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| ASMT-QTB2-XXXXX PLCC-4 Surface Mount LED Indicator Data Sheet Description This family of SMT LEDs is packaged in the industry standard PLCC-4 package. These SMT LEDs have high brightness and reliability performance and are designed to work under a wide range of environmental conditions. This high reliability feature makes them ideally suited to be used under exterior and interior full color signs application conditions. To facilitate easy pick & place assembly, the LEDs are packed in EIA-compliant tape and reel. Every reel will be shipped in single intensity and color bin; except red color to provide close uniformity. These LEDs are compatible with IR soldering process. This super wide viewing angle at 120 together with the built in reflector pushing up the intensity of the light output makes these LED suitable to be used in the interior electronics signs. The flat top emitting surface makes it easy for these LEDs to mate with light pipes. This is suitable for general backlighting in automotive interior, office equipment, industrial equipment, and home appliances. Features * Industry Standard PLCC-4 package - (Plastic Leaded Chip Carrier) * High reliability LED package due to enhanced silicone resin material * High brightness using AlInGaP and InGaN dice technologies * Super wide viewing angle at 120 * Available in 8mm carrier tape on 7-inch reel * Compatible with IR soldering process * Black surface RGB PLCC-4 for higher contrast * JEDEC MSL 2a Applications * Electronic Signs and Signals - Exterior and Interior Full Color Sign - Variable Message Sign * Interior automotive - Instrument cluster backlighting - Central console backlighting - Cabin backlighting * Office automation, Home appliances, Industrial Equipment - Front panel backlighting - Display backlighting CAUTION: ASMT-QTB2-XXXXX LEDs are Class 1C ESD sensitive. Please observe appropriate precautions during handling and processing. Refer to Avago Application Note AN-1142 for additional details. Package Dimensions Notes: 1. All Dimensions are in millimeters. 2. Tolerance = 0.2 mm unless otherwise specified. 3. Terminal Finish: Ag plating 4. Encapsulation material: Silicone resin Lead Configuration 3 4 Figure 1. Package Drawing Cathode Common Anode Cathode Cathode Red Blue Green Table 1. Device Selection Guide Tri Color Part Number ASMT-QTB-0xxxx Color 1 AlInGaP Red Color 2 InGaN Green Color 3 InGaN Blue Color 1 Min. Iv @ 20mA Part Number ASMT-QTB-0A00 Bin ID T (mcd) 355 Typ. Iv @ 20mA (mcd) 505 Bin ID V Color 2 Min. Iv @ 20mA (mcd) 75 Typ. Iv @ 20mA Min. Iv @ 20mA (mcd) 05 Bin ID S Color 3 Typ. Iv @ 20mA (mcd) 35 (mcd) 4 Notes: 1. The luminous intensity IV, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not be aligned with this axis. 2. Tolerance = 12 % Part Numbering System A S M T - Q T B 2 - X1 X2 X3 X4 X5 Packaging Option Color Bin Selection Intensity Bin Limit Intensity Bin Selection Device Specification Configuration Table 2. Absolute Maximum Ratings (Tj = 25C) Parameter DC forward current [] Peak forward current [] Power dissipation Reverse voltage Maximum junction temperature Tj max Operating board temperature, Ta range Storage temperature range Note: 1. Derate Linearly as shown in Figure 5a & 5b. 2. Duty Factor = 0.5%, Frequency = 500Hz Red 50 00 30 Green & Blue 30 300 7 4V 5 - 40 to + 0 - 40 to + 0 Unit mA mA mW V C C C Table 3. Optical Characteristics (Tj = 25C) Dominant Wavelength, ld (nm) [1] Typ. 68 56 47 Peak Wavelength, lp (nm) Typ. 639 59 467 Viewing Angle, 2q1/2 [2] (Degrees) Typ. 0 0 0 Luminous Efficacy, hV [3] (lm/W) Typ. 60 530 70 Luminous Efficiency, he (lm/W) Typ. 30 45 5 Luminous Intensity / Total Flux, [4, 5] IV (cd) / FV (lm) Typ. 0.35 0.35 0.35 Color Red Green Blue Dice Technology AlInGaP InGaN InGaN Notes: 1. The chromaticity coordinates and dominant wavelength are derived from the CIE Chromaticity Diagram and represent the perceived color of the device. The values area average for all LEDs in the product. 2. The total spectral width at 1/2 of the peak intensity for all LEDs of a specific color. 3. Radiant intensity, Ie in watts / steradian, may be calculated from the equation Ie = IV / hV, where IV is the luminous intensity in candelas and hV is the luminous efficacy in lumens / watt. 4. FV is the total luminous flux output as measured with an integrating sphere after the device has stabilized. 5. Flux tested at mono pulse conditions. Table 4. Electrical Characteristics (Tj = 25C) Forward Voltage VF (V) [1] Color Red Green Blue Note: 1. Tolerance 0.1V. Reverse Voltage VR @ 100mA Max. .60 3.90 3.90 Min. 4 - Reverse Voltage VR @ 10mA Min. 4 4 Thermal Resistance RqJ-P (C/W) Typ. 95 70 60 Typ. .06 3.3 3.3 3 1.0 0.8 RELATIVE INTENSITY 0.6 0.4 0.2 0.0 380 430 480 530 580 WAVELENGTH - nm 630 680 730 780 InGaN Blue InGaN Green AlInGaP Red Figure 2. Relative intensity vs. wavelength 60 50 FORWARD CURRENT - mA 40 30 20 10 0 0 1 2 FORWARD VOLTAGE - V 3 4 InGaN 3.00 2.50 2.00 1.50 1.00 0.50 0.00 InGaN AlInGaP AlInGaP RELATIVE LUMINOUS INTENSITY (NORMALIZATION AT 20 mA) 0 10 20 30 40 DC FORWARD CURRENT - mA 50 60 Figure 3. Forward current vs. forward voltage Figure 4. Relative Intensity vs. forward current 60 50 FORWARD CURRENT - mA 40 30 20 10 Derating Curve - 3 Chips On 0 0 20 40 60 80 100 120 InGaN AlInGaP FORWARD CURRENT - mA 60 50 40 30 20 10 Derating Curve - 1 Chip On 0 0 20 40 60 80 AMBIENT TEMPERATURE - C 100 120 InGaN AlInGaP AMBIENT TEMPERATURE - C Figure 5a. Maximum forward current vs. ambient temperature. Derated based on TJMAX = 125C, RJA = 600C/W (3 chip on). Figure 5b. Maximum forward current vs. ambient temperature. Derated based on TJMAX = 125C, RJA = 340C/W (1 chip on). 4 1 0.9 DOMINANT WAVELENGTH - nm 0.8 NORMALIZED INTENSITY 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 -90 -60 -30 0 30 60 90 650 600 550 500 450 400 AlINGaP Red InGaN Green InGaN Blue ANGULAR DISPLACEMENT - DEGREES 0 10 20 30 FORWARD CURRENT - mA 40 50 Figure 6. Radiation pattern. Figure 7. Dominant wavelength vs. forward current Figure 8. Recommended soldering land pattern. 5 20 SEC. MAX. TEMPERATURE 10 to 30 SEC. 255 - 260C 3C/SEC.MAX. 6C/SEC. MAX. 3 C/SEC. MAX. 60 - 120 SEC. TIME 100 SEC. MAX. TEMPERATURE 240C MAX. 3C/SEC. MAX. 100-150C 3C/SEC. MAX. 120 SEC. MAX. TIME 60-150 SEC. 183C -6C/SEC. MAX. 217 C 200 C 150 C Figure 9. Recommended leaded reflow soldering profile. Figure 10. Recommended Pb-free reflow soldering profile. (Acc. To J-STD-020C) Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN 1060 Surface Mounting SMT LED Indicator Components. Figure 11. Carrier Tape Dimension 2 +0.5 -0 180 20.5 0.3 62.5 +0 -2.5 13 0.2 13.2 0.50 (MEASURED AT OUTER EDGE) 16.2 0.50 (MAX. MEASURED AT HUB) LABEL AREA (111 mm x 57 mm) WITH DEPRESSION (0.25 mm) Figure 12. Reel Dimension. 6 USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 13. Reeling Orientation. Moisture Sensitivity This product is qualified as Moisture Sensitive Level 2a per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling of Moisture Sensitive Surface Mount Devices for details. A. Storage before use - Unopen moisture barrier bag (MBB) can be stored at <40C/90%RH for 12 months. If the actual shelf life has exceeded 12 months and the HIC indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. - It is not recommended to open the MBB prior to assembly (e.g. for IQC). B. Control after opening the MBB - The humidity indicator card (HIC) shall be read immediately upon opening of MBB. - The LEDs must be kept at <30C / 60%RH at all time and all high temperature related process including soldering, curing or rework need to be completed within 672 hours. C. Control for unfinished reel - For any unuse LEDs, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH. D. Control of assembled boards - If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure no LEDs have exceeded their floor life of 672 hours. E. Baking is required if: - "10%" or "15%" HIC indicator turns pink. - The LEDs are exposed to condition of >30C / 60% RH at any time. - The LEDs floor life exceeded 672 hours. Recommended baking condition: 605C for 20 hours. 7 Intensity Bin Select (X2X3) Individual reel will contain parts from 1 half bin only For ASMT-QTB2-0xxxx Min Iv Bin (Minimum Intensity Bin) X2 0 A B C D E F G H J K L M N P Q R S T U V W X Y Z 3 4 5 6 7 8 Color 1 (Red) 0 T T T T T T T T T T T T U U U U U U U U U U U U U U U U U U U U Color 2 (Green) 0 V V V V V V V V W W W W V V V V V V V V W W W W V V V V V V V V Color 3 (Blue) 0 S T T U S T T U S T T U S T T U S T T U S T T U S T T U S T T U X3 0 A B C D E F G H J K L M N P Q R S T U V W X Y Z 3 9 Note: 0 represents no maximum bin limit Number of Half bins from X2 Color 1 (Red) 0 4 4 4 4 4 4 4 4 4 3 3 3 3 3 3 3 3 3 Color 2 (Green) 0 4 4 4 3 3 3 4 4 4 3 3 3 4 4 4 3 3 3 Special Color 3 (Blue) 0 4 3 4 3 4 3 4 3 4 3 4 3 4 3 4 3 4 3 8 Intensity Bin Limits Bin ID S T T U U V V W W X X Y Min (mcd) 4.00 85.00 355.00 450.00 560.00 75.00 900.00 5.00 400.00 800.00 40.00 850.00 Max (mcd) 85.00 355.00 450.00 560.00 75.00 900.00 5.00 400.00 800.00 40.00 850.00 3550.00 Tolerance of each bin limit = 12% Color Bin Select (X4) Individual reel will contain parts from 1 full bin only For ASMT-QTB2-XXXXX Color Bin Combinations X4 0 Color 1 0 Color 2 0 Color 3 0 Color Bin Limits Blue B C Green C D Red Full Distribution Min (nm) 465.0 470.0 Min (nm) 55.0 530.0 Min (nm) 60.0 Max (nm) 470.0 475.0 Max (nm) 530.0 535.0 Max (nm) 630.0 Tolerance of each bin limit = 1nm 9 0.90 0.80 0.70 Green 0.60 CIE 1931 - Chromaticity Diagram CD Y-COORDINATE 0.50 0.40 0.30 0.20 Blue 0.10 0.00 0.00 C B 0.20 0.30 0.40 0.50 0.60 0.70 0.80 Red 0.10 X-COORDINATE Packaging Option (X5) Option Test Current 0mA Package Type Top Mount Reel Size 7 inch Handling Precaution The encapsulation material of the product is made of silicone for better reliability of the product. As silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product and cause premature failure. During assembly of handling, the unit should b e held on the body only. Please refer to Avago Application Note AN 5288 for detail information. For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright (c) 007 Avago Technologies Limited. All rights reserved. AV0-083EN - June 9, 007 |
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