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MECHANICAL DATA
LL
2A at T = 75 C WITH NO THERMAL RUNAWAY
EXTREMELY LOW LEAKAGE AT HIGH TEMPERATURES
LOW FORWARD VOLTAGE DROP
VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area)
PROPRIETARY SOFT GLASS JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE
PARAMETER (TEST CONDITIONS)
18020 Hobart Blvd., Unit B Gardena, CA 90248 U.S.A Tel.: (310) 767-1052 Fax: (310) 767-7958
DIOTEC ELECTRONICS CORP.
FEATURES
2 AMP FAST RECOVERY SILICON DIODES
MAXIMUM RATINGS & ELECTRICAL CHARACTERISTICS
R
R
oHS
PLI OM C
ACTUAL SIZE OF DO-41 PACKAGE
SYMBOL
ANT
MECHANICAL SPECIFICATION
DO - 41
Sym
LL LD
BD
BL
RATINGS
Color Band Denotes Cathode
BD (Dia)
Data Sheet No. FSPD-200-1B
LD (Dia)
1.00 0.028
0.160
0.103
Minimum In mm
SERIES RGP200 - RGP210
25.4 0.71
2.6
4.1
Maximum In mm 5.2 0.205
0.034
0.107
UNITS
0.86
2.7
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FIGURE 1. FORWARD CURRENT DERATING CURVE
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0.01 0.4

18020 Hobart Blvd., Unit B Gardena, CA 90248 U.S.A Tel.: (310) 767-1052 Fax: (310) 767-7958
DIOTEC ELECTRONICS CORP.
0.6
0.8
RATING & CHARACTERISTIC CURVES FOR SERIES RGP200 - RGP210
2 AMP FAST RECOVERY SILICON DIODES
1.0
1.2
1.4
1.6
1.8
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FIGURE 3. TYPICAL FORWARD CHARACTERISTIC FIGURE 5. REVERSE RECOVERY TEST SETUP AND TIME CHARACTERISTIC
W W W
O O O O O N I I I I E
FIGURE 2. MAXIMUM NON-REPETITIVE SURGE CURRENT
FIGURE 4. TYPICAL JUNCTION CAPACITANCE
Data Sheet No. FSPD-200-2B
TJ = 25 oC f = 1 MHz VSIG = 50 mV P-P

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