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ASMT-Rx45-xxxxx
0.45mm Leadframe-Based Surface Mount ChipLED
Data Sheet
Description
Avago Technologies' ultra-thin ASMT-Rx45 ChipLEDs were developed based on the industrial standard ChipLED 0603 platform which requires less board space. These ChipLEDs provide a wide viewing angle of 130 degrees to improve visibility in bright sunlight. In addition to the high-brightness and compact size, Avago's ASMT-Rx45 ChipLEDs provide two significant advantages in the production environment: They can be easily soldered using IR solder reflow process, and the package is qualified to a Joint Electronic Device Engineering Council (JEDEC) moisture sensitive level (MSL) rating of 2a. For manufacturers, this rating means that these ChipLEDs can be kept in the open air (30 degrees C, 60 percent relative humidity) for up to four weeks after being removed from its sealed package without the need to remove absorbed moisture. Avago's ultra-thin Leadframe ChipLED available in Red, Orange, Yellow Green and Amber colors, the ASMT-Rx45 series is ideal for use by lighting designers developing backlighting for dashboards and entertainment consoles in automobiles, backlighting of industrial switches and buttons, and small pixel indoor signs.
Features
* Industrial 0603 platform - 1.6 x 0.8 x 0.45mm * Automotive qualified * Super wide 130 deg viewing angle * JEDEC MSL 2a. * Robust Operating Temperature from - 40 to +100 C * Junction Temperature Tj = 110 C * RoHS & IR Reflow compatible
Applications
1. Interior Automotive * Navigation backlighting * Audio panel backlighting * Push Button backlighting 2. Office Automation, home appliances and industrial equipment * Front panel backlighting * Push Button backlighting * LCD backlighting * Switches backlighting * Navigation backlighting
CAUTION: ASMT-Rx45 LEDs are Class 1C ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
Package Dimensions
0.8 LED Die 0.45 Lead Frame Cathode Side
0.6
1.6
1.1
Resin
Device Selection Guide
Package Dimension (mm) 1.6 (L) x 0.8 (W) x 0.45 (H) 1.6 (L) x 0.8 (W) x 0.45 (H) 1.6 (L) x 0.8 (W) x 0.45 (H) 1.6 (L) x 0.8 (W) x 0.45 (H) Die Technology AlInGaP AlInGaP AlInGaP AlInGaP Colors Red Orange Yellow Green Amber Parts per Reel 4000 4000 4000 4000 Package Description Untinted, Diffused Untinted, Diffused Untinted, Diffused Untinted, Diffused
Part Numbering System
A S M T - R X1 45 - X2 X3 X4 X5 X6 Packaging Option Color Bin Selection Max. Flux Bin Min. Flux Bin LED Chip Color
0.4
Absolute Maximum Ratings at TA = 25C
Parameter DC Forward Current [1] Power Dissipation Reverse Voltage (IR = 100mA) LED Junction Temperature Operating Temperature Range Storage Temperature Range
Notes: 1. Applies when single LED is lit up.
ASMT-Rx45 0 48 5 110 -40 to +100 -40 to +100
Units mA mW V C C C
Electrical Characteristics at TA = 25C
Forward Voltage, VF (Volts) [1] @ IF =20mA Part Number ASMT-RR45 ASMT-RJ45 ASMT-RF45 ASMT-RA45
Notes: 1. VF Tolerance: 0.1V
Reverse Breakdown VR (Volts) @ IR = 100mA Max .4 .4 .4 .4 Min 5 5 5 5
Thermal Resistance RqJ-PIN (C/W) Typical 46 46 46 46
Min 1.6 1.6 1.6 1.6
Typ .0 .0 .0 .0
Optical Characteristics at TA = 25C
Luminous Intensity IV [1] (mcd) @ 20mA Part Number ASMT-RR45 ASMT-RJ45 ASMT-RF45 ASMT-RA45 Color Red Orange Yellow Green Amber Min. 50 50 6 40 Typ. 10 10 60 90 Peak Wavelength lpeak (nm) Typical 66 61 574 59 Dominant Wavelength ld [2] (nm) Typical 6 605 57 591 Viewing Angle 2q1/2 [3] (Degrees) Typical 145 145 145 145
Notes: 1. The luminous intensity IV is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the LED package. 2. The dominant wavelength, ld, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. q1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.
Intensity Bin Select (X3X4)
Individual reel will contain parts from one half bin only X3 X4 0 4 5 6 7 8 9 Full Distribution half bins starting from X1 half bins starting from X1 4 half bins starting from X1 5 half bins starting from X1 half bins starting from X half bins starting from X 4 half bins starting from X 5 half bins starting from X Min IV Bin
Light Intensity (IV) Bin Limits
Intensity (mcd) Bin ID A1 A B1 B C1 C D1 D E1 E F1 F G1 G H1 H J1 J K1 K L1 L M1 M N1 N P1 P Q1 Q R1 R S1 S Tolerance: 15% Min. 0.11 0.14 0.18 0. 0.9 0.6 0.45 0.57 0.7 0.90 1.10 1.41 1.80 .4 .80 .55 4.50 5.70 7.0 9.00 11.0 14.0 18.00 .50 8.00 6.00 45.00 57.00 71.50 90.00 11.00 14.00 180.00 7.00 Max. 0.14 0.18 0. 0.9 0.6 0.45 0.57 0.7 0.90 1.10 1.41 1.80 .4 .80 .55 4.50 5.70 7.0 9.00 11.0 14.0 18.00 .50 8.00 6.00 45.00 57.00 71.50 90.00 11.00 14.00 180.00 7.00 85.00
4
Color Bin Select (X5)
Individual reel will contain parts from one full bin only. X5 0 Z Y W V U T S Q P N M L K J 1 4 5 6 Full Distribution A and B only B and C only C and D only D and E only E and F only F and G only G and H only A, B and C only B, C and D only C, D and E only D, E and F only E, F and G only F, G and H only Special Color Bin A, B, C and D only E, F, G and H only B, C, D and E only C, D, E and F only A, B, C, D and E only B, C, D, E, and F only
Color Bin Limits
Yellow Green Color Bin Dominant Wavelength (nm) Bin ID E F G H Yellow/Amber Color Bin Dominant Wavelength (nm) Bin ID A B C D E F Orange Color Bin Dominant Wavelength (nm) Bin ID A B C D E Package Type Top Mount Top Mount Top Mount Reel Size 7 Inch 7 Inch 7 Inch Red Color Bin Dominant Wavelength (nm) Bin ID Full Distribution
Tolerance: 1nm
Min. 564.5 567.5 570.5 57.5
Max. 567.5 570.5 57.5 576.5
Min. 58.0 584.5 587.0 589.5 59.0 594.5
Max. 584.5 587.0 589.5 59.0 594.5 597.0
Min 597.0 600.0 60.0 606.0 609.0
Max 600.0 60.0 606.0 609.0 61.0
Packaging Option (X6)
Option H K Test Current 0 mA mA 5 mA
Min. 60.0
Max. 65.0
Forward Voltage (VF) Bin Limits
Forward Voltage (V) Bin ID 1 4
Tolerance: 0.1V
Minimum 1.60 1.80 .00 .0
Maximum 1.80 .00 .0 .40
5
1 0.9 0.8 RELATIVE INTENSITY 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 380 430 480
AMBER YELLOW GREEN
ORANGE RED
100
IF - FORWARD CURRENT - mA
AMBER/ ORANGE
10
RED
YELLOW GREEN
530
580
630
680
730
780
WAVELENGTH-nm
1 0.00
0.50
1.00
1.50
2.00
2.50
3.00
3.50
V F - FORWARD VOLTAGE - V
Figure 1. Relative intensity vs. wavelength.
Figure 2. Forward current vs. forward voltage.
1.40 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20mA) MAX. FORWARD CURRENT - mA 0 5 10 15 20 25 30 1.20 1.00 0.80 0.60 0.40 0.20 0.00
25 20 15 10 5 0
0
20
40
60
80
100
120
IF - FORWARD CURRENT - mA
AMBIENT TEMPERATURE - C
Figure 3. Luminous intensity vs. forward current.
Figure 4. Maximum forward current vs. ambient temperature. Derated based on TJMAX = 110C, RqJA = 465C/W
1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE
RELATIVE INTENSITY
Figure 5. Radiation pattern.
Figure 6. Recommended soldering land pattern.
Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.1mm (0.004in.) unless otherwise specified.
6
10 to 30 SEC.
20 SEC. MAX.
TEMPERATURE
240 oC/ MAX. 3 oC/SEC. MAX. 100-150 oC 3 oC/SEC. MAX. 120 SEC. MAX. TIME 60-150 SEC.
TEMPERATURE
217 C 200 oC 150 oC
o
255 - 260 C 3 oC/SEC. MAX. 6 oC/SEC. MAX. 3 oC/SEC. MAX. 60 - 120 SEC. TIME 100 SEC. MAX. (Acc. to J-STD-020C)
o
183 oC -6 oC/SEC. MAX.
Figure 7a. Recommended reflow soldering profile.
Figure 7b. Recommended Pb-free reflow soldering profile.
Notes: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN 1060 Surface Mounting SMT LED Indicator Components.
[0.157]
4.00
[0.157] [0.069]
4.00
[0.059]
1.50
[SEE TABLE 1]
DIM. C
0.254 +/- 0.02
[0.01 +/- 0.001]
1.75
3.50 +/- 0.05
[SEE TABLE]
8.00 +/- 0.30
[0.315 +/- 0.012]
DIM. A
[0.14 +/- 0.002]
[SEE TABLE]
DIM. B
Diam. 0.60 +/- 0.05
CARRIER TAPE USER FEED DIRECTION COVER TAPE
Figure 8. Tape Dimensions.
USER FEED DIRECTION
CATHODE SIDE
PRINTED LABEL
Figure 9. Reeling Orientation.
7
This product is qualified as Moisture Sensitive Level 2a per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling of Moisture Sensitive Surface Mount Devices for details. A. Storage before use - Unopen moisture barrier bag (MBB) can be stored at <40C/90%RH for 12 months. If the actual shelf life has exceeded 12 months and the HIC indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. - It is not recommended to open the MBB prior to assembly (e.g. for IQC). B. Control after opening the MBB - The humidity indicator card (HIC) shall be read immediately upon opening of MBB. - The LEDs must be kept at <30C / 60%RH at all time and all high temperature related process including soldering, curing or rework need to be completed within 672 hours. C. Control for unfinished reel - For any unuse LEDs, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH. D. Control of assembled boards - If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure no LEDs have exceeded their floor life of 672 hours. E. Baking is required if: "10%" or "15%" HIC indicator turns pink. - The LEDs are exposed to condition of >30C / 60% RH at any time. - The LEDs floor life exceeded 672 hours. Recommended baking condition: 605C for 20 hours.
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright (c) 007 Avago Technologies Limited. All rights reserved. AV0-078EN - August 9, 007

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