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 True SineWave SAW Based VCSO 5x7.5mm SMD 3.3 Volts
CVS575S-500.000
Model CVS575S-500 is a 500MHz voltage-controlled SAW (surface acoustic wave) oscillator (VCSO). SAW crystal technology provides low-noise and low-jitter performance with true sinewave output. Features include -135dBc/Hz phase noise at 10kHz offset, 3.3V input voltage, -20 to +70C operating temperature, and 5x7.5 mm SMT package. The oscillator has no sub-harmonic and the second harmonic is typically -14dBc. Applications include PLL frequency translation, test and measurement, avionics, pointto-point radios, and multi-point radios.
Rev.: A Date: 05-12-08
True SineWave SAW Based VCSO 5x7.5mm SMD 3.3 Volts
CVS575S-500.000
Frequency: Temperature Range: Storage: Input Voltage: Control Voltage: Settability At Nominal (25C): Freq. vs Temp. Input Current:
500 MHz -20C to 70C -40C to 90C 3.3V 0.15V 1.65V 1.65V 1.5V 0.5V +100ppm, -150ppm Typ. 20mA Typ., 25mA Max True SineWave 50ppm Min. 20% Max +7dBm Min. into 50 Ohm Load 2ms Typ., 10ms Max -14dBc Typ., -10dBc Max None >20KHz @ -3dB <1ps RMS (1-sigma) Max
Output: Pullability APR: Linearity: Output Power: Start-up time: 2nd Harmonic: Sub-harmonics: Modulation BW: Phase Jitter: 12KHz~80MHz
0.305 -0.008 +0.020 (7.75 -0.2 +0.5)
0.046 (1.16)
CCS575S Freq XXX XX
Denotes pad 1 XXX=Date Code XX=Lot Code
0.200 0.010 (5.08 0.25)
0.058 (1.47)
#1 #4
#2 #3
0.046 (1.16)
0.200 (5.08)
Pad
1 2 3
0.050 (1.27)
Connection
Volt Control GND Output Vdd
SUGGESTED PAD LAYOUT
via to ground 0.01F 4 3
4
0.154 (3.91) 0.099 (2.50) 0.071 (1.80) 1 2
Dimensions inches (mm) All dimensions are Max unless otherwise specified.
0.200 (5.08)
Rev.: A Date: 05-12-08
True SineWave SAW Based VCSO 5x7.5mm SMD 3.3 Volts
CVS575S-500.000
Frequency VS Temperature
RECOMMENDED REFLOW SOLDERING PROFILE TEMPERATURE
260C 217C 200C 150C
Ramp-Up 3C/Sec Max. Critical Temperature Zone Ramp-Down 6C/Sec.
Preheat 180 Secs. Max. 8 Minutes Max.
90 Secs. Max. 260C for 10 Secs. Max.
NOTE: Reflow Profile with 240C peak also acceptable.
Parameter Mechanical Shock Mechanical Vibration Solderability Solvent Resistance Resistance to Soldering Heat Thermal Shock Moisture Resistance
Conditions MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A MIL-STD-883, Method 2003 MIL-STD-202, Method 215 MIL-STD-202, Method 210, Condition I or J MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004
Rev.: A Date: 05-12-08


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