View EMIF04-MMC02F208_4279579.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

EMIF04-MMC02F2
4-line IPADTM, EMI filter including ESD protection
Features

EMI symmetrical (I/O) low-pass filter High efficiency in EMI filtering Lead-free package Very low PCB space occupation: 1.57 mm x 2.07 mm Very thin package: 0.65 mm High efficiency in ESD suppression High reliability offered by monolithic integration High reduction of parasitic elements through integration and wafer level packaging Figure 1. Pin layout (bump side)
3
I1
Flip Chip 11 bumps
2
O1
1 A
O2
Complies with the standards:
IEC 61000-4-2 Level 4 - 15 kV (air discharge) - 8 kV (contact discharge)
I2
VD2
B C D
I3
VD1
O3
Application
Where EMI filtering in ESD sensitive equipment is required:
I4
GND
O4
Figure 2.
Device configuration
VD2 VD1
MultiMediaCard for mobile phones, personal digital assistant, digital camera, MP3 players...
R1 I1 I2 I3 R2 R3
R20
R10 O1 (Data) O2 (CLK) O3 (CMD) O4
Description
The EMIF04-MMC02 is a highly integrated device designed to suppress EMI/RFI noise for a MultiMediaCard port. The EMIF04 Flip Chip packaging means the package size is equal to the die size. This filter includes ESD protection circuitry, which prevents damage to the application when it is subjected to ESD surges up to 15 kV.
I4 R4
Cline = 20pF max.
GND
TM: IPAD is a trademark of STMicroelectronics.
April 2008
Rev 4
1/8
www.st.com 8
Electrical characteristics
EMIF04-MMC02F2
1
Electrical characteristics
Table 1.
Symbol PR Tj Top Tstg DC power per resistor Junction temperature Operating temperature range Storage temperature range
Absolute maximum ratings (Tamb = 25 C)
Parameter Value 70 125 -40 to + 85 -55 to +150 Unit mW C C C
Table 2.
Symbol VBR IRM VRM VCL Rd IPP RI/O Cline Symbol VBR IRM Cline
\
Electrical characteristics (Tamb = 25 C)
Parameters Breakdown voltage Leakage current @ VRM Stand-off voltage Clamping voltage Dynamic impedance Peak pulse current Series resistance between input and output Input capacitance per line Test conditions IR = 1 mA VRM = 3 V @0V 47 13 56 Min 6 0.1 0.5 20 Typ Max Unit V A pF k k
R1,R2,R3,R4 Tolerance 5% R10 R20 Tolerance 5% Tolerance 5%
2/8
EMIF04-MMC02F2
Electrical characteristics
Figure 3.
S21 (dB) attenuation measurement Figure 4. and Aplac simulation
EMIF04-MMC02F2: Aplac vs measurement (C3/C1 line)
Cross talk measurement
Xtalk measurements C3/B1
0.00 dB - 5.00 - 10.00
Simulation
0.00 dB -10.00 -20.00
- 15.00 - 20.00 - 25.00 - 30.00 - 35.00
Measurement
-30.00 -40.00 -50.00 -60.00
- 40.00 - 45.00 - 50.00 1.0M 3.0M 10.0M 30.0M 100.0M f/Hz 300.0M 1.0G 3.0G
-70.00 -80.00 1.0M
3.0M
10.0M
30.0M
100.0M 300.0M f/Hz
1.0G
3.0G
Figure 5.
ESD response to IEC 61000-4-2 (+15kV contact discharge) on one input (Vin) and one output (Vout)
Figure 6.
ESD response to IEC 61000-4-2 (-15kV contact discharge) on one input (Vin) and one output (Vout)
Vin
Vin
Vout
Vout
Figure 7.
Junction capacitance versus reverse applied voltage typical values
C(pF)
20 18 16 14 12 10 8 6 4 2 0 0.0 0.5 1.0 1.5 2.0 VR(V) 2.5 3.0 3.5 4.0
F=1MHz Vosc=30mVRMS Tj=25C
3/8
Application information
EMIF04-MMC02F2
2
Application information
Figure 8. Device structure
B22 C22
R20 R1 A33 R2 B33 C33 D33 MODEL = demif04 R3 R4
R10 A22 B11 C11 D11 MODEL = demif04
bulk
MODEL = demif04_gnd
D2
Model demif04 BV = 7 IBV = 1m CJO = Cz M = 0.3333 RS = 1 VJ = 0.6 TT = 100n
Model demif04 gnd BV = 7 IBV = 1m CJO = Cz_gnd M = 0.3333 RS = RS_gnd VJ = 0.6 TT = 100n
Figure 9.
Aplac model connections
Rbump Lbump
D2
Rbump Lbump A33 A2 A22
A3
+
Cbump Rbump
Lbump Rbump Lbump B3
bulk
+
Cbump Rbump
Rbump Lbump
bulk
Rbump Lbump B22 B1 B11
B33
B2
+
Rbump Cbump Rbump Rbump Lbump C3
bulk
+
Cbump Rbump Rbump Lbump
bulk
+
Cbump Rbump Rbump Lbump
Device aplacvar R1 50.053 aplacvar R2 50.053 aplacvar R3 50.053 aplacvar R4 50.053 aplacvar R10 13 k aplacvar R20 56 k aplacvar Rsub 120 m Diodes aplacvar Cz 14.9pF aplacvar Cz_gnd 47.9pF aplacvar Rs_gnd 480 m Bumps aplacvar Rbump 20 m aplacvar Lbump 50 pH aplacvar Cbump 1.5 p Gnd aplacvar Lgnd 95 pH aplacvar Rgnd 100 m aplacvar Cgnd 0.6 pF
bulk
C33
C2
C22
C1
C11
+
Lgnd Cgnd D3 Rgnd Cbump Rbump Rbump Lbump
bulk
+
Cbump Rbump
bulk
+
Cbump Rbump Rbump Lbump D1
bulk
D33
D11
+
Cbump Rbump
bulk
+
Cbump Rbump
bulk
4/8
EMIF04-MMC02F2
Ordering information scheme
3
Ordering information scheme
Figure 10. Ordering information scheme
EMIF
EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version Package F = Flip Chip x = 2: Lead-free, pitch = 500 m, bump = 315 m
yy
-
xxx zz
Fx
4
Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com. Figure 11. Flip Chip dimensions
500 m 50 315 m 50 650 m 65
500 m 50
285 m
1.57mm 50 m
285 m
2.07mm 50 m
5/8
Ordering information
EMIF04-MMC02F2
Figure 12. Footprint
Copper pad Diameter: 250 m recommended, 300 m max
Figure 13. Marking
Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week)
E
Solder stencil opening: 330 m
Solder mask opening recommendation: 340 m min for 315 m copper pad diameter
xxz y ww
Figure 14. Flip Chip tape and reel specification
Dot identifying Pin A1 location 4 0.1 O 1.5 0.1
1.75 0.1 3.5 0.1
2.17
0.73 0.05
All dimensions in mm
8 0.3
ST E
ST E
ST E
xxz yww
User direction of unreeling
xxz yww
xxz yww
4 0.1
1.67
5
Ordering information
Table 3. Ordering information
Marking FH Package Flip Chip Weight 4.5 mg Base qty 5000 Delivery mode Tape and reel (7")
Order code EMIF04-MMC02F2
Note:
More packing information is available in the applications note: AN1235: "Flip Chip: package description and recommendations for use" AN 1751: "EMI filters: Recomendations and measurements"
6/8
EMIF04-MMC02F2
Revision history
6
Revision history
Table 4.
Date 14-Oct-2004 06-Apr-2005 25-Aug-2005 28-Apr-2008
Document revision history
Revision 1 2 3 4 First issue Minor layout update. No content change. Reformatted to current standard, Aplac model updated in section 2. Updated ECOPACK statement. Updated Figure 10, Figure 11 and Figure 14. Reformatted to current standards. Changes
7/8
EMIF04-MMC02F2
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
(c) 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com
8/8

▲Up To Search▲

Price & Availability of EMIF04-MMC02F208

	To Download EMIF04-MMC02F208 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .