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PD - 97321
HEXFET(R) Power MOSFET plus Schottky Diode
l l l l l l l l l l l
IRF6795MPBF IRF6795MTRPbF
RoHs Compliant Containing No Lead and Bromide VDSS VGS RDS(on) RDS(on) Integrated Monolithic Schottky Diode 25V max 20V max 1.4m@ 10V 2.4m@ 4.5V Low Profile (<0.7 mm) Dual Sided Cooling Compatible Qg tot Qgd Qgs2 Qrr Qoss Vgs(th) Ultra Low Package Inductance 35nC 10nC 4.8nC 34nC 27nC 1.8V Optimized for High Frequency Switching Ideal for CPU Core DC-DC Converters Optimized for Sync. FET socket of Sync. Buck Converter Low Conduction and Switching Losses Compatible with existing Surface Mount Techniques 100% Rg tested DirectFET ISOMETRIC MX
SQ SX ST MQ MX MT MP
Typical values (unless otherwise specified)
Applicable DirectFET Outline and Substrate Outline (see p.7,8 for details)
Description
The IRF6795MPBF combines the latest HEXFET(R) Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a SO-8 and only 0.7 mm profile. The DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques. Application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%. The IRF6795MPBF balances industry leading on-state resistance while minimizing gate charge along with ultra low package inductance to reduce both conduction and switching losses. This part contains an integrated Schottky diode to reduce the Qrr of the body drain diode further reducing the losses in a Synchronous Buck circuit. The reduced losses make this product ideal for high frequency/high efficiency DC-DC converters that power high current loads such as the latest generation of microprocessors. The IRF6795MPBF has been optimized for parameters that are critical in synchronous buck converter's Sync FET sockets.
Absolute Maximum Ratings
Parameter
VDS VGS ID @ TA = 25C ID @ TA = 70C ID @ TC = 25C IDM EAS IAR
6
Typical RDS(on) (m)
Max.
25 20 32 25 160 250 190 25
VGS, Gate-to-Source Voltage (V)
Units
V
Drain-to-Source Voltage Gate-to-Source Voltage Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS Pulsed Drain Current
g
e e @ 10V f h
14.0 12.0 10.0 8.0 6.0 4.0 2.0 0.0 0 10 20 30 ID= 25A
A
Single Pulse Avalanche Energy Avalanche CurrentAg
ID = 32A 5 4 3 T J = 125C 2 T J = 25C 1 0 2 4 6 8 10 12 14 16 18
mJ A
VDS= 20V VDS= 13V
20
40
50
60
70
80
90
VGS, Gate -to -Source Voltage (V) Fig 1. Typical On-Resistance vs. Gate Voltage Notes: Click on this section to link to the appropriate technical paper. Click on this section to link to the DirectFET Website. Surface mounted on 1 in. square Cu board, steady state.
Q G Total Gate Charge (nC)
Fig 2. Typical Total Gate Charge vs. Gate-to-Source Voltage
TC measured with thermocouple mounted to top (Drain) of part. Repetitive rating; pulse width limited by max. junction temperature. Starting TJ = 25C, L = 0.60mH, RG = 25, IAS = 25A.
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05/27/08
IRF6795MTRPbF
Static @ TJ = 25C (unless otherwise specified)
Parameter
BVDSS VDSS/TJ RDS(on) VGS(th) VGS(th)/TJ IDSS IGSS gfs Qg Qgs1 Qgs2 Qgd Qgodr Qsw Qoss RG td(on) tr td(off) tf Ciss Coss Crss Drain-to-Source Breakdown Voltage Breakdown Voltage Temp. Coefficient Static Drain-to-Source On-Resistance Gate Threshold Voltage Gate Threshold Voltage Coefficient Drain-to-Source Leakage Current Gate-to-Source Forward Leakage Gate-to-Source Reverse Leakage Forward Transconductance Total Gate Charge Pre-Vth Gate-to-Source Charge Post-Vth Gate-to-Source Charge Gate-to-Drain Charge Gate Charge Overdrive Switch Charge (Qgs2 + Qgd) Output Charge Gate Resistance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance
Min.
25 --- --- --- 1.35 --- --- --- --- --- 100 --- --- --- --- --- --- --- --- --- --- --- --- --- --- ---
Typ. Max. Units
--- 11 1.4 2.4 1.8 -4.2 --- --- --- --- --- 35 8.8 4.8 10 11 14.8 27 1.3 16 27 16 11 4280 1280 550 --- --- 1.8 3.2 2.35 --- 500 5.0 100 -100 --- 53 --- --- --- --- --- --- 2.2 --- --- --- --- --- --- --- pF ns nC
Conditions
VGS = 0V, ID = 250A
V mV/C Reference to 25C, ID = 5mA m VGS = 10V, ID = 32A VGS = 4.5V, ID = 25A V
i i
VDS = VGS, ID = 100A
mV/C VDS = VGS, ID = 10mA A VDS = 20V, VGS = 0V mA nA S VDS = 20V, VGS = 0V, TJ = 125C VGS = 20V VGS = -20V VDS = 13V, ID = 25A VDS = 13V nC VGS = 4.5V ID = 25A See Fig. 15 VDS = 16V, VGS = 0V VDD = 13V, VGS = 4.5VAi ID = 25A RG = 1.8 See Fig. 17 VGS = 0V VDS = 13V = 1.0MHz
Diode Characteristics
Parameter
IS ISM VSD trr Qrr Continuous Source Current (Body Diode) Pulsed Source Current (Body Diode)Ag Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge --- --- --- --- 27 34 0.75 41 51 V ns nC --- --- 250
Min.
---
Typ. Max. Units
--- 140 A
Conditions
MOSFET symbol showing the integral reverse p-n junction diode. TJ = 25C, IS = 25A, VGS = 0V TJ = 25C, IF = 25A di/dt = 200A/s
i
i
Notes:
Pulse width 400s; duty cycle 2%.
2
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IRF6795MTRPbF
Absolute Maximum Ratings
PD @TA = 25C PD @TA = 70C PD @TC = 25C TP TJ TSTG
e Power Dissipation e Power Dissipation f
Power Dissipation Operating Junction and
Parameter
Max.
2.8 1.8 75 270 -40 to + 150
Units
W
Peak Soldering Temperature Storage Temperature Range
C
Thermal Resistance
RJA RJA RJA RJC RJ-PCB
el Junction-to-Ambient jl Junction-to-Ambient kl Junction-to-Case fl
Junction-to-Ambient Linear Derating Factor
100 D = 0.50
Thermal Response ( Z thJA )
Parameter
Typ.
--- 12.5 20 --- 1.0 0.022
Max.
45 --- --- 1.66 ---
Units
C/W
Junction-to-PCB Mounted
eA
W/C
10
0.20 0.10 0.05
R1 R1 J J 1 R2 R2 R3 R3 R4 R4 R5 R5 R6 R6 R7 R7 R8 R8
Ri (C/W)
1.64e-02 2.21e-02 2.30e-01
A A 5 6 6 7 7
i (sec)
1.01e-06 6.00e-06 8.20e-05 1.56e-03 3.96e-03 6.48e-03 1.03e+00 3.98e+01
1
0.02 0.01
8.64e-01 1.66e+00 4.90e-01 2.37e+01 1.80e+01
1
2
2
3
3
4
4
5
Ci= i/Ri Ci= i/Ri
0.1 SINGLE PULSE ( THERMAL RESPONSE ) 0.01 1E-006 1E-005 0.0001 0.001 0.01 0.1 1
Notes: 1. Duty Factor D = t1/t2 2. Peak Tj = P dm x Zthja + Tc 10 100
1000
t1 , Rectangular Pulse Duration (sec)
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
(At lower pulse widths ZthJA & ZthJC are combined) Notes: R is measured at TJ of approximately 90C. Used double sided cooling , mounting pad with large heatsink. Mounted on minimum footprint full size board with metalized back and with small clip heatsink.
Surface mounted on 1 in. square Cu (still air).
Mounted to a PCB with small clip heatsink (still air)
Mounted on minimum footprint full size board with metalized back and with small clip heatsink (still air)
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IRF6795MTRPbF
1000
TOP VGS 10V 5.0V 4.5V 3.5V 3.0V 2.7V 2.5V 2.3V
1000
TOP VGS 10V 5.0V 4.5V 3.5V 3.0V 2.7V 2.5V 2.3V
ID, Drain-to-Source Current (A)
100
10
BOTTOM
ID, Drain-to-Source Current (A)
100
BOTTOM
1
10
0.1
2.3V
60s PULSE WIDTH
Tj = 25C 0.01 0.1 1 10 100 VDS, Drain-to-Source Voltage (V) 1 0.1
2.3V
60s PULSE WIDTH
Tj = 150C 1 10 100
V DS, Drain-to-Source Voltage (V)
Fig 4. Typical Output Characteristics
1000 VDS = 15V 60s PULSE WIDTH 100 T J = 150C 10 T J = 25C T J = -40C
2.0
Fig 5. Typical Output Characteristics
ID = 32A
Typical R DS(on) (Normalized)
ID, Drain-to-Source Current (A)
V GS = 10V 1.5 V GS = 4.5V
1.0
1
0.1 1 2 3 4 5
0.5 -60 -40 -20 0 20 40 60 80 100 120 140 160 T J , Junction Temperature (C)
VGS , Gate-to-Source Voltage (V)
Fig 6. Typical Transfer Characteristics
100000
VGS = 0V, f = 1 MHZ Ciss = Cgs + Cgd, C ds SHORTED Crss = Cgd
Fig 7. Normalized On-Resistance vs. Temperature
10 T J = 25C 8
Typical R DS(on) ( m)
Coss = Cds + Cgd
C, Capacitance(pF)
10000 Ciss Coss 1000 Crss
6
Vgs = 3.5V Vgs = 4.0V Vgs = 4.5V Vgs = 5.0V Vgs = 10V
4
2
100 1 10 VDS, Drain-to-Source Voltage (V) 100
0 0 50 100 150 200
ID, Drain Current (A)
Fig 8. Typical Capacitance vs.Drain-to-Source Voltage
Fig 9. Typical On-Resistance vs. Drain Current and Gate Voltage
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IRF6795MTRPbF
1000 1000
OPERATION IN THIS AREA LIMITED BY R (on) DS
ID, Drain-to-Source Current (A)
ISD, Reverse Drain Current (A)
100
100sec
100
10
10msec
1msec
10
1 DC 0.1 T A = 25C T J = 150C Single Pulse
T J = 150C 1 T J = 25C T J = -40C VGS = 0V 0 0.0 0.5 1.0 1.5 2.0 2.5 VSD, Source-to-Drain Voltage (V)
0.01 0.01 0.10 1.00 10.00 100.00 VDS, Drain-to-Source Voltage (V)
Fig 10. Typical Source-Drain Diode Forward Voltage
Typical V GS(th) Gate threshold Voltage (V)
160 140 120
ID, Drain Current (A)
Fig11. Maximum Safe Operating Area
2.5
2.0 ID = 10mA
100 80 60 40 20 0 25 50 75 100 125 150 T C , Case Temperature (C)
1.5
1.0 -75 -50 -25 0 25 50 75 100 125 150 T J , Temperature ( C )
Fig 12. Maximum Drain Current vs. Case Temperature
800
EAS , Single Pulse Avalanche Energy (mJ)
Fig 13. Typical Threshold Voltage vs. Junction Temperature
ID 4.0A 9.2A BOTTOM 25A TOP
600
400
200
0 25 50 75 100 125 150 Starting T J , Junction Temperature (C)
Fig 14. Maximum Avalanche Energy vs. Drain Current
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IRF6795MTRPbF
Id Vds Vgs
L VCC
0
DUT
20K 1K
S
Vgs(th)
Qgodr
Qgd
Qgs2 Qgs1
Fig 15a. Gate Charge Test Circuit
Fig 15b. Gate Charge Waveform
V(BR)DSS
15V
tp
DRIVER
VDS
L
VGS RG
D.U.T
IAS
+ - VDD
A
20V
tp
0.01
I AS
Fig 16b. Unclamped Inductive Waveforms
Fig 16a. Unclamped Inductive Test Circuit
VDS VGS RG
RD
VDS 90%
D.U.T.
+
- V DD
VGS
Pulse Width 1 s Duty Factor 0.1 %
10% VGS
td(on) tr t d(off) tf
Fig 17a. Switching Time Test Circuit
Fig 17b. Switching Time Waveforms
6
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IRF6795MTRPbF
D.U.T
Driver Gate Drive
+
P.W.
Period
D=
P.W. Period VGS=10V
+
Circuit Layout Considerations * Low Stray Inductance * Ground Plane * Low Leakage Inductance Current Transformer
***
D.U.T. ISD Waveform Reverse Recovery Current Body Diode Forward Current di/dt D.U.T. VDS Waveform Diode Recovery dv/dt
-
+
RG
*
* * * *
dv/dt controlled by RG Driver same type as D.U.T. I SD controlled by Duty Factor "D" D.U.T. - Device Under Test
V DD
VDD
**
+ -
Re-Applied Voltage Inductor Curent
Body Diode
Forward Drop
Ripple 5%
ISD
* Use P-Channel Driver for P-Channel Measurements ** Reverse Polarity for P-Channel
*** VGS = 5V for Logic Level Devices
Fig 18. Diode Reverse Recovery Test Circuit for HEXFET(R) Power MOSFETs
DirectFET Board Footprint, MX Outline (Medium Size Can, X-Designation).
Please see DirectFET application note AN-1035 for all details regarding the assembly of DirectFET. This includes all recommendations for stencil and substrate designs.
G = GATE D = DRAIN S = SOURCE
D S G S D
D
D
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IRF6795MTRPbF
Please see DirectFET application note AN-1035 for all details regarding the assembly of DirectFET. This includes all recommendations for stencil and substrate designs.
DirectFET Outline Dimension, MX Outline (Medium Size Can, X-Designation).
DIMENSIONS
METRIC CODE A B C D E F G H J K L M R P MIN 6.25 4.80 3.85 0.35 0.68 0.68 1.38 0.80 0.38 0.88 2.28 0.616 0.020 0.08 MAX 6.35 5.05 3.95 0.45 0.72 0.72 1.42 0.84 0.42 1.01 2.41 0.676 0.080 0.17 IMPERIAL MIN 0.246 0.189 0.152 0.014 0.027 0.027 0.054 0.032 0.015 0.035 0.090 0.0235 0.0008 0.003 MAX 0.250 0.201 0.156 0.018 0.028 0.028 0.056 0.033 0.017 0.039 0.095 0.0274 0.0031 0.007
DirectFET Part Marking
GATE MARKING LOGO PART NUMBER BATCH NUMBER DATE CODE
Line above the last character of the date code indicates "Lead-Free"
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IRF6795MTRPbF
DirectFET Tape & Reel Dimension (Showing component orientation).
NOTE: Controlling dimensions in mm Std reel quantity is 4800 parts. (ordered as IRF6795MTRPBF). For 1000 parts on 7" reel, order IRF6795MTR1PBF REEL DIMENSIONS STANDARD OPTION (QTY 4800) TR1 OPTION (QTY 1000) IMPERIAL IMPERIAL METRIC METRIC MIN MIN MAX CODE MIN MIN MAX MAX MAX A 12.992 6.9 N.C 330.0 177.77 N.C N.C N.C B 0.795 0.75 N.C 20.2 19.06 N.C N.C N.C 0.504 0.53 C 0.50 12.8 13.5 0.520 13.2 12.8 D 0.059 0.059 1.5 1.5 N.C N.C N.C N.C E 3.937 2.31 100.0 58.72 N.C N.C N.C N.C F N.C N.C N.C N.C 0.53 0.724 18.4 13.50 G 0.488 0.47 12.4 11.9 N.C 0.567 14.4 12.01 H 0.469 0.47 11.9 11.9 N.C 0.606 15.4 12.01
LOADED TAPE FEED DIRECTION
NOTE: CONTROLLING DIMENSIONS IN MM
CODE A B C D E F G H
DIMENSIONS IMPERIAL METRIC MIN MAX MAX MIN 0.311 8.10 7.90 0.319 0.154 0.161 4.10 3.90 0.469 11.90 0.484 12.30 0.215 5.55 5.45 0.219 0.201 5.10 0.209 5.30 0.256 6.70 6.50 0.264 0.059 N.C 1.50 N.C 0.059 1.50 0.063 1.60
Data and specifications subject to change without notice. This product has been designed and qualified for the Consumer market. Qualification Standards can be found on IR's Web site.
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105 TAC Fax: (310) 252-7903 Visit us at www.irf.com for sales contact information.05/08
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