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| ASMT-CB00 InGaN Blue, 0.4mm Low Profile Right Angle Surface Mount ChipLED Data Sheet Description The ASMT-CB00 of blue color chip-type LEDs is designed with the smallest footprint to achieve high density of components on board. They have the industry standard footprint 1.6 mm x 1.0 mm and a height of only 0.4 mm. This makes them very suitable for cellular phone and mobile equipment backlighting and indication application where space is a constraint. In order to facilitate automated pick and place operation, these ChipLEDs are shipped in conductive tape and reel, with 4000 units per reel. These part are compatible with IR soldering. Features * Small size right angle mount * 0603 industry standard footprint * 0.4 mm low profile type * Operating temperature range of -30C to +85 C * Compatible with IR reflow soldering process * Available in 8mm tape on 178mm (7') diameter reels * Reel sealed in zip locked moisture barrier bags Applications * LCD Backlighting * Keypad Side / Backlighting * Pushbutton backlighting * Symbol Indicator Package Dimension 1.60 0.063 0.20 0.008 0.20 0.008 1.00 0.039 1.20 0.047 R0.60 0.024 0.400.05 0.0160.002 0.50 0.020 SIDE VIEW 0.20 0.009 CATHODE MARK 0.30 0.012 TOP VIEW 0.30 0.012 0.35 0.014 0.30 0.012 0.35 0.014 TERMINAL VIEW Notes: 1. All dimensions will be in millimeters (inches) 2. Tolerance is 0.1mm (0.004 in) unless otherwise stated CAUTION: ASMT-CB00 LEDs are Class 1A ESD sensitive per JESD22-A114C.01. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Device Selection Guide Package Dimension (mm) 1.6 (L) x 1.0 (W) x 0.4 (H) Parts per Reel 4000 Package Description Untinted, Non-diffused Absolute Maximum Ratings at TA = 25C Parameter DC Forward Current [1] Power Dissipation Reverse Voltage (IR = 100A) LED Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature Note: 1. Derate linearly as shown in Figure 4. ASMT-CB00 10 3 5 95 -30 to +85 -40 to +85 See reflow soldering profile (Figure 7 & 8) Unit mA mW V C C C Electrical Characteristics at TA = 25C Forward Voltage VF (Volts) [1] @ IF = 5mA Part Number ASMT-CB00 Typ. .85 Max. 3.15 Reverse Breakdown VR (Volts) @ IR = 100A Min. 5 Thermal Resistance RJ-PIN (C/W) Typ. 450 Notes: 1. Vf tolerance : 0.1V Optical Characteristics at TA = 25C Luminous Intensity IV [1] (mcd) @ 5mA Part Number ASMT-CB00 Min. 7. Typ. 18 Peak Wavelength peak (nm) Typ. 469 Dominant Wavelength d [2] (nm) Typ. 473 Viewing Angle 2 1/2 [3] (Degrees) Typ. 150 Notes: 1. The luminous intensity IV is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the LED package. 2. The dominant wavelength, d, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. Light Intensity (IV) Bin Limits Intensity (mcd) Bin ID K L M Minimum 7.0 11.0 18.00 Maximum 11.0 18.00 8.50 Forward Voltage (VF) Bin Limits Forward Voltage (V) Bin ID 1 3 Tolerance : 0.1V Minimum .55 .75 .95 Maximum .75 .95 3.15 Tolerance : 15% Notes: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on current available bins. Color Bin Limits Dominant Wavelength (nm) Bin ID A B C D Tolerance : 1nm Minimum 460.0 465.0 470.0 475.0 Maximum 465.0 470.0 475.0 480.0 1 0.9 100 RELATIVE INTENSITY 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 400 450 500 550 600 650 700 FORWARD CURRENT - mA 0.8 10 1 0.1 2.0 2.5 3.0 3.5 4.0 WAVELENGTH - nm Figure 1. Relative intensity vs. wavelength FORWARD VOLTAGE - V Figure 2. Forward current vs. forward voltage 3 2.0 1.8 RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 5 mA) RELATIVE LUMINOUS INTENSITY 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 0 2 4 6 8 DC FORWARD CURRENT - mA 10 12 10 (NORMALIZED AT 5 mA) 8 6 4 2 0 0 20 40 60 80 100 DC FORWARD CURRENT - mA Figure 3. Luminous intensity vs. forward current Figure 4. Maximum forward current vs. ambient temperature 100 90 RELATIVE INTENSITY 80 70 60 50 40 30 20 10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE 0.8 (0.031) 1.2 (0.047) 0.15 (0.006) 0.4 (0.016) 0.4 (0.016) 0.7 (0.028) CENTERING BOARD 0.8 (0.031) Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.1mm (0.004in.) unless otherwise specified Figure 5. Radiation pattern Figure 6. Recommended soldering land pattern 10 SEC. MAX. TEMPERATURE TEMPERATURE 230C MAX. 140-160C 4C/SEC. MAX. OVER 2 MIN. TIME 4C/SEC. MAX. 3C/SEC. MAX. 255 - 260C 3C/SEC. MAX. 10 to 30 SEC. 217 C 200 C 150 C 6C/SEC. MAX. 3C/SEC. MAX. 60 - 120 SEC. TIME 100 SEC. MAX. Figure 7. Recommended reflow soldering profile Figure 8. Recommended Pb-free reflow soldering profile 4 USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 9. Reeling orientation 8.0 1.0 (0.315 0.039) 10.50 1.0 (0.413 0.039) 13.1 0.5 (0.516 0.020) 20.20 MIN. ( 0.795 MIN.) 3.0 0.5 (0.118 0.020) AE 178.40 1.00 (7.024 0.039) 59.60 1.00 (2.346 0.039) 4.0 0.5 (0.157 0.020) 6 PS 5.0 0.5 (0.197 0.020) Figure 10. Reel dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.1mm (0.004in.) unless otherwise specified. 5 4.00 0.10 0.157 0.004 1.50 0.059 DIM. C 1.75 0.069 8.00 0.30 0.315 0.012 SEE TABLE 1 0.20 0.02 0.008 0.001 DIM. A SEE TABLE 1 DIM. B [ SEE TABLE 1 ] 2.00 0.05 0.079 0.002 4.00 0.157 R 0.40 USER FEED DIRECTION COVER TAPE CARRIER TAPE Table1. PART NUMBER ASMT-CA00 DIM.A 0.10 (0.004) 1.75 (0.069) DIM.B 0.10 (0.004) 1.10 (0.043) DIM.C 0.10 (0.004) 0.60 (0.04) Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.1mm (0.004in.) unless otherwise specified. Dimensions In Millimeters (Inches) Figure 11. Tape dimensions END START THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. Figure 12. Tape leader and trailer dimensions MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Reflow Soldering For more information on reflow soldering, refer to Application Note AN-1060, Surface Mounting SMT LED Indicator Components. Storage Condition 5 to 30C @ 60%RH max.Baking is required before mounting, if 1. Humidity Indicator Card is > 10% when read at 23 5C. 2. Device expose to factory conditions <30C/60%RH more than 672 hours. Recommended baking condition: 605C for 20 hours. 6 For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright (c) 007 Avago Technologies Limited. All rights reserved. AV0-0587EN - July 8, 007 |
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