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FMA3009
2-20GHZ BROADBAND MMIC AMPLIFIER
FEATURES:
* * * * * * * 10dB Gain Single Supply (Self Biased) 26dBm P1dB Output Power at 8.0V pHEMT Technology Bias Control Input Return Loss <-9dB Output Return Loss <-8dB
Pre-Production Datasheet v2.5
FUNCTIONAL SCHEMATIC:
VDD
RF Input
RF Output
GENERAL DESCRIPTION:
The FMA3009 is a high performance 2-20GHz Gallium Arsenide monolithic travelling wave amplifier. It is suitable for use in broadband communication, instrumentation and electronic warfare applications. The die is fabricated using the Filtronic 0.25m process. The Circuit is DC blocked at both the RF input and the RF output. Bias control is achieved using a combination of three on chip bias resistors connected to ground, using the bond wires.
TYPICAL APPLICATIONS:
* * * Test Instrumentation Electronic Warfare Broadband Communication Infrastructure
ELECTRICAL SPECIFICATIONS:
PARAMETER
Small Signal Gain Gain Ripple Input Return Loss Output Return Loss Reverse Isolation Output Power at 1dB compression point
CONDITIONS
2-20GHz 2-20GHz 2-20GHz 2-20GHz 2-20GHz 2 GHz 10GHz 20GHz
MIN
8.0
TYP
10 1 -10 -9 -30
MAX
12
UNITS
dB dB
-8 -8 -25
dB dB dB dBm
24 20 19
26.3 26 21.5 250
Drain Current Noise Figure
8.0V 4
mA 6.5 dB
5
Note: TAMBIENT = +25C, Z0 = 50 Performances for on-wafer measurements All Bias resistors bonded to ground.
1
Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Fax: +44 (0) 1325 306177 Email: sales@filcs.com
Tel: +44 (0) 1325 301111
Website: www.filtronic.com
FMA3009
Pilot Datasheet v2.5
ABSOLUTE MAXIMUM RATINGS:
PARAMETER
Max Input Power Drain Voltage Total Power Dissipation Thermal Resistivity Operating Temp Storage Temp
PAD LAYOUT:
PAD REF
A
SYMBOL
Pin VDD
ABSOLUTE MAXIMUM
+20dBm
PAD NAME
IN R1 R2 R3 Source
DESCRIPTION
PIN COORDINATES (m)
(100,396) (1896,100) (2046, 100) (2196, 100) (2027, 337)
RF in Enable Different Source Resistors to be grounded Test Pad (Resistor bypass)
+10V B
Ptot JC Toper Tstor
3W
C D E
32C/W -40C to +85C -55C to +150C
F
OUT
RF Output
(2200, 650)
Note: Exceeding any one of these absolute maximum ratings may cause permanent damage to the device.
G H I
VDD GND R5
Drain Voltage Ground Cascode Resistors: Enable Different
(2156, 1000) (1738, 995) (245, 1000)
J
R4
Voltages across the Cascode devices
(95, 1000)
H J I
G
F A E B C D
Note: Co-ordinates are referenced from the bottom left hand corner of the die to the centre of bond pad opening
DIE SIZE (m)
2300 x 1100
DIE THICKNESS (m)
100
MIN. BOND PAD PITCH (m)
150
MIN. BOND PAD OPENING (m x m )
100 x 100
DIFFERENT BIAS CONFIGURATIONS:
The Pads B, C and D can be bonded to ground or left unbonded to achieve different performances, as shown on the following table (see also page 5 for more information).
B
PADS GROUNDED C D
2
TYPICAL BIAS TYPICAL GAIN AT CURRENT (MA) 10 GHZ (DB) 230 9.9 210 9.8 200 9.7 179 9.4 178 9.4 145 9.1 112 8.7
Tel: +44 (0) 1325 301111
Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Fax: +44 (0) 1325 306177 Email: sales@filcs.com
Website: www.filtronic.com
FMA3009
Pilot Datasheet v2.5
TYPICAL PERFORMANCE FOR ON WAFER MEASUREMENTS:
All Bias resistors bonded to ground. Note: Measurement Conditions ID= 230mA, VDD= 8V, TAMBIENT = 25C.
Gain 14 0 12 10 |S21| (dB) 8 6 4 2 0 2 4 6 8 10 12 14 Frequency (GHz) Input Return Loss 0 -5 |S11| (dB) -10 -15 -20 -25 2 4 6 8 10 12 14 Frequency (GHz)
Noise Figure 7 6
P1dB (dBm) 30 25 20 15 10 5 0
Reverse Isolation
-10 |S12| (dB) 16 18 20 -20 -30 -40 -50 -60 -70 2 4 6 8 10 12 14 Frequency (GHz) 16 18 20
Output Return Loss 0 -5 -10 -15 -20 -25 -30 -35 -40 -45 2 4 6 8 10 12 14 Frequency (GHz) 16 18 20
16
18
20
|S22| (dB)
4 6 8 10 12 14 Frequency (GHz) 16 18 20
Output Pow er at 1 dB Com pression Point
5 NF (dB) 4 3 2 1 0 2
2
4
6
8 10 12 14 Frequency (GHz)
16
18
20
3
Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Fax: +44 (0) 1325 306177 Email: sales@filcs.com
Tel: +44 (0) 1325 301111
Website: www.filtronic.com
FMA3009
Pilot Datasheet v2.5
TYPICAL PERFORMANCE FOR ON WAFER MEASUREMENTS WITH DIFFERENT PADS CONFIGURATIONS (PADS B, C AND D GROUNDED OR UNBONDED):
Note: VDD= 8V, TAMBIENT = 25C. Letters or Group of Letters indicate which Bias resistors are bonded to ground
Gain w ith Different Pad Grounding Configurations B C 11 Reverse Isolation
13 12
|S21| (dB)
10 9 8 7 2 4 6 8 10 12 14 16 18 20
BC BD CD BCD
|S12| (dB)
D
0 -10 -20 -30 -40 -50 -60 -70 -80 2 4 6 8 10 12 14 16 18 20 Frequency (GHz)
Output Return Loss
B C D BC BD CD BCD
Frequency (GHz)
Input Return Loss
0 -5 |S11| (dB) -10 -15 -20 -25 2 4 6 8 10 12 14 16 18 20 Frequency (GHz)
Drain Current @ 10 GHz for Different Pad Grounding Configurations 250 200 150 100 50 0 B C D BC BD CD
B C D BC BD CD BCD
0 -5 -10 -15 -20 -25 -30 -35 -40 -45 2 4 6 8 10 12 14 16 18 20 Frequency (GHz)
B C D BC BD CD BCD
|S22| (dB)
P1dB (dBm)
Output P1dB @ 10 GHz for Different Pad Grounding Configurations 27 26 25 24 23 22 21 20 BCD B C D BC BD Grounded Pads CD BCD
Id (mA)
Grounded Pads
4
Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Fax: +44 (0) 1325 306177 Email: sales@filcs.com
Tel: +44 (0) 1325 301111
Website: www.filtronic.com
FMA3009
Pilot Datasheet v2.5
TYPICAL PERFORMANCE FOR ON WAFER MEASUREMENTS OVER TEMPERATURE:
Note: Measurement Conditions ID= 230mA, VDD= 8V. All Bias resistors bonded to ground.
TAMBIENT = 25C
Gain
TCOLD = -40C
THOT = +85C
Reverse Isolation
14 13 12 11 10 9 8 7 6 2 4 6 8 10 12 14 16 Frequency (GHz) 18 20
0 -10 |S12| (dB) -20 -30 -40 -50 -60 -70 -80 2 4 6 8 10 12 14 16 Frequency (GHz) 18 20
|S21| (dB)
Input Return Loss 0 -5 |S11| (dB)
Output Return Loss
0 -10 |S22| (dB) -20 -30 -40
-10 -15 -20 -25 -30 2 4 6 8 10 12 14 Frequency (GHz) 16 18 20
-50 2 4 6 8 10 12 14 Frequency (GHz) 16 18 20
P1dB overTem perature 30 25 P1dB (dBm) 20 15 10 5 0 6 8 10 12 14 16 Frequency (GHz) 18 20
5
Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Fax: +44 (0) 1325 306177 Email: sales@filcs.com
Tel: +44 (0) 1325 301111
Website: www.filtronic.com
FMA3009
Pilot Datasheet v2.5
S-PARAMETERS FOR ON-WAFER MEASUREMENTS:
Note: Measurement Conditions ID= 230mA, VDD= 8V and TAMBIENT = 25C Units: GHZ (Frequency), dB (S-parameters magnitude), radian (S-parameters angle)
S11 S21 Frequency Mag Angle Mag Angle 1.85 -12.85 1.23 9.61 2.05 -12.87 1.18 9.65 2.25 -12.78 1.12 9.64 2.45 -12.59 1.06 9.62 2.65 -12.34 1.00 9.58 2.85 -12.20 0.92 9.52 3.05 -12.08 0.86 9.49 3.25 -11.94 0.80 9.45 3.45 -11.72 0.73 9.39 3.65 -11.64 0.67 9.35 3.85 -11.56 0.61 9.33 4.05 -11.42 0.55 9.29 4.25 -11.34 0.49 9.25 4.45 -11.26 0.44 9.22 4.65 -11.20 0.38 9.20 4.85 -11.16 0.32 9.17 5.05 -11.13 0.27 9.15 5.25 -11.12 0.21 9.13 5.45 -11.15 0.15 9.11 5.65 -11.17 0.10 9.09 5.85 -11.23 0.05 9.09 6.05 -11.31 -0.01 9.09 6.25 -11.39 -0.06 9.09 6.45 -11.51 -0.12 9.09 6.65 -11.66 -0.17 9.10 6.85 -11.82 -0.22 9.11 7.05 -12.01 -0.27 9.13 7.25 -12.23 -0.33 9.15 7.45 -12.49 -0.37 9.17 7.65 -12.77 -0.43 9.20 7.85 -13.12 -0.48 9.28 8.05 -13.53 -0.52 9.41 8.25 -13.94 -0.56 9.47 8.45 -14.43 -0.60 9.49 8.65 -14.93 -0.64 9.54 8.85 -15.52 -0.67 9.58 9.05 -16.13 -0.70 9.62 9.25 -16.86 -0.73 9.67
Mag -0.32 -0.44 -0.56 -0.68 -0.79 -0.89 -0.99 -1.08 -1.18 -1.27 -1.36 -1.45 -1.53 1.52 1.44 1.36 1.27 1.19 1.11 1.03 0.95 0.87 0.79 0.71 0.63 0.56 0.48 0.40 0.32 0.25 0.17 0.09 0.01 -0.08 -0.17 -0.25 -0.33 -0.41
6
S12 S22 Angle Mag Angle -58.57 0.26 -13.78 -0.25 -62.80 0.35 -14.07 -0.26 -62.11 0.41 -14.32 -0.29 -61.89 0.61 -14.55 -0.33 -57.78 0.28 -14.85 -0.34 -57.97 0.53 -15.13 -0.38 -56.03 0.51 -15.36 -0.41 -53.36 0.25 -15.75 -0.43 -57.90 -0.19 -15.93 -0.45 -55.80 0.04 -16.21 -0.49 -56.38 -0.22 -16.54 -0.50 -58.71 0.00 -17.02 -0.54 -55.81 -0.02 -17.26 -0.57 -54.83 -0.07 -17.67 -0.58 -54.10 -0.12 -18.40 -0.61 -53.61 -0.21 -18.88 -0.64 -53.06 -0.20 -19.35 -0.63 -52.56 -0.36 -20.20 -0.66 -51.79 -0.42 -20.90 -0.68 -51.11 -0.43 -21.37 -0.65 -50.95 -0.57 -22.35 -0.65 -50.29 -0.64 -23.38 -0.68 -49.78 -0.72 -24.17 -0.65 -49.40 -0.75 -25.38 -0.60 -49.24 -0.89 -26.82 -0.67 -48.49 -0.94 -28.32 -0.63 -47.97 -1.06 -30.53 -0.41 -47.71 -1.15 -34.49 -0.40 -47.37 -1.24 -41.79 -0.06 -47.14 -1.35 -36.69 -1.52 -47.30 -1.41 -29.12 -1.22 -48.02 -1.42 -24.56 -1.44 -46.62 -1.48 -22.10 1.44 -46.47 -1.51 -21.21 1.35 -45.51 1.54 -21.18 1.29 -45.61 1.46 -20.39 1.28 -44.75 1.34 -19.58 1.33 -44.60 1.27 -19.05 1.28
Tel: +44 (0) 1325 301111
Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Fax: +44 (0) 1325 306177 Email: sales@filcs.com
Website: www.filtronic.com
FMA3009
Pilot Datasheet v2.5
S-PARAMETERS CONTINUED
S11 S21 S12 S22 Frequency Mag Angle Mag Angle Mag Angle Mag Angle 9.45 -17.68 -0.74 9.75 -0.49 -43.92 1.16 -18.35 1.26 9.65 -18.55 -0.74 9.78 -0.58 -44.02 1.07 -17.66 1.29 9.85 -19.45 -0.72 9.81 -0.67 -43.32 0.97 -16.90 1.27 10.05 -20.51 -0.69 9.88 -0.75 -43.38 0.90 -16.33 1.23 10.25 -21.65 -0.63 9.95 -0.83 -43.53 0.77 -15.87 1.25 10.45 -22.95 -0.50 9.98 -0.92 -43.32 0.70 -15.32 1.23 10.65 -23.58 -0.29 10.03 -1.01 -43.10 0.67 -14.49 1.18 10.85 -23.52 -0.08 10.10 -1.10 -42.82 0.54 -13.89 1.16 11.05 -22.97 0.10 10.11 -1.18 -42.71 0.50 -13.44 1.16 11.25 -22.03 0.24 10.11 -1.27 -42.47 0.41 -12.67 1.13 11.45 -20.90 0.34 10.16 -1.37 -42.44 0.33 -12.07 1.08 11.65 -19.77 0.40 10.25 -1.45 -41.96 0.19 -11.75 1.04 11.85 -18.62 0.42 10.24 -1.54 -42.27 0.08 -11.09 0.99 12.05 -17.64 0.43 10.14 1.50 -42.51 0.00 -10.19 0.93 12.25 -16.75 0.42 10.12 1.41 -43.34 -0.06 -9.70 0.82 12.45 -15.97 0.39 10.19 1.34 -43.82 -0.06 -9.81 0.67 12.65 -15.23 0.37 10.19 1.26 -43.35 -0.01 -10.32 0.62 12.85 -14.58 0.33 10.22 1.16 -42.38 -0.04 -10.65 0.61 13.05 -13.97 0.29 10.30 1.07 -41.92 -0.11 -10.67 0.57 13.25 -13.41 0.24 10.27 0.98 -41.40 -0.24 -10.45 0.58 13.45 -12.93 0.20 10.17 0.90 -41.13 -0.29 -10.33 0.58 13.65 -12.48 0.14 10.18 0.80 -40.78 -0.35 -10.11 0.52 13.85 -12.12 0.09 10.29 0.72 -40.86 -0.42 -9.99 0.50 14.05 -11.80 0.04 10.27 0.64 -39.83 -0.50 -9.95 0.49 14.25 -11.47 -0.02 10.16 0.54 -39.91 -0.58 -9.67 0.43 14.45 -11.19 -0.08 10.15 0.44 -39.98 -0.65 -9.38 0.38 14.65 -10.97 -0.14 10.22 0.36 -39.88 -0.74 -9.46 0.35 14.85 -10.80 -0.20 10.15 0.29 -39.46 -0.77 -9.39 0.31 15.05 -10.60 -0.26 10.12 0.20 -39.37 -0.87 -9.19 0.27 15.25 -10.50 -0.32 10.25 0.10 -39.02 -0.93 -9.39 0.21 15.45 -10.41 -0.38 10.25 0.02 -39.17 -1.00 -9.52 0.16 15.65 -10.35 -0.45 10.15 -0.06 -38.70 -1.11 -9.33 0.13 15.85 -10.34 -0.51 10.16 -0.15 -38.29 -1.16 -9.38 0.09 16.05 -10.38 -0.58 10.25 -0.24 -38.37 -1.22 -9.71 0.03 16.25 -10.44 -0.64 10.27 -0.31 -37.69 -1.25 -9.87 -0.01 16.45 -10.51 -0.70 10.27 -0.40 -37.81 -1.34 -9.95 -0.04 16.65 -10.68 -0.77 10.33 -0.50 -37.37 -1.46 -10.17 -0.11 16.85 -10.85 -0.83 10.47 -0.58 -37.44 -1.49 -10.34 -0.15 17.05 -11.05 -0.90 10.44 -0.66 -36.70 -1.57 -10.54 -0.14 17.25 -11.34 -0.96 10.44 -0.75 -36.30 1.52 -10.81 -0.19
7
Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Fax: +44 (0) 1325 306177 Email: sales@filcs.com
Tel: +44 (0) 1325 301111
Website: www.filtronic.com
FMA3009
Pilot Datasheet v2.5
S-PARAMETERS CONTINUED
S11 S21 S12 S22 Frequency Mag Angle Mag Angle Mag Angle Mag Angle 17.45 -11.67 -1.02 10.60 -0.85 -35.91 1.43 -11.13 -0.25 17.65 -12.06 -1.08 10.76 -0.93 -35.58 1.33 -11.61 -0.27 17.85 -12.56 -1.14 10.81 -1.02 -35.39 1.23 -12.09 -0.30 18.05 -13.13 -1.20 10.89 -1.12 -35.00 1.15 -12.46 -0.37 18.25 -13.80 -1.25 11.04 -1.22 -34.55 1.06 -13.22 -0.40 18.45 -14.60 -1.29 11.14 -1.31 -34.35 0.97 -14.20 -0.42 18.65 -15.56 -1.32 11.23 -1.41 -34.03 0.90 -14.94 -0.44 18.85 -16.63 -1.32 11.37 -1.52 -33.85 0.80 -16.16 -0.44 19.05 -17.87 -1.29 11.50 1.52 -33.73 0.70 -18.02 -0.42 19.25 -19.21 -1.21 11.59 1.41 -33.08 0.60 -19.15 -0.32 19.45 -20.43 -1.06 11.67 1.30 -32.79 0.48 -19.93 -0.15 19.65 -21.00 -0.85 11.78 1.18 -32.69 0.34 -21.30 0.09 19.85 -20.78 -0.61 11.83 1.08 -32.53 0.24 -21.17 0.44 20.05 -19.99 -0.42 11.88 0.96 -32.70 0.11 -19.15 0.73
8
Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Fax: +44 (0) 1325 306177 Email: sales@filcs.com
Tel: +44 (0) 1325 301111
Website: www.filtronic.com
FMA3009
Pilot Datasheet v2.5
BIASING CIRCUIT SCHEMATIC:
VDD 100pF 100nF
RF Output
RF Input
ASSEMBLY DIAGRAM:
It is recommended that the RF connections be made using bond wires with 25m diameter and a maximum length of 300m. Optimum input and output return loss can be achieved, to compensate for bond wire inductance, with the addition of a microstrip transformer, shown in the diagram below. Ground connections should be made according to the required bias conditions.
To Evaluation Board via an 0402 Surface Mounted capacitor (100nF)
100pF Chip Capacitor
Substrate: Alumina Thickness: 635m Dimensions in mm
0.9
3.5 Turn Air Coil
0.9
0.61 0.61
1.0 1.0
Ground Connections
Transformer Impedance 41 Electrical Length 32 at 10GHz
BILL OF MATERIALS:
COMPONENT
All RF tracks should be 50 characteristic material Capacitor, 100pF, chip capacitor Capacitor, 100nF, 0402 6 nH - 3.5 Turn Air Coil (Manufacturer: Sycopel, model: HMG/3.5/500/50/100)
9
Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Fax: +44 (0) 1325 306177 Email: sales@filcs.com
Tel: +44 (0) 1325 301111
Website: www.filtronic.com
FMA3009
Pilot Datasheet v2.5
PREFERRED ASSEMBLY INSTRUCTIONS:
GaAs devices are fragile and should be handled with great care. Specially designed collets should be used where possible. The recommended die attach is gold/tin eutectic solder under a nitrogen atmosphere. Stage temperature should be 280-290C; maximum time at temperature is one minute. The recommended wire bond method is thermo-compression wedge bonding with 0.7 or 1.0 mil (0.018 or 0.025 mm) gold wire. Stage temperature should be 250-260C. Bonds should be made from the die first and then to the mounting substrate or package. The physical length of the bondwires should be minimised especially when making RF or ground connections.
ORDERING INFORMATION:
PART NUMBER
FMA3009 (Gel-pak available on request)
DESCRIPTION
Die in Waffle-pack
HANDLING PRECAUTIONS:
To avoid damage to the devices care should be exercised during handling. Proper Electrostatic Discharge (ESD) precautions should be observed at all stages of storage, handling, assembly, and testing. These devices should be treated as Class 0 (0-250 V) as defined in JEDEC Standard No. 22-A114. Further information on ESD control measures can be found in MIL-STD-1686 and MILHDBK-263.
APPLICATION NOTES & DESIGN DATA:
Application Notes and design data including Sparameters available on request.
DISCLAIMERS:
This product is not designed for use in any space based or life sustaining/supporting equipment.
10
Specifications subject to change without notice Filtronic Compound Semiconductors Ltd Fax: +44 (0) 1325 306177 Email: sales@filcs.com
Tel: +44 (0) 1325 301111
Website: www.filtronic.com

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