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HLMP-LD15, HLMP-LM17, HLMP-LB17
Precision Optical Performance Red, Green and Blue 4mm Standard Oval LEDs
Data Sheet
Description
These Precision Optical Performance Oval LEDs are specifically designed for full color/video and passenger information signs. The oval shaped radiation pattern and high luminous intensity ensure that these devices are excellent for wide field of view outdoor applications where a wide viewing angle and readability in sunlight are essential. These lamps have very smooth, matched radiation patterns ensuring consistent color mixing in full color applications, message uniformity across the viewing angle of the sign. High efficiency LED material is used in these lamps: Aluminum Indium Gallium Phosphide (AlInGaP II) for red and Indium Gallium Nitride for blue and green. Each lamp is made with an advanced optical grade epoxy offering superior high temperature and high moisture resistance in outdoor applications. The package epoxy contains both UV-A and UV-B inhibitors to reduce the effects of long term exposure to direct sunlight.
Features
* Well defined spatial radiation pattern * High brightness material * Available in red, green and blue color. - Red AlInGaP 630mm - Green InGaN 525nm - Blue InGaN 470nm * Superior resistance to moisture * Tinted and diffused
Benefits
* Viewing angle designed for wide filed of view applications * Superior performance for outdoor environments
Applications
* Full color signs * Commercial outdoor advertising.
Caution: InGaN devices are Class 1C HBM ESD sensitive per JEDEC standard. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.
A
6.3 0.248 9.65 0.380 21.0 MIN. 0.827 1.25 0.049 CATHODE LEAD 1.0 MIN. 0.038
2.9 0.114
3.7 0.146
2.540.3 0.1000.012
0.8 0.016 MAX. EPOXY MENISCUS
0.450.10 0.0180.004
0.40.1 0.0160.004
B
6.40.2 0.2520.008 9.100.20 0.3580.008 21.0MIN. 0.827 1.250.20 0.0490.008 1.0MIN. 0.038 2.40.2 .094.008 CATHODE LEAD
3.870.2 0.1520.008 0.8MAX. EPOXY MENISCUS 0.016
2.540.3 0.1000.012
0.450.10 0.0180.004
0.40.1 0.0160.004
Note: 1. Dimension in millimeters (inches). 2. Tolerance is 0.2mm unless otherwise noted. 3. For InGaN Blue and Green (package B), if heat-sinking application is required, the terminal for heat sink is anode.
Device Selection Guide
Color and Dominant Wavelength d (nm) Typ. Red 630 Red 630 Green 525 Blue 470 Luminous Intensity Iv (mcd) at 20 mA Min 520 680 1900 400 Max 1500 1900 5500 1150 Tinting Type Red Red Green Blue Package Drawing A A B B
Part Number HLMP-LD15-MQTXX HLMP-LD15-NRTxx HLMP-LM17-SV0xx HLMP-LB17-LP0xx
Notes: 1. The luminous intensity is measured on the mechanical axis of the lamp package 2. The tolerance for intensity limit is 15% 3. The optical axis is closely aligned with the package mechanical axis 4. The dominant wavelength, d, is derived from the Chromaticity Diagram and represents the color of the lamp.
2
Part Numbering System
H L M P - L X 1X - X X X XX Packaging Options 00: Bulk DD: Ammo Pack YY: Flexi-Bin, Bulk ZZ: Flexi-Bin, Ammo pack Color Bin Options 0: No color bin limitation T: Red Color with max VF of 2.6V Maximum Intensity Bin Refer to Device Selection Guide Minimum Intensity Bin Refer to Device Selection Guide Color D: 630nm Red M: 525nm Green B: 470nm Blue Package L: 4mm standard Oval
Note: Please refer to AB 5337 for complete information about part numbering system.
Absolute Maximum Rating (TA = 25oC)
Parameter DC Forward Current [1] Peak Forward Current Power Dissipation Reverse Voltage LED Junction Temperature Operating Temperature Range Storage Temperature Range
Notes: 1. Derate linearly as shown in Figure 4 and Figure 8. 2. Duty Factor 30%, frequency 1KHz. 3. Duty Factor 10%, frequency 1KHz.
Red 50 100[2] 130 5 (IR = 100 mA) 130 -40 to +100 -40 to +120
Blue and Green 30 100[3] 116 5 (IR = 10 mA) 130 -40 to +85 -40 to +100
Unit mA mA mW V
oC oC oC
3
Electrical/Optical Characteristics
Parameter Forward Voltage Red [1] Blue Green Reverse Voltage Red Blue Green Peak Wavelength Red Blue Green Dominant wavelength [2,3] Red Green Blue Spectral Half width Red Blue Green Capacitance Red Blue Green Thermal Resistance [4] Luminous Efficacy [5] Red Blue Green Luminous Flux Red Green Blue Luminous Efficiency [6] Red Green Blue Symbol VF Min. 2.0 2.8 2.8 5 5 5 639 464 516 622 520 460 630 525 470 17 23 32 40 65 64 240 634 540 480 Typ. 2.3 3.2 3.3 Max. 2.6 3.85 3.85 Units V Test Condition IF = 20 mA
VR
V
IR = 100 mA IR = 10 mA IR = 10 mA Peak of wavelength of spectral distribution at IF = 20 mA
peak
nm
d
nm
IF = 20 mA
D1/2
nm
Wavelength width at spectral distribution 1/2 power point at IF = 20 mA VF = 0, F = 1 MHz
C
pF
RqJ-PIN v
oC/W
LED Junction-to-pin Emitted luminous power/emitted radiant power
155 75 520 1300 3000 600 30 50 10
lm/W
jV
mlm
IF = 20 mA
e
lm/W
Luminous Flux/Electrical Power IF = 20 mA
Notes: 1. For option -xxTxx, VF maximum is 2.6V. Refer to VF bin table. 2. Tolerance for each color bin limit is 0.5 nm 3. The dominant wavelength d is derived from the Chromaticity Diagram and represents the color of the lamp. 4. For AlInGaP Red, thermal resistance applied to LED junction to cathode lead, and for InGaN Blue and Green, thermal resistance applied to LED junction to anode lead. 5. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = Iv/v where Iv is the luminous intensity in candelas and v is the luminous efficacy in lumens/watt. 6. e = jV / IF x VF , where jV is the emitted luminous flux, IF is electrical forward current and VF is the forward voltage.
4
AlInGaP Red
1.0
RELATIVE INTENSITY
0.5
0 500
550
600 WAVELENGTH - nm
650
700
Figure 1. Relative intensity vs. wavelength
IF MAX - MAXIMUM FORWARD CURRENT - mA
60 DC FORWARD CURRENT - mA RELATIVE INTENSITY (NORMALIZED AT 20 mA) 50 40 30 20 10 0 0 0.5 1.0 1.5 2.0 2.5 3.0
2.5 2.0 1.5 1.0 0.5 0
60 50 40 30 20 10 0
0
10
20
30
40
50
0
FORWARD VOLTAGE - V
FORWARD CURRENT - mA
20 40 60 80 TA - AMBIENT TEMPERATURE - oC
100
Figure 2. Forward current vs. forward voltage
Figure 3. Relative luminous intensity vs. forward current
Figure 4. Forward current vs. ambient temperature
InGaN Blue and Green
1.00
35 30 FORWARD CURRENT - mA
RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA)
1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 0 5 10 15 20 25 30 DC FORWARD CURRENT - mA
0.80
RELATIVE INTENSITY
BLUE 0.60 0.40 0.20 0 350
GREEN
25 20 15 10 5 0
400
450
500
550
600
650
0
1
2
3
4
WAVELENGTH - nm
FORWARD VOLTAGE - V
Figure 5. Relative intensity vs. wavelength
Figure 6. Forward current vs. forward voltage.
Figure 7. Relative luminous intensity vs. forward current.
5
IF - MAXIMUM FORWARD CURRENT - mA
35 30
RELATIVE DOMINANT WAVELENGTH
1.020 1.015 1.010 GREEN 1.005 BLUE 1.000 0.995
25 20 15 10 5 0 0 20 40 60 80 100
0
10
20
30
TA - AMBIENT TEMPERATURE - o C
FORWARD CURRENT, mA
Figure 8. Forward current vs. ambient temperature.
Figure 9. Relative dominant wavelength vs. forward current
1
NORMALIZED INTENSITY
0.5
0 0 30 60 90 120 150 180 ANGULAR DISPLACEMENT - DEGREES
Figure 10a. Spatial radiation pattern - major axis for RGB
1
NORMALIZED INTENSITY
0.5
0
0
30
60 90 120 ANGULAR DISPLACEMENT - DEGREES
150
180
Figure 10b. Spatial radiation pattern - minor axis for RGB
6
Intensity Bin Limit Table
Intensity (mcd) at 20 mA Bin L M N P Q R S T U V Min 400 520 680 880 1150 1500 1900 2500 3200 4200 Max 520 680 880 1150 1500 1900 2500 3200 4200 5500
Blue Color Bin Table
Bin 1 2 3 4 5 Min Dom 460.0 464.0 468.0 472.0 476.0 Max Dom 464.0 468.0 472.0 476.0 480.0 Xmin 0.1440 0.1818 0.1374 0.1766 0.1291 0.1699 0.1187 0.1616 0.1063 0.1517
Tolerance for each bin limit is 0.5nm
Ymin 0.0297 0.0904 0.0374 0.0966 0.0495 0.1062 0.0671 0.1209 0.0945 0.1423
Xmax 0.1766 0.1374 0.1699 0.1291 0.1616 0.1187 0.1517 0.1063 0.1397 0.0913
Ymax 0.0966 0.0374 0.1062 0.0495 0.1209 0.0671 0.1423 0.0945 0.1728 0.1327
Tolerance for each bin limit is 15%
Green Color Bin Table
Bin Min Dom 520.0 524.0 528.0 532.0 536.0 Max Dom 524.0 528.0 532.0 536.0 540.0 Xmin 0.0743 0.1650 2 3 4 5 0.1060 0.1856 0.1387 0.2068 0.1702 0.2273 0.2003 0.2469
Tolerance for each bin limit is 0.5nm
Ymin 0.8338 0.6586 0.8292 0.6556 0.8148 0.6463 0.7965 0.6344 0.7764 0.6213
Xmax 0.1856 0.1060 0.2068 0.1387 0.2273 0.1702 0.2469 0.2003 0.2659 0.2296
Ymax 0.6556 0.8292 0.6463 0.8148 0.6344 0.7965 0.6213 0.7764 0.6070 0.7543
VF bin Table (V at 20mA) [2]
Bin ID VA VB VC Min. 2.0 2.2 2.4 Max. 2.2 2.4 2.6
1
Tolerance for each bin limit is 0.05V.
Red Color Range
Min Dom 622 Max Dom 634 Xmin 0.6904 0.6726
Tolerance for each bin limit is 0.5nm Note: 1. All bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Avago Technologies representative for further information. 2. VF bin table only available for those AlInGaP Red devices with options -xxTxx.
Ymin 0.3094 0.3106
Xmax 0.6945 0.7135
Ymax 0.2888 0.2865
7
Avago Color Bin on CIE 1931 Chromaticity Diagram
1.000
0.800 Green 1 2 3 4 5
0.600
Y 0.400
Red 0.200 5 4 3 Blue 2 1 0.200 0.300 0.400 X 0.500 0.600 0.700 0.800
0.000 0.000 0.100
Relative Light Output vs Junction Temperature
10
RELATIVE LIGHT OUTPUT (NORMALIZED at TJ = 25C)
GREEN 1
RED
BLUE
0.1 -40 -20 0 20 40 60 80 100 120 TJ - JUNCTION TEMPERATURE - C
8
Precautions:
Lead Forming: * The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. * For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. * If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Soldering and Handling: * Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. * LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron's tip) to the body is 1.59mm. Soldering the LED using soldering iron tip closer than 1.59mm might damage the LED.
1.59mm
Note: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB. 2. Avago Technologies' high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 250C and the solder contact time does not exceeding 3sec. Over-stressing the LED during soldering process might cause premature failure to the LED due to delamination.
Avago Technologies LED configuration
Cathode
Anode
AlInGaP Device
InGaN Device
* ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Do refer to Avago application note AN 1142 for details. The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. * Recommended soldering condition:
Wave Soldering [1, 2] Manual Solder Dipping
* Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process. * At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. * If PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. * Recommended PC board plated through holes (PTH) size for LED component leads.
LED component lead size Diagonal Plated through hole diameter
Note: Electrical connection between bottom surface of LED die and the lead frame is achieved through conductive paste.
Pre-heat temperature Preheat time Peak temperature Dwell time
105 C Max. 60 sec Max 250 C Max. 3 sec Max.
260 C Max. 5 sec Max
Note: 1) Above conditions refers to measurement with thermocouple mounted at the bottom of PCB. 2) It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED.
0.45 x 0.45 mm (0.018x 0.018 inch) 0.50 x 0.50 mm (0.020x 0.020 inch)
0.636 mm (0.025 inch) 0.707 mm (0.028 inch)
0.98 to 1.08 mm (0.039 to 0.043 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch)
* Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions.
* Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can cause difficulty inserting the TH LED.
Refer to Application Note 5334 for more information about soldering and handling of high brightness TH LED lamps.
Example of Wave Soldering Temperature Profile for TH LED
TURBULENT WAVE 250 LAMINAR WAVE HOT AIR KNIFE
Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin flux
200
Solder bath temperature: 245C 5C (maximum peak temperature = 250C) Dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force.
150
100
50 PREHEAT
0
10
20
30
40
50 60 TIME (MINUTES)
70
80
90
100
Ammo Packs Drawing
Note: The ammo-packs drawing is applicable for packaging option -DD & -ZZ and regardless standoff or non-standoff
10
Packaging Box for Ammo Packs
FROM LEFT SIDE OF BOX ADHESIVE TAPE MUST BE FACING UPWARDS.
LABEL ON THIS SIDE OF BOX
ANODE LEAD LEAVES THE BOX FIRST.
Note: For InGaN device, the ammo pack packaging box contain ESD logo
Packaging Label
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
(1P) Item: Part Number (1T) Lot: Lot Number LPN (9D) MFG Date: Manufacturing Date (P) Customer Item: (V) Vendor ID
STANDARD LABEL LS0002 RoHS Compliant e1 max temp 250C (Q) QTY: Quantity CAT: Intensity Bin BIN: Refer to below information REV: DeptID:
Made In: Country of Origin 11
(ii) Avago Baby Label (Only available on bulk packaging)
RoHS Compliant e1 max temp 250C PART #: Part Number LOT#: Lot Number MFG DATE: Manufacturing Date C/O: Country of Origin Customer P/N: Supplier Code: CAT: Intensity Bin BIN: Refer to below information DATECODE: Date Code QUANTITY: Packing Quantity
Acronyms and Definition: BIN: (i) Color bin only or VF bin only (Applicable for part number with color bins but without VF bin OR part number with VF bins and no color bin) OR (ii) Color bin incorporated with VF Bin (Applicable for part number that have both color bin and VF bin) Example: (i) Color bin only or VF bin only BIN: 2 (represent color bin 2 only) BIN: VB (represent VF bin "VB" only) (ii) Color bin incorporate with VF Bin BIN: 2VB VB: VF bin "VB" 2: Color bin 2 only
DISCLAIMER: AVAGO'S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.
For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other countries. Data subject to change. Copyright (c) 2006 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0293EN AV02-0364EN - July 26, 2007

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