial InGaN/SiC * Suitabl e for al l SMT as s e mbly methods Suitabl e for al l soldering methods * RoHS Compliant Rev. 00 November 2007 www.ZLED.com 1/4-1/2AoE : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 2. Absolute maximum ratings Parameter Power Dissipation Forward Current Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature Symbol Value 12 0 30 90 5 -40 ~ +1 10 Unit mW mA mA V oC oC Pd IF IFM *2 VR T opr T stg -40 ~ 1 10 + *1 Care is to b e tak e n that p o wer d issip a tio n do es no t ex cee d th e ab sol ute maximum ra ting of the prod uc t. *2 IFM was meas ured at TW A 1msec of p uls e width and D A 1/10 o f d uty r a tio. 3. Electric characteristics Parame te r Rank A Rank B Forward Voltage Rank C Rank D Re ve rse C urre nt Rank P Luminous Intensity*1 Rank O Rank N Viewing Angle *2 Sy mbol Condition Min 3.7 3.3 3.0 2.7 900 700 500 - Typ 120 Max 4.0 3.7 3.3 3.0 50 1200 900 700 - Unit V V V V i A mc d mc d mc d deg. VF VF VF VF IR IV IV IV 2 IF =2 0 mA IF =2 0 mA IF =2 0 mA IF =2 0 mA VR=5V IF =2 0 mA IF =2 0 mA IF2 0 mA = I 2 0 mA F= *1. he l umino us inte nsit y IVw as m e as ured at the p e ak o f the s p atial patte rn w hich may not be al igned with the mec hanical ax is of T the LED p ack ag e. L umino us Inte nsit y Meas urement allo wance is 3/4 10 % *2. 2 1/2 si t h e o f ax -f si w h er t h e l u m i on u s tni e tisn y si /1 2 o f t h e p e ak in tensiy. Rev. 00 November 2007 www.ZLED.com 1/4-1/2AoE : SSC-QP-7-07-24 (Rev.00) Relative Luminous Intensity [%] Forward Current IF [mA] Forward Current IF [mA] Relative Optical Intensity 0.328 0.328 0.6 0.324 0.324 0.320 0.320 0.4 0.316 0.2 0.316 0.312 0.0 20 40 60 80 100 120 0.312 0.308 -200 0 200 400 600 800 1000 Ambient Temperature Measurement Time [hr] Rev. 00 0.308 1200 November 2007 www.ZLED.com 1/4-1/2AoE : SSC-QP-7-07-24 (Rev.00) CIE (y) Coordinate 0.8 CIE (x) Coordinate Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 4. Optical characteristics Forward Current vs. Forward Voltage 10 2 Relative Luminous Intensity vs Forward Current 140 (Ta=25 OC ) (Ta=25 OC ) 120 100 80 10 1 60 40 20 10 0 0 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 0 5 10 15 20 25 30 35 Forward Voltage VF (V) Forward Current IF [mA] Forward Current Derating Curve 40 Radiation Diagram (Ta=25 OC ) 0 30 -30 20 30 -60 10 60 0 -40 -20 0 20 40 60 80 100 120 -90 90 Ambient Temperature TA [OC] Luminous Intensity vs. Ambient Temperature 1.0 Color Coordinate Variation By Time 0.336 0.336 IF=20mA B 0.332 x coordinate y coordinate 0.332 CIE (y) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 5. CIE Chromaticity Diagram 0.9 0.8 0.7 505 515 510 520 525 530 535 540 545 550 555 560 500 565 570 575 580 585 590 595 600 610 620 630 830 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0.0 495 490 485 480 475 470 460 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 CI E(x) Rev. 00 November 2007 www.ZLED.com 1/4-1/2AoE : SSC-QP-7-07-24 (Rev.00) CIE Coord. (Y) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 0.40 0.38 0.36 0.34 0.32 g d c f e a b h 0.30 0.28 0.26 0.24 0.22 0.24 0.26 0.28 0.30 0.32 0.34 0.36 0.38 CIE Coord. (X) U COLRO AKN R a x 0.264 0.272 0.287 0.283 e x 0.296 0.311 0.307 0.287 y 0.276 0.294 0.315 0.295 x 0.311 0.330 0.330 0.307 y 0.267 0.258 0.296 0.305 x 0.272 0.280 0.296 0.287 f y 0.294 0.318 0.339 0.315 x 0.330 0.330 0.358 0.361 0.0 1 b y 0.258 0.248 0.276 0.295 x 0.283 0.287 0.307 0.304 g y 0.360 0.339 0.368 0.385 x 0.330 0.330 0.358 0.356 c y 0.305 0.295 0.315 0.330 x 0.307 0.330 0.330 0.304 h y 0.318 0.339 0.368 0.351 d y 0.315 0.339 0.360 0.330 * Meas urem ent Uncert aint y o f the Co lo r Co o rd inat e s : 3/4 Rev. 00 November 2007 www.ZLED.com 1/4-1/2AoE : SSC-QP-7-07-24 (Rev.00) Cath ode Cath ode Mark 2. 2 ( Tolerance: 3/4 0.2, Unit: mm ) 7. packing 1.750.1 2 .0 0 .0 5 4 .0 0 .1 1 .5 5 0 .0 5 0 .2 2 0 .0 5 3.50.1 80.1 5 1 .0 0 .1 3 .1 0 .1 8 3.830.1 2 .2 2 0 .1 11.4 0.1 180 +0 -3 2.0 0.2 LABLE 13 0.2 9.0 0.3 30 10 22 (1) Quan tity : 20 00pcs /Reel (2) Cumulative To lera nce : C umula tive Tol e rance/10 pitches to be 0.2mm 3/4 (3) Adhesion S tre ng th o f Co ver Tape : Adhesion s tre ng th t o b e 0. 1- 0.7 N when the cover t a p e is turne d o ff fro m the c a rrier t a pe at the an gle o f 10 to t he carrier t a p e (4) Pack age : P/N, Manu fac turing d a ta Co de No. an d qu an tity to b e indicated on a d a mp pro o f Pa ck age 60 1. 8 Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 6.outline dimension R ecom ended Solder P rn m atte 2. 8 2. 2 0. 15 0. 8 1. 9 0. 8 An ode 1. 8 1. 6 3. 2 2. 4 1. 6 Rev. 00 November 2007 www.ZLED.com 1/4-1/2AoE : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet U R eel Packing Structure Reel QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. HUMIDITY INDICATOR DESI PAK Aluminum Vinyl Bag QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. Outer Box Structure Material : Paper(SW3B(B)) SIZE (mm) TYPE a c b 7inch 245 220 142 1 SIDE c QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : SEOUL SEMICONDUCTOR CO., LTD. RoHS 1 b a Rev. 00 November 2007 www.ZLED.com 1/4-1/2AoE : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 8. soldering (1) Lead Solder Lead Solder Lead Solder Pre-heat Pre-heat time Peak-Tempera re tu Sold ering time Cond ition 120 150E ~ 120 sec. Max. 240 Max E . 10 s ec. Max. 2.5~5 C / sec. 2.5~5 o C / sec. 240 oC Max. 10 sec. Max. 60sec. Max. Above 200 oC Pre-heating 120~150 oC 120sec. Max. (2) Lead-Free Solder Lead-frame Solder Lead F ree Solder Pre-heat Pre-heat time Peak-Tempera re tu Sold ering time Cond ition 150 200E ~ 120 sec. Max. 260 Max E . 10 s ec. Max. 1~5 o C / sec. 1~5 o C / sec. 260 oC Max. 10 sec. Max. 60sec. Max. Above 220 oC Pre-heating 150~200 o C 120sec. Max. (3) Hand Soldering conditions Do not exceed 4 seconds at maximum 315C under soldering iron. (4) The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resign should be used. Note : In case that the soldered products are reused in soldering process, we don't guarantee the products. Rev. 00 November 2007 www.ZLED.com 1/4-1/2AoE : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 9. precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desicator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5C ~30C Humidity : maximum 70%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; Keeping of a fraction Temperature : 5 ~ 40C Humidity : less than 10% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 603/4 5C. (4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ray design is not considered for the products. (8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (10) The LEDs must be soldered within seven days after opening the moisture-proof packing. (11) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (12) The appearance and specifications of the product may be modified for improvement without notice. Rev. 00 November 2007 www.ZLED.com 1/4-1/2AoE : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Z-Power LED X10490 Technical Data Sheet 10. Handling of Silicone Resin LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED's reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. Rev. 00 November 2007 www.ZLED.com 1/4-1/2AoE : SSC-QP-7-07-24 (Rev.00) |
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