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HD74HC174 Hex D-type Flip-Flops (with Clear) REJ03D0584-0300 Rev.3.00 Jan 31, 2006 Description This device contains 6 master-slave flip-flops with a common clock and common clear. Data on the D input having the specified setup and hold times is transferred to the Q output on the low to high transition of the clock input. The clear input when low, sets all outputs to a low state. Features * * * * * * High Speed Operation: tpd (Clock to Q) = 15 ns typ (CL = 50 pF) High Output Current: Fanout of 10 LSTTL Loads Wide Operating Voltage: VCC = 2 to 6 V Low Input Current: 1 A max Low Quiescent Supply Current: ICC (static) = 4 A max (Ta = 25C) Ordering Information Part Name HD74HC174P HD74HC174FPEL Package Type DILP-16 pin SOP-16 pin (JEITA) Package Code (Previous Code) PRDP0016AE-B (DP-16FV) Package Abbreviation P -- EL (2,000 pcs/reel) ELL (2,000 pcs/reel) Taping Abbreviation (Quantity) PRSP0016DH-B FP (FP-16DAV) PTSP0016JB-A HD74HC174TELL TSSOP-16 pin T (TTP-16DAV) Note: Please consult the sales office for the above package availability. Function Table Clear L H H H H High level Low level Irrelevant Inputs Clock X D X H L X X Output Q L H L no change no change L H: L: X: Rev.3.00, Jan 31, 2006 page 1 of 7 HD74HC174 Pin Arrangement Clear 1 1Q 2 1D 3 2D 4 2Q 5 3D 6 3Q 7 GND 8 (Top view) Q CLR D CK Q CLR CK D 16 VCC 15 6Q 14 6D 13 5D 12 5Q 11 4D 10 4Q 9 Clock D CK CLR Q CK D CLR Q D CK CLR Q CK D CLR Q Logic Diagram Clock 1D Clear CK 2D D CL Q 2Q CK D CL 1Q Q CK 3D D CL Q 3Q CK 4D D CL Q 4Q CK 5D D CL Q 5Q CK 6D D CL Q 6Q Rev.3.00, Jan 31, 2006 page 2 of 7 HD74HC174 Absolute Maximum Ratings Item Supply voltage range Input / Output voltage Input / Output diode current Output current VCC, GND current Power dissipation Storage temperature Symbol VCC Vin, Vout IIK, IOK IO ICC or IGND PT Tstg Ratings -0.5 to 7.0 -0.5 to VCC +0.5 20 25 50 500 -65 to +150 Unit V V mA mA mA mW C Note: The absolute maximum ratings are values, which must not individually be exceeded, and furthermore, no two of which may be realized at the same time. Recommended Operating Conditions Item Supply voltage Input / Output voltage Operating temperature Input rise / fall time*1 Note: Symbol VCC VIN, VOUT Ta tr, tf Ratings 2 to 6 0 to VCC -40 to 85 0 to 1000 0 to 500 0 to 400 1. This item guarantees maximum limit when one input switches. Waveform: Refer to test circuit of switching characteristics. Unit V V C ns Conditions VCC = 2.0 V VCC = 4.5 V VCC = 6.0 V Electrical Characteristics Item Input voltage Symbol VCC (V) VIH 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 4.5 6.0 2.0 4.5 6.0 4.5 6.0 6.0 6.0 Min 1.5 3.15 4.2 -- -- -- 1.9 4.4 5.9 4.18 5.68 -- -- -- -- -- -- -- Ta = 25C Typ Max -- -- -- -- -- -- 2.0 4.5 6.0 -- -- 0.0 0.0 0.0 -- -- -- -- -- -- -- 0.5 1.35 1.8 -- -- -- -- -- 0.1 0.1 0.1 0.26 0.26 0.1 4.0 Ta = -40 to+85C Unit Min Max 1.5 3.15 4.2 -- -- -- 1.9 4.4 5.9 4.13 5.63 -- -- -- -- -- -- -- -- -- -- 0.5 1.35 1.8 -- -- -- -- -- 0.1 0.1 0.1 0.33 0.33 1.0 40 V Test Conditions VIL V Output voltage VOH V Vin = VIH or VIL IOH = -20 A VOL V Vin = VIH or VIL IOH = -4 mA IOH = -5.2 mA IOL = 20 A Input current Quiescent supply current Iin ICC IOL = 4 mA IOL = 5.2 mA A Vin = VCC or GND A Vin = VCC or GND, Iout = 0 A Rev.3.00, Jan 31, 2006 page 3 of 7 HD74HC174 Switching Characteristics (CL = 50 pF, Input tr = tf = 6 ns) Item Maximum clock frequency Propagation delay time Symbol VCC (V) fmax 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 2.0 4.5 6.0 -- Ta = 25C Ta = -40 to +85C Unit Min Typ Max Min Max -- -- -- -- -- -- -- -- -- 100 20 17 5 5 5 25 5 4 80 16 14 -- -- -- -- -- -- -- -- 15 -- -- 17 -- -- 3 - -- 0 -- -- -1 -- -- 6 -- -- 5 -- 5 6 30 35 160 32 27 160 32 27 -- -- -- -- -- -- -- -- -- -- -- -- 75 15 13 10 -- -- -- -- -- -- -- -- -- 125 25 21 5 5 5 31 6 5 100 20 17 -- -- -- -- 5 24 28 200 40 34 200 40 34 -- -- -- -- -- -- -- -- -- -- -- -- 95 19 16 10 MHz Test Conditions tPLH, tPHL ns Clock to Q ns Clear to Q Setup time tsu ns Data to Clock Hold time th ns Clock to Data Removal time trem ns Clear to Clock Pulse width tw ns Clock, Clear Output rise/fall time Input capacitance tTLH, tTHL ns Cin pF Test Circuit Measurement point CL* Note: CL includes the probe and fig capacitance. Rev.3.00, Jan 31, 2006 page 4 of 7 HD74HC174 Waveforms * Waveform - 1 tr 90 % 90 % 50 % 10 % 50 % tf VCC 0V th Data 10 % 50 % t su tr th tf 90 % t su VCC 50 % 10 % Clock 10 % 50 % 50 % 0V t PHL 90 % 50 % 10 % tw t PLH 90 % tw VOH VOL Q 50 % 10 % t TLH t THL * Waveform - 2 90 % 50 % 10 % tf tr 90 % 50 % 10 % tw t rem t w(clock) 90 % 90 % 50 % 50 % 10 % t PHL tf t r t PLH 90 % 50 % 10 % t THL 50 % 10 % t TLH VOH VOL VCC 0V VCC 0V Clear Clock Q 90 % Note : Clock Input : PRR 1 MHz, Zo = 50 , tr 6 ns, tf 6 ns Data Input : PRR 500 kHz Rev.3.00, Jan 31, 2006 page 5 of 7 HD74HC174 Package Dimensions JEITA Package Code P-DIP16-6.3x19.2-2.54 RENESAS Code PRDP0016AE-B Previous Code DP-16FV MASS[Typ.] 1.05g D 16 9 1 0.89 b3 8 Z E A1 A Reference Symbol Dimension in Millimeters Min Nom 7.62 19.2 6.3 20.32 7.4 5.06 0.51 0.40 0.48 1.30 0.19 0 2.29 2.54 0.25 0.31 15 2.79 1.12 2.54 0.56 Max e D E L 1 A A1 e bp e1 b c b c p 3 e Z ( Ni/Pd/Au plating ) L JEITA Package Code P-SOP16-5.5x10.06-1.27 RENESAS Code PRSP0016DH-B Previous Code FP-16DAV MASS[Typ.] 0.24g *1 D F 9 16 NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. bp HE E Index mark Reference Symbol *2 c Dimension in Millimeters Min Nom 10.06 5.50 Max 10.5 Terminal cross section ( Ni/Pd/Au plating ) 1 Z e *3 D E A2 8 bp x M L1 A1 A bp b1 c 0.00 0.10 0.20 2.20 0.34 0.40 0.46 0.15 1 0.20 0.25 A c HE 0 7.50 7.80 1.27 8 8.00 A1 y L e x y 0.12 0.15 0.80 0.50 1 Detail F Z L L 0.70 1.15 0.90 Rev.3.00, Jan 31, 2006 page 6 of 7 HD74HC174 JEITA Package Code P-TSSOP16-4.4x5-0.65 RENESAS Code PTSP0016JB-A Previous Code TTP-16DAV MASS[Typ.] 0.05g *1 D F NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. 16 9 bp *2 HE E c Reference Symbol Dimension in Millimeters Min Nom 5.0 4.40 Max 5.3 Index mark Terminal cross section ( Ni/Pd/Au plating ) D E A2 A1 0.03 0.07 0.10 1.10 1 Z e *3 8 bp L1 x M A bp b1 c c 1 0.15 0.20 0.25 0.10 0.15 0.20 A HE 0 6.20 6.40 0.65 8 6.60 A1 L e x y 0.13 0.10 0.65 0.4 1 y Detail F Z L L 0.5 1.0 0.6 Rev.3.00, Jan 31, 2006 page 7 of 7 Sales Strategic Planning Div. Keep safety first in your circuit designs! Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials. 3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein. The information described here may contain technical inaccuracies or typographical errors. Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors. Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com). 4. 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