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| Twin Diode Surface Mounting Device Diode Array OUTLINE DIMENSIONS Package 1NA 800V 3A AK AD 80 014N Standard soldering pad RATINGS Absolute Maximum Ratings Item Storage Temperature Operation Junction Temperature Maximum Reverse Voltage l Average Rectified Forward Current 50Hz sine wave, Resistance load, On glass-epoxy substrate, 50Hz sine wave, Non-repetitive 1cycle peak value, Tj=25 l Type No. Symbol Conditions S1NAD80 Unit Peak Surge Forward Current Current Squared Time Electrical Characteristics Forward Voltage Reverse Current Pulse measurement, per diode Pulse measurement, per diode l l Thermal Resistance Junction to Lead, On glass-epoxy substrate Junction to Ambient, On glass-epoxy substrate Copper soldering pad Area 101mm2 162 J 514 - 6 www.shindengen.co.jp/product/semi/ CHARACTERISTIC DIAGRAMS Forward Voltage Forward Power Dissipation Peak Surge Forward Current Capability l l Ta Io Derating Curve Ta Io Tl Io Derating Curve Tl Io l ' www.shindengen.co.jp/product/semi/ J 514 - 6 163 |
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