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AMERICAN BRIGHT OPTOELECTRONICS CORP.
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Gap DOMILED BL-PDP-GJS Series
Feature: 1. Surface mount LED. 2. 120 viewing angle. 3. Small package outline (LxWxH) of 3.2 x 2.8 x 1.8 mm. 4. Qualified according to JEDEC moisture sensitivity Level 2. 5. Compatible to both IR reflow soldering and TTW soldering.
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Package Dimension:
Recommended Solder Pad
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AMERICAN BRIGHT OPTOELECTRONICS CORP.
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Gap DOMILED BL-PDP-GJS Series
Optical Characteristics:
Part Number BL-PDP-GJS-C10
* * * BIN G1 BIN G2 BIN H1 BIN H2
Chip Technology / Color GaP / Green, 560 nm
Luminous Intensity @ If = 10mA Iv ( mcd ) 1.80 ... 4.50
1.80 ... 2.24 2.24 ... 2.80 2.80 ... 3.55 3.55 ... 4.50
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Forward voltage @ If=10 mA. 2.05 V (typ.); 2.45 V (max) NOTE:
Chip Type GaP
Viewing angle at 50% Iv 120
Reverse current, IR @ VR = 5V, (max) 100 A
1. Other luminous intensity groups are also available upon request. 2. Luminous intensity is measured with an accuracy of 11%. 3. Wavelength binning is carried for all units as per the wavelength-binning table. Only one wavelength group is allowed for each reel. 4. An optional Vf binning is also available upon request. Binning scheme is as per following table.
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Absolute Maximum Ratings:
Maximum Value DC forward current. Peak pulse current; (tp 10 s, Duty cycle = 0.005) Reverse voltage. LED junction temperature. Operating temperature. Storage temperature. Power dissipation ( at room temperature ) 30 500 5 100 -40 ... +100 -40 ... +100 75 Unit mA mA V C C C mW
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Vf Binning: Vf Bin @ 10mA 01 02 03 04 Forward voltage (V) 1.25 ... 1.55 1.55 ... 1.85 1.85 ... 2.15 2.15 ... 2.45
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AMERICAN BRIGHT OPTOELECTRONICS CORP.
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Gap DOMILED BL-PDP-GJS Series
Wavelength Grouping: Color
BL-PDP; Pure Green
Group
Full W X Y Z
Wavelength distribution (nm)
552.5 - 564.5 552.5 - 555.5 555.5 - 558.5 558.5 - 561.5 561.5 - 564.5
Wavelength is measured with an accuracy of 1 nm.
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Relative intensity. Normalized at 10 mA.
Typical electro-optical characteristics curves:
Fig. 2 Forward current vs. forward voltage.
Forward Current vs. Forward Voltage
35
Fig. 1 Relative luminous intensity vs. forward current.
Intensity vs. DC Forw ard Current
4.0
Forward Current (mA)
3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 5 10 15 20 25 30 35 FORW ARD CURRENT (m A)
30 25 20 15 10 5 0 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6
Forward Voltage (V)
Fig. 3 Radiation pattern
30 20 10 0
1.0
Fig. 4 Maximum forward current vs. temperature
35
30
40
0.8
25 Forward Current, If
50
0.6
20
15
60 70 80 90
0.4
10
0.2
5
0 0 10 20 30 40 50 60 70 80 90 100 Ambient Temperature
0
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AMERICAN BRIGHT OPTOELECTRONICS CORP.
Gap DOMILED BL-PDP-GJS Series
Fig. 5 Recommended IR-reflow Soldering Profile (acc. to IPC 9501)
Classification Reflow Profile (JEDEC J-STD-020B)
275 250 225 Ramp-up 3 oC/sec 60-150s 235-240oC 10-30s
Temperature ( C)
200 175 150 125 100 75 50
o
183 oC
Ramp-down 6 oC/sec Preheat 60-120s 360s max
25 0 50 100 150 200
Time (sec)
Fig. 6 Recommended TTW Soldering Profile (acc. to CECC 00802).
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AMERICAN BRIGHT OPTOELECTRONICS CORP.
Gap DOMILED BL-PDP-GJS Series
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Taping And Orientation.
Reels come in quantity of 2000 units. Reel diameters is 180 mm .
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