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IR-Lumineszenzdiode Infrared Emitter SFH 4271
Wesentliche Merkmale * Schwarz eingefarbtes TOPLED-Gehause * Typische Emissionswellenlange 880nm * Verbesserte Abbildungseigenschaften durch Absorption der Seitenstrahlung * Groe der Leuchtquelle 300m x 300m * IR Reflow und TTW Loten geeignet * Feuchte-Empfindlichkeitsstufe 2 nach JEDEDC Standard J-STD-020A Anwendungen * Miniaturlichtschranken und Lichtschranken uber groe Entfernungen * Industrieelektronik * Messen/Steuern/Regeln" * Automobiltechnik * Sensorik * Alarm- und Sicherungssysteme * IR-Freiraumubertragung Typ Type SFH 4271
1)
Features * Black coloured TOPLED-package * Typical Peakwavelength 880nm * Improved imaging characteristics due to absorption of side emission * Size of emitting area 300m x 300m * Suited for IR Reflow and TTW-soldering * Moisture sensitivity level 2 according to JEDEDC Standard J-STD-020A Applications * * * * * * * Miniature and long distance photointerrupters Industrial electronics For drive and control circuits Automotive technology Sensor technology Alarm and safety equipment IR free air transmission
Bestellnummer Ordering Code Q65110A1013
Strahlstarkegruppierung 1) (IF = 100 mA, tp = 20 ms) Radiant intensity grouping 1) Ie (mW/sr) 1 ... 5
gemessen bei einem Raumwinkel = 0.01 sr / measured at a solid angle of = 0.01 sr
2004-01-23
1
SFH 4271
Grenzwerte (TA = 25 C) Maximum Ratings Bezeichnung Parameter Betriebs- und Lagertemperatur Operating and storage temperature range Sperrspannung Reverse voltage Durchlastrom Forward current Stostrom, = 10 s, D = 0 Surge current Verlustleistung Power dissipation Symbol Symbol Wert Value - 40 ...+ 100 5 100 2.5 180 450 Einheit Unit C V mA A mW K/W
Top; Tstg VR IF IFSM Ptot
Warmewiderstand Sperrschicht - Umgebung bei RthJA Montage auf FR4 Platine, Padgroe je 16 mm2 Thermal resistance junction - ambient mounted on PC-board (FR4), padsize 16 mm2 each RthJS Warmewiderstand Sperrschicht - Lotstelle bei Montage auf Metall-Block Thermal resistance junction - soldering point, mounted on metal block
200
K/W
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2
SFH 4271
Kennwerte (TA = 25 C) Characteristics Bezeichnung Parameter Wellenlange der Strahlung Wavelength at peak emission IF = 100 mA, tp = 20 ms Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 100 mA Abstrahlwinkel Half angle Aktive Chipflache Active chip area Abmessungen der aktiven Chipflache Dimensions of the active chip area Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, bei IF = 100 mA, RL = 50 Switching times, e from 10% to 90% and from 90% to 10%, IF = 100 mA, RL = 50 Kapazitat, Capacitance VR = 0 V, f = 1 MHz Durchlaspannung, Forward voltage IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 s Sperrstrom, Reverse current VR = 5 V Gesamtstrahlungsflu, Total radiant flux IF = 100 mA, tp = 20 ms Temperaturkoeffizient von Ie bzw. e, Symbol Symbol peak Wert Value 880 Einheit Unit nm
80
nm
60 0.09 0.3 x 0.3 0.5
Grad deg. mm2 mm s
A Lx B Lx W tr , tf
Co
15
pF
VF VF IR
1.5 (1.8) 3.0 (3.8) 0.01 (1)
V V A
e
5
mW
TCI
- 0.5
%/K
IF = 100 mA
Temperature coefficient of Ie or e, IF = 100 mA
Temperaturkoeffizient von VF, IF = 100 mA Temperature coefficient of VF, IF = 100 mA Temperaturkoeffizient von , IF = 100 mA Temperature coefficient of , IF = 100 mA
2004-01-23
TCV TC
-2 + 0.25
mV/K nm/K
3
SFH 4271
Strahlstarke Ie in Achsrichtung gemessen bei einem Raumwinkel = 0.01 sr Radiant Intensity Ie in Axial Direction at a solid angle of = 0.01 sr Bezeichnung Parameter Strahlstarke Radiant intensity IF = 100 mA, tp = 20 ms Strahlstarke Radiant intensity IF = 1 A, tp = 100 s Symbol -L Ie min Ie max Ie typ 1 2 16 Werte Values -M 1.6 3.2 20 -N 2.5 5.0 24 mW/sr Einheit Unit
mW/sr
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4
SFH 4271
Relative Spectral Emission Irel = f ()
100 rel % 80
OHR00877
Radiant Intensity
e = f (IF) e 100 mA
OHR00878
Single pulse, tp = 20 s
10 2 e (100mA) 10 1 e
Max. Permissible Forward Current IF = f (TA)
120
OHR00883
F mA
100
80
60
10 0
R thjA = 450 K/W 60
40
10 -1
40
20
10 -2
20
0 750
10 -3
0
10 0 10 1 10 2 10 3 mA 10 4 F
800
850
900
950 nm 1000
0
20
40
60
80
100 C 120 TA
IF = f (VF) single pulse, tp = 20 s
10 1
OHR00881
Forward Current
Permissible Pulse Handling Capability IF = f (tp), TA = 25 C duty cycle D = parameter
10 4 mA
OHR00886
F
A
F
0
10
D = 0.005 0.01 0.02 0.05 10 3 0.1 0.2
10 -1
0.5 10 2 DC tp
10 -2
D= tp T
F
T
10 -3
0
1
2
3
4
5
6
V VF
8
10 1 -5 10 10 -4 10 -3 10 -2 10 -1 10 0
10 1 s 10 2 tp
Radiation Characteristics Sel = f ()
40 30 20 10 0
OHL01660
1.0
50
0.8
0.6 60 0.4 70 0.2 80 90 100 1.0 0.8 0.6 0.4 0 20 40 60 80 100 120 0
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5
SFH 4271
Mazeichnung Package Outlines
3.0 (0.118) 2.6 (0.102) 2.3 (0.091) 2.1 (0.083)
2.1 (0.083) 1.7 (0.067) 0.1 (0.004) (typ) 0.9 (0.035) 0.7 (0.028)
41
(2.4 (0.094))
3.4 (0.134) 3.0 (0.118)
0.18 (0.007) Anode marking 0.12 (0.005)
1.1 (0.043) 0.5 (0.020)
0.6 (0.024) 0.4 (0.016)
GPLY6059
Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch). Gehausefarbe: schwarz, Verguss klar Brechungsindex Verguss: 1.53 Package Colour: black, resin colourless clear Refractive index resin: 1.53
2004-01-23
6
3.7 (0.146) 3.3 (0.130)
SFH 4271
Lotbedingungen Vorbehandlung nach JEDEC Level 2 Soldering Conditions Preconditioning acc. to JEDEC Level 2
IR-Reflow Lotprofil (nach IPC 9501) IR Reflow Soldering Profile (acc. to IPC 9501)
OHLY0597
300 C T 250 240-245 C 10-40 s 183 C 120 to 180 s 150
200
ramp-down rate up to 6 K/s defined for Preconditioning: up to 6 K/s ramp-up rate up to 6 K/s
100
50 defined for Preconditioning: 2-3 K/s 0 0 50 100 150 t 200 s 2
2004-01-23
7
SFH 4271
Wellenloten (TTW) TTW Soldering (nach CECC 00802) (acc. to CECC 00802)
300 C T 250 235 C ... 260 C
OHLY0598
10 s
Normalkurve standard curve 2. Welle 2. wave Grenzkurven limit curves
200 1. Welle 1. wave 150 100 C ... 130 C 100 2 K/s 50 Zwangskuhlung forced cooling ca 200 K/s 5 K/s 2 K/s
0 0 50 100 150 t 200 s 250
2004-01-23
8
SFH 4271
Empfohlenes Lotpaddesign Recommended Solder Pad IR-Reflow Loten IR Reflow Soldering
2.6 (0.102)
1.5 (0.059)
4.5 (0.177)
2.6 (0.102)
Padgeometrie fur verbesserte Warmeableitung Paddesign for improved heat dissipation Lotstopplack Solder resist Cu-Flache > 16 mm 2 Cu-area > 16 mm 2
OHLPY970
Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch) Gehause fur Wellenloten (TTW) geeignet / Package suitable for TTW-soldering Mae werden wie folgt angegeben: mm (inch) / Dimensions are specified as follows: mm (inch).
2004-01-23
9
1.5 (0.059)
4.5 (0.177)
SFH 4271
Published by OSRAM Opto Semiconductors GmbH & Co. OHG Wernerwerkstrasse 2, D-93049 Regensburg (c) All Rights Reserved. Attention please! The information describes the type of component and shall not be considered as assured characteristics. All typical data and graphs have been determined on a sample base and don't represent the whole production range. For technical improvements, the typical data may be changed without any further notice. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2004-01-23 10

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