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| LX1705 TM (R) 8+8W Stereo Filterless Class-D Amplifier PRODUCTION DATA SHEET DESCRIPTION KEY FEATURES Filter Free Operation 6W +6W Output Power @ 8 load: THD+N < 1% High Efficiency > 90% Full Audio Bandwidth: 20Hz to 20kHz Low Distortion < 0.25% @ 30% Max Power, 1kHz High Signal-to-Noise Ratio: 90dB Wide Supply Voltage Range 5.0V ~ 15V 5mA Per Channel Typical Quiescent Current Turn ON/OFF POP Free Standby / Mute Feature Built-in Under Voltage Lockout Thermal Protection WWW .Microsemi .C OM The LX1705 is a fully integrated stereo class-D CMOS audio amplifier. optimized for highly efficient operation and minimum system cost. The stereo BTL (Bridge-tied-load) configuration uses 3-level PWM modulation. This allows eliminating the LC filter to reduce the system cost and simplify the system design. The LX1705 outputs 8W into each of two channels with better than 90% efficiency. The entire signal path from input to output is differential to reject any sources of common-mode noise or distortion. The part features on-board H-bridge output stages with low RDSON. External bootstrap capacitors are all that is required to provide the gate drive to the all-NFET output stage since on-board bootstrap diodes are provided. The LX1705 also features Mute and Standby modes, POP-free turn-on and turn-off, under-voltage lockout for both input supplies, and multi-level overtemperature protection. The LX1705 is offered in a small thermally efficient footprint, low profile surface mountable 32-pin Micro Lead Quad Package (MLPQ) in 5mm x 5 mm. APPLICATIONS IMPORTANT: For the most current data, consult MICROSEMI's website: http://www.microsemi.com LCD TV Car Navigation MP3 Docking Stations Portable Sound System PRODUCT HIGHLIGHT STBY 5V AVSS1 PVSS1N OUT1N BOOT1N PVDD1 AVSS2 PVSS2N OUT2N BOOT2N V5V STATUS N.C. ROSC TMON PVDD PVDD1 BOOT1P OUT1P LX1705 TCTRL MUTE VREF IN1P N.C. STBY PVDD2 PVDD2 BOOT2P OUT2P PVDD PVSS1P IN1N PVSS2P IN2P IN2N LX1705 LX1705 IN2N IN1N IN1P IN2P MUTE PACKAGE ORDER INFO TA (C) -40 to 85 LQ Plastic MLPQ 32-Pin 5mm x 5mm RoHS Compliant / Pb-free LX1705ILQ Note: Available in Tape & Reel. Append the letters "TR" to the part number. (i.e. LX1705ILQ-TR) Copyright (c) 2007 Rev. 1.2, 2007-03-20 Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 1 LX1705 TM (R) 8+8W Stereo Filterless Class-D Amplifier PRODUCTION DATA SHEET ABSOLUTE MAXIMUM RATINGS Power Supply Voltage (PVDD) ................................................................... -0.3V to 16.5V BOOTP/N - PVDD ......................................................................................... -0.3 to 16.5V Bias Supply Voltage (V5V) ................................................................................. -0.3 to 6V Input Pins (IN1P/N, IN2P/N ,TCTRL, STBY, MUTE) ......................-0.3V to V5V + 0.3V Output Pins (VREF, STATUS, ROSC, TMON) .................................-0.3V to V5V + 0.3V Maximum Operating Junction Temperature .............................................................. 150C Storage Temperature Range.........................................................................-65C to 150C Package Peak Temp. for Solder Reflow (40 seconds maximum exposure) ... 260C (+0 -5) Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to AVSS, except as noted. Currents are positive into, negative out of specified terminal. PACKAGE PIN OUT WWW .Microsemi .C OM BOOT1N BOOT1P 30 PVSS1N PVSS1P 32 OUT1N OUT1P 31 PVDD1 29 PVDD1 28 27 26 25 24 23 22 21 20 19 18 17 STBY IN1P IN1N N.C. N.C. IN2N IN2P MUTE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 TCTRL TMON AVSS2 ROSC VREF AVSS1 V5V STATUS PVSS2P OUT2P BOOT2P PVDD2 PVDD2 BOOT2N OUT2N PVSS2N THERMAL DATA LQ PACKAGE (Top View) LQ Plastic MLPQ 32-Pin 5mm x 5mm THERMAL RESISTANCE-JUNCTION TO AMBIENT, JA Pb-free 100% Matte Tin Pin Finish 21.6C/W Junction Temperature Calculation: TJ = TA + (PD x JA). The JA numbers are guidelines for the thermal performance of the device/pc-board system. All of the above assume no ambient airflow. P D PACKAGE DATA Copyright (c) 2007 Rev. 1.2, 2007-03-20 Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 2 LX1705 TM (R) 8+8W Stereo Filterless Class-D Amplifier PRODUCTION DATA SHEET FUNCTIONAL PIN DESCRIPTION Name PVSS1P PVSS1N PVSS2P PVSS2N PVDD1 PVDD2 V5V AVSS1 AVSS2 IN1N IN1P IN2N IN2P OUT1N OUT1P OUT2N OUT2P BOOT1N BOOT1P BOOT2N BOOT2P VREF Function Pin Number(s) 32 25 16 9 28,29 12,13 18 19 22 3 2 6 7 26 31 15 10 27 30 14 11 20 Description WWW .Microsemi .C OM Power Ground Power Supply Power Supply Analog Ground Analog Input Power Ground for the two H-bridge output drivers, connect to power ground plane Power Supply for the two H-bridge output drivers. Current draw will be up to 1.6A at 2 x 8W into 8. These are peak currents when the part is run at maximum rated power on both channels. Analog Power Supply for the analog signal processing section. Analog Ground for the analog signal processing section. Must be at the same potential as PVSS, connect at one point to the power ground plane. Differential analog audio inputs for each channel. The common mode voltage will be set by the LX1705 to around 2.25V. Differential high power audio outputs for each channel. Each output will swing between PVDD and PVSS. These outputs are driven by an on-chip H-bridge output driver which uses low RDSON NFETs. Bootstrap voltage pins which provide the high voltage needed to drive the upper NFET. A bootstrap capacitor should be placed between the respective output and these pins. Digital Output Bootstrap Analog Output CMOS Input CMOS Input CMOS Output Analog Input Test Pin Test Pin No connect Typical 2.25V reference voltage which serves as an internal reference. An external compensation capacitor of at least 1uF should be connected between this pin and AVSS. Logic level control which mutes the audio signal when high. Logic level control which places the chip into sleep mode when high. Digital monitoring pin which is used to flag internal fault states. This pin will be synchronized with the internal clock to prevent glitches. See the STATUS flag list (below) for a summary of which conditions will force this pin to go high. Frequency control pin. A resistor between this pin and AVSS will set the oscillation frequency for the Class-D modulator. Test purpose only, Connect to AVSS1 Test purpose only, left open. No Connect, pin is open MUTE STBY STATUS ROSC TCTRL TMON N.C. 8 1 17 21 24 23 4,5 P D PACKAGE DATA The STATUS pin will go high under any of the following conditions: STBY is high. This indicates that the chip is in "stand-by" mode. V5V is below the V5V UVLO threshold. PVDD is below the PVDD UVLO threshold. The die temperature is above about 140C. This indicates that the part has gone in to gain foldback. A short circuit across the speaker has caused the output devices to shut off due to excessive temperature. Copyright (c) 2007 Rev. 1.2, 2007-03-20 Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 3 LX1705 TM (R) 8+8W Stereo Filterless Class-D Amplifier PRODUCTION DATA SHEET ELECTRICAL CHARACTERISTICS Unless otherwise specified, the following specifications apply over the operating ambient temperature -40C < TA < 85C except where otherwise noted and the following test conditions: PVDD = 12V, PVSS = AVSS = 0V, V5V = 5V, RROSC = 24.9k Parameter OSCILLATOR Oscillator Frequency Temperature Stability POWER SUPPLY Supply Voltage UVLO UVLO Hysteresis +5V Supply UVLO UVLO Hysteresis Stand-By Current Operating Current Stand-By Current Operating Current Power Supply Rejection Ratio Reference Voltage GAIN Stage Gain Mute Gain OFFSET Output DC Offset INPUT STAGE Input Resistance Common Mode Voltage OUTPUT STAGE MOSFET On Resistance THERMAL Thermal Shut Down Junction Temperature Thermal Gain Fold-back Temperature Thermal Recovery Temperature MUTE / STBY MUTE Threshold STBY Threshold MUTETH STBYTH Mute Mode RDSON IDS = 200mA 220 m RIN VCM 22 2.25 k V VOFFSET Measured Differentially. Channel + to Channel 40 mV G GMUTE f = 1kHz; VMUTE = 0V VMUTE = 5V 26 -40 dB 1 WWW .Microsemi .C OM Symbol Test Conditions Min Varies with ROSC resistor value, value shown is for default conditions. TA = -40C to 85C LX1705 Typ Max Units FOSC 250 300 2 350 kHz % PVDD PVDD PVDD V5V V5V V5V IQQ IQQ IQQ5V5 IQQ5V5 PSRR VREF For PVDD, STBY high For PVDD, STBY low, Mute high For 5V5, STBY high For 5V5, STBY low, Mute high For PVDD @ 1kHz C bypass = 1F Start-up Voltage , Rising Start-up Voltage, Rising 5 12 4.5 500 15 4.9 V mV 4.5 4.25 250 10 10 10 7 55 2.25 5.5 4.50 V mV 50 30 A mA A 15 mA dB V E ELECTRICALS TSD TFB TREC 150 140 110 C V5V 2 V5V 2 V ms STBY To Output Enable Note 1: Not ATE Tested. Copyright (c) 2007 Rev. 1.2, 2007-03-20 5 Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 4 LX1705 TM (R) 8+8W Stereo Filterless Class-D Amplifier PRODUCTION DATA SHEET TYPICAL SYSTEM APPLICATION CHARACTERISTICS Unless otherwise specified, the following specifications apply over the operating ambient temperature -40C < TA < 85C except where otherwise noted and the following conditions: PVDD = 12V, PVSS = AVSS = 0V, V5V = 5V, ROSC = 25k, RL = 8. Parameter AUDIO CHARACTERISTICS Symbol Test Conditions LX1705 Typ Units WWW .Microsemi .C OM Min Max Output Power Stereo PO THD+N < 1% THD+N <10% POUT = 50% of Maximum Power, FIN = 1kHz with diodes POUT = 50% of Maximum Power, FIN = 1kHz No diodes POUT = 1W, FIN = 20Hz~20kHz POUT = Max, THD+N < 1% 6 8 0.2 0.5 0.4 90 -60 3 26 -40 90 200 W Total Harmonic Distortion Stereo THD+N % Power Efficiency Channel Crosstalk Audio Bandwidth Stage Gain Stereo High Low SNR VN VXTALK BW % POUT = 1W, FIN = 1kHz POUT = 1W, FIN = 20-20kHz VIN = 200mVRMS, F = 20Hz~20kHz VIN = 2VRMS, FIN = 20Hz~20khz FIN = 1kHz @ 20Hz-20kHz A-weighted Input short, non A-weighted @ 20Hz-20kHz dB Signal to Noise Ratio Output Noise Floor dB VRMS E ELECTRICALS Copyright (c) 2007 Rev. 1.2, 2007-03-20 Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 5 LX1705 TM (R) 8+8W Stereo Filterless Class-D Amplifier PRODUCTION DATA SHEET SIMPLIFIED BLOCK DIAGRAM WWW .Microsemi .C OM PVDD1 MUTE VREF PVSS1P BOOT1P IN1P IN1N + - + PWM - NFET H-BRIDGE OUT1P BOOT1N OUT1N VREF MUTE PVSS1N MUTE PVDD OSC ROSC VREF V5V STBY MUTE TCTRL AVSS1 CONTROL BLOCK -UVLO -De-Pop Mute -Thermal STATUS TMON AVSS2 PVDD2 MUTE VREF PVSS2P BOOT2P IN2P IN2N + - + PWM - NFET H-BRIDGE OUT2P BOOT2N OUT2N VREF MUTE BLOCK DIAGRAM BLOCK DIAGRAM PVSS2N Figure 1 - Simplified Block Diagram Copyright (c) 2007 Rev. 1.2, 2007-03-20 Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 6 LX1705 TM (R) 8+8W Stereo Filterless Class-D Amplifier PRODUCTION DATA SHEET TEST SYSTEM SET-UP WWW .Microsemi .C OM 8 TO 4 OHM SPEAKER LOAD OR SPEAKER SIMULATOR +5V +/- 0.5V POWER SUPPLY TB2 AVSS LOW PASS FILTER TB4 OUT1P OUT1N J1 LOW PASS FILTER IN1P + V5V CHA AUDIO ANALYZER OUTPUT CHB TB1 PVDD LX1705 PVSS LOW PASS FILTER IN1N J2 IN2P +5V TO +15V POWER SUPPLY CHA AUDIO ANALYZER INPUT CHB TB3 OUT2N IN2N OUT2P LOW PASS FILTER LX1705 EVALUATION BOARD 8 TO 4 OHM SPEAKER LOAD OR SPEAKER SIMULATOR Figure 2 - System Test Set-up Diagram Note: Speaker Load is simulated with 8 resistor in series with 66H inductor for 8 speaker and 4 resistor in series with 33H inductor for 4 speaker A APPLICATIONS Copyright (c) 2007 Rev. 1.2, 2007-03-20 Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 7 LX1705 TM (R) 8+8W Stereo Filterless Class-D Amplifier PRODUCTION DATA SHEET APPLICATION CIRCUITS WWW .Microsemi .C OM TEST PURPOSE +VIN RTN TB1 CR2 1N5817 OUTR+ +5V RTN TB1 VIN TP1 GND C7 1F C8 1F J1 C9 1F C10 1F C21 4.7nF VIN C2 22F 6.3V +5V OUTRTP2 1P TP3 1N C1 47F 25V VIN CR1 1N5817 R8 470 R9 470 TP4 RT-P C23 4.7nF C24 2.2nF TEST PURPOSE R6 470 R7 470 TP5 RT-N C22 2.2nF SLEEP RCA Jack INR+ INRJP1 HEADER 1 INLINL+ JP2 HEADER 2 J2 +5V C3 0.47F C4 0.47F STBY IN1P IN1N N/C N/C IN2N IN2P MUTE Part LX1705 PVDD1 PVDD1 BOOT1N OUT1N PVSS1N U1 PVSS1P OUT1P BOOT1P +5V SW1 TCTRL TMON AVSS2 ROSC VREF AVSS1 V5V R1 24.9K C11 1F C5 0.47F C6 0.47F PVDD2 PVDD2 BOOT2N OUT2N PVSS2P OUT2P BOOT2P PVSS2N STATUS C12 1F TP6 STATUS +5V M L RCA Jack N Header 3x2 C13 1F VIN C14 1F C15 1F TP7 GND +5V C16 1F TP8 2P TP9 2N VIN TEST PURPOSE TP10 LEFT-N R10 124K R2 470 C17 4.7nF R3 470 C18 2.2nF R11 75K CR8 1N5817 OUTLOUTL+ CR7 1N5817 TEST PURPOSE APPLICATIONS APPLICATIONS TP1 LEFT-P R4 470 C19 4.7nF R5 470 C20 2.2nF Note 1: CR1, CR2, CR7, CR8 can be used for lower distortion performance. Figure 3 - Typical Application Copyright (c) 2007 Rev. 1.2, 2007-03-20 Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 8 LX1705 TM (R) 8+8W Stereo Filterless Class-D Amplifier PRODUCTION DATA SHEET FUNCTIONAL DESCRIPTION FILTERLESS CLASS-D MODULATION The LX1705 drives each output between PVDD and PVSS using an all-NFET, bootstrapped, H-bridge driver for each channel. High efficiency is obtained by forcing all transistors to operate either completely on or completely off as required for a true class-D amplifier. The entire signal path from input to output is differential to reject any sources of common-mode noise or distortion. Even the triangle wave operates differentially. Filterless class-D modulation operates such that with no input signal, the outputs switch at the programmed clock frequency and are in-phase with each other. Because the two signals are identical, the differential signal to the speaker is zero. As a direct result, there is no requirement for a low-pass LC filter to present high impedance at the modulation frequency. This allows a cheaper and simpler audio amplifier to be designed. As the input signal goes positive, the duty cycle to the positive output increases while the duty cycle of the negative output decreases. This produces a net positive current flow into the load. A negative signal reduces the positive output duty cycles and increases the negative output duty cycle. The differential signal actually appears at twice the modulation frequency and alternates between +PVDD, 0, and -PVDD which allows the parasitic inductance of the load to effectively filter the switching signal so that only the audio band portion remains. Because each speaker is driven by an in-phase signal, the common mode voltage to the speaker switches at the full PVDD amplitude at the clock frequency. This is a possible source of EMI radiation. Typically, a ferrite bead is placed with a small common-mode filter capacitor to reduce EMI generation by filtering the edges of the output signals. NOISE-FREE TURN-ON AND OFF signal is de-asserted and the audio input signal is allowed to drive the pulse-width-modulator which then adjusts the output duty cycle as necessary to drive the speaker. At turn-off, the internal mute signal is asserted to silence the input audio signal. The outputs continue switching in this muted condition for about 0.6ms prior to being pulled low. Once the outputs are forced low, the error amplifier is reset so that the part is ready to begin a new power-up sequence. This scheme basically limits the pop noise at turn-on or off to be no larger than the differential offset voltage of the error amplifier. AC-COUPLING AND BOOTSTRAP CAPACITORS WWW .Microsemi .C OM Input AC-coupling capacitors should be used to block any input DC and low frequency components below the desired low frequency corner. Since the input resistance to the LX1705 is 25k, a 20Hz low frequency corner can be achieved with a 0.33F AC-coupling capacitor. 1F bootstrap capacitors are required at each output to supply the gate drive voltage for the upper level NFET in each half-bridge. THERMAL OVERLOAD PROTECTION The LX1705 protects itself by monitoring its operating temperature in two different ways. A general thermal protection scheme monitors the overall die temperature. Above 140C, the amplifier gain is reduced by 6dB so that the audio signal is still amplified, but the on-chip power dissipation is halved. When the die temperature goes below 110C, the amplifier gain is restored. Above 150C, the LX1705 forces all outputs to PVSS so that no power is dissipated until the chip cools down to 110C. A dynamic thermal protection scheme operates by placing temperature sensors near each of the output devices. When a differential temperature rise of about 60C occurs above the core die temperature, the outputs are disabled to protect the part. This provides short circuit protection for differential shorts across the output. Shorts to PVDD and ground (PVSS) are not protected. Noise-free turn-on and off is accomplished by carefully sequencing the signal path when the amplifier is enabled or disabled. Prior to turn-on, the outputs are initially both at PVSS so there is no differential signal. The internal error amplifier is held in a reset condition so that the internal loop compensation components are "ready to go". When the outputs begin to toggle, the audio signal path is muted for about 1.6ms. Following that time, the internal mute A APPLICATIONS Copyright (c) 2007 Rev. 1.2, 2007-03-20 Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 9 LX1705 TM (R) 8+8W Stereo Filterless Class-D Amplifier PRODUCTION DATA SHEET APPLICATION NOTE/PCB DESIGN GUIDELINE OSCILLATOR The value of ROSC selects the switching frequency, smaller values increase the switching frequency. See Figure 4, Typical Switching Frequency vs. ROSC. The recommended range of ROSC is between 17.5K and 42.5K Sw itching Frequency vs ROSC 450 SW FREQ (kHz) 400 350 300 250 200 150 17.5 22.5 27.5 32.5 37.5 42.5 WWW .Microsemi .C OM PCB DESIGN GUIDELINES Component placement for the LX1705 should be done such that low-level inputs to the LX1705 are routed away from the high frequency switching outputs. Special care should be given to the bypass and bootstrap capacitors. Capacitors (C7, C10, C13, C16, C8, C9, C14, and C15 in the application schematic), should be placed as close to the IC as possible. If workable, they should be mounted on the same layer as the IC, with a direct connection to the IC on that layer. It is best not to use vias to establish the critical connection of these components to the LX1705. Bypass capacitors for V5V input, as well as VREF (C11 and C12 in the application schematic), should be mounted close to the IC as well. One of the key efforts in implementing the MLP package on a pc board is the design of the land pattern. The MLP has a rectangular exposed thermal pad on the bottom surface of the package body. Electrical and mechanical connection between the component and the pc board is made by screen printing solder paste on the pc board and then reflowing the paste after placement. To guarantee reliable solder joints it is essential to properly design the land pattern to the MLP terminal pattern, exposed thermal pad, and thermal pad vias. There are two basic designs for PCB land pads for the MLP: Copper Defined style (also known as Non Solder Mask Defined (NSMD)) and the Solder Mask Defined style (SMD). The industry has had some debate on the merits of both styles and although Microsemi recommends the Copper Defined style land pad (NSMD). Both styles are acceptable for use with the MLP package. NSMD pads are recommended over SMD pads due to the tighter tolerance on copper etching than solder masking. NSMD by definition also provides a larger copper pad area and allows the solder to anchor to the edges of the copper pads thus providing improved solder joint reliability. Due to the 0.5mm pitch of the LX1705's 5x5mm MLPQ package, it is recommended to design the solder mask around all pads on each side, rather than individual mask openings on each pad. ROSC (kOhm s) Figure 4 - Typical Switching Frequency vs. ROSC BOOTSTRAP CAPACITORS C8, C9, C14, and C15 are bootstrap capacitors for internal NMOSFETs gate drive voltage, they work together with internal diodes to provide sufficient gate drive voltage for upper MOSFETS. Those capacitors should be placed as close to the IC as possible. BYPASSING CAPACITORS C7, C10, C11, C12, C13, and C16 are bypassing capacitors for input supplies and internal reference voltage (VREF), nominal value is 1F. These capacitors should be placed as close to the IC as possible, to guarantee low ripple and noise. A APPLICATIONS Copyright (c) 2007 Rev. 1.2, 2007-03-20 Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 10 LX1705 TM (R) 8+8W Stereo Filterless Class-D Amplifier PRODUCTION DATA SHEET APPLICATION NOTE/PCB DESIGN GUIDELINE (CONTINUED) EXPOSED PAD PCB DESIGN The construction of the Exposed Pad MLP enables enhanced thermal and electrical characteristics. In order to take full advantage of this feature the exposed pad must be physically connected to the PCB substrate with solder. The exposed pad is internally connected to the die substrate, so it is very important that the PCB substrate potential be connected to the same potential as AVSS. The PCB thermal pad dimensions should be greater than the dimensions of the MLPQ thermal pad whenever possible; however adequate clearance must be met to prevent solder bridging to the outer pads. A minimum clearance of 0.2mm is recommended. If this clearance cannot be met, then the PCB thermal pad should be reduced in area. THERMAL PAD VIA DESIGN 5.56mm [0.219] 3.40mm [0.134] WWW .Microsemi .C OM 0.50mm [0.020] TYP. 32 PLS. 1.20mm [0.047] 6 PLS. 5.56mm [0.219] 1.20mm [0.047] 6 PLS. O0.30mm [O0.012] 9 PLS. 3.40mm [0.134] 0.30mm [0.012] MAX. 32 PLS. ] 10 .0 [0 S. L m m 4P 25 . 0. MIN 0.81mm [0.032] There are two types of on-board thermal pad designs: one using thermal vias to sink the heat to an inner layer utilizing a copper plane. Based on the JEDEC Specification (JESD 51-5) the thermal vias should be designed similar to Figure 5, with the following specifications: Via Barrel diameter: 0.3mm Min. Via Barrel plating: 0.025mm Center to center spacing: 1.2mm For the LX1705 5x5mm MLPQ package, there will be enough space for 9 vias. This method is recommended for use on a multilayer board, and will give the best thermal performance. Thermal vias may be used on a two layer board as well, with reduced performance. Another method is the no via thermal pad, which uses only the copper pad as a heat sink, and relies on the PCB substrate material for thermal conduction. This type of thermal pad is good for a two layer board; however thermal performance will not be as good as the thermal via method on a multilayer board. Figure 5 - Recommended Land Pad with Vias for 5x5mm LQ package A APPLICATIONS Copyright (c) 2007 Rev. 1.2, 2007-03-20 Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 11 LX1705 TM (R) 8+8W Stereo Filterless Class-D Amplifier PRODUCTION DATA SHEET THD+N VS. OUTPUT POWER 100 50 20 10 5 2 1 0.5 % 0.2 0.1 0.05 0.02 0.01 0.005 0.002 0.001 60m 100m 200m 500m 1 W 2 5 10 20 % 0.2 0.1 0.05 0.02 0.01 0.005 0.002 0.001 THD+N VS. OUTPUT POWER 12V, 8 Ohm Load with External Diodes 100 50 20 10 5 2 1 0.5 12V, 8 Ohm Load, No External Diodes WWW .Microsemi .C OM 60m 100m 200m 500m 1 W 2 5 10 20 THD+N VS. OUTPUT POWER 9V, 4 Ohm Load No External Diodes 100 50 20 10 5 2 1 0.5 % 0.2 0.1 0.05 0.02 0.01 0.005 0.002 0.001 60m 100m 200m 500m 1 W 2 5 10 20 % 0.2 0.1 0.05 0.02 0.01 0.005 0.002 0.001 100 50 20 10 5 2 1 0.5 THD+N VS. OUTPUT POWER 9V, 4 Ohm Load, With External Diodes 60m 100m 200m 500m 1 W 2 5 10 20 THD+N VS. FREQUENCY 100 50 20 10 5 2 1 0.5 % 0.2 0.1 0.05 0.02 0.01 0.005 0.002 0.001 20 50 100 200 500 Hz 1k 2k 5k 10k 20k THD+N VS. FREQUENCY 100 50 20 10 5 2 1 0.5 % 0.2 0.1 0.05 0.02 0.01 0.005 0.002 0.001 20 50 100 200 500 Hz 1k 2k 5k 10k 20k 12V, 8 Ohm Load, No External Diodes 12V, 8 Ohm Load, With External Diodes CHARTS CHARTS Copyright (c) 2007 Rev. 1.2, 2007-03-20 Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 12 LX1705 TM (R) 8+8W Stereo Filterless Class-D Amplifier PRODUCTION DATA SHEET THD+N VS. FREQUENCY 100 50 20 10 5 2 1 0.5 % 0.2 0.1 0.05 0.02 0.01 0.005 0.002 0.001 20 50 100 200 500 Hz 1k 2k 5k 10k 20k % 0.2 0.1 0.05 0.02 0.01 0.005 0.002 0.001 20 THD+N VS. FREQUENCY 100 50 20 10 5 2 1 0.5 9V, 4 Ohm Load, No External Diodes 9V, 4 Ohm Load, With External Diodes WWW .Microsemi .C OM 50 100 200 500 Hz 1k 2k 5k 10k 20k THD VS. POWER SUPPLY 8 Ohm Load, 6V, 9V, 12V, 15V 100 50 20 10 5 2 1 0.5 % 0.2 0.1 0.05 0.02 0.01 0.005 0.002 0.001 60m 100m 200m 500m 1 W 2 5 10 20 % 0.2 0.1 0.05 0.02 0.01 0.005 0.002 0.001 60m 100 50 20 THD VS. POWER SUPPLY 4 Ohm Load, 5V, 6V, 7V, 8V, 9V 6V 15V 10 5 2 1 0.5 5V 9V 100m 200m 500m 1 W 2 5 10 20 OUTPUT POWER BANDWIDTH @ 1% THD 30 20 OUTPUT POWER BANDWIDTH @ 1% THD 9V, 4 Ohm Load 10 9 8 12V, 8 Ohm Load 10 8 6 5 W 4 3 2 7 6 CHARTS CHARTS W 5 4 1 800m 600m 20 50 100 200 500 Hz 1k 2k 5k 10k 20k 3 20 50 100 200 500 Hz 1k 2k 5k 10k 20k Copyright (c) 2007 Rev. 1.2, 2007-03-20 Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 13 LX1705 TM (R) 8+8W Stereo Filterless Class-D Amplifier PRODUCTION DATA SHEET PSRR @ 8 OHM PSRR @ 8 ohm +0 -10 -20 -30 -40 CHANNEL CROSSTALK @ 8 OHM +0 -10 -20 -30 -40 dB -50 -60 -70 -80 -90 -100 20 Channel Crosstalk @ 8 ohm WWW .Microsemi .C OM PVDD CURRENT VS. OUTPUT POWER 2.50 dBr -50 -60 -70 -80 -90 -100 20 50 100 200 500 Hz 1k 2k 5k 10k 20k 50 100 200 500 Hz 1k 2k 5k 10k 20k SIGNAL TO NOISE RATIO @ 8 OHM +0 -10 -20 -30 -40 NOISE FLOOR @ 8 OHM +0 -10 -20 -30 -40 -50 -60 -70 -80 -90 dBV SNR @ 8 ohm Noise Floor @ 8 ohm PVDD Supply Current (A) 2.00 Efficiency 1.50 1.00 0.50 0.00 0 2 4 6 8 10 12 14 16 Output Power - 2 Channels Total (WattsRMS) Copyright (c) 2007 Rev. 1.2, 2007-03-20 dBr -50 -60 -70 -80 -90 -100 20 -100 -110 50 100 200 500 Hz 1k 2k 5k 10k 20k -120 20 50 100 200 500 Hz 1k 2k 5k 10k 20k EFFICIENCY 100% 90% 80% 70% 60% 50% 40% 30% 20% 10% 0% 0 2 4 6 8 10 12 14 16 18 Output Power - 2 Channels Total (Watts RMS) PVDD Current Vs. Output Power Efficiency C CHARTS Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 14 LX1705 TM (R) 8+8W Stereo Filterless Class-D Amplifier PRODUCTION DATA SHEET IQQ VS. FREQUENCY 40 +30 GAIN @ 8 OHM GAIN @ 8 ohm +28 +26 WWW .Microsemi .C OM 35 30 25 IQQ (mA) 20 15 10 5 0 150k 250k 350k 450k 550k 650k 750k 850k 950k 1,050k 1,150k dBr +24 +22 +20 +18 +16 +14 +12 +10 +8 +6 +4 +2 +0 20 50 100 200 500 1k Hz 2k 5k 10k 20k 50k 80k SW Freq. (Hz) C CHARTS Copyright (c) 2007 Rev. 1.2, 2007-03-20 Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 15 LX1705 TM (R) 8+8W Stereo Filterless Class-D Amplifier PRODUCTION DATA SHEET PACKAGE DIMENSIONS WWW .Microsemi .C OM LQ 32-Pin MLPQ Plastic (5x5mm EP) D Top E A L A1 e A3 Side Dim A A1 A3 b D D2 E E2 e L Note: MILLIMETERS MIN MAX 0.80 1.00 0 0.05 0.20 REF 0.18 0.30 5.00 BSC 3.30 3.55 5.00 BSC 3.30 3.55 0.50 BSC 0.30 0.50 INCHES MIN MAX 0.031 0.039 0 0.002 0.008 REF 0.007 0.012 0.197 BSC 0.130 0.140 0.197 BSC 0.130 0.140 0.02 BSC 0.012 0.020 b E2 Pin 1 ID Bottom D2 1. Dimensions do not include mold flash or protrusions; these shall not exceed 0.155mm(.006") on any side. Lead dimension shall not include solder coverage. M MECHANICALS Copyright (c) 2007 Rev. 1.2, 2007-03-20 Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 16 LX1705 TM (R) 8+8W Stereo Filterless Class-D Amplifier PRODUCTION DATA SHEET NOTES WWW .Microsemi .C OM NOTES NOTES PRODUCTION DATA - Information contained in this document is proprietary to Microsemi and is current as of publication date. This document may not be modified in any way without the express written consent of Microsemi. Product processing does not necessarily include testing of all parameters. Microsemi reserves the right to change the configuration and performance of the product and to discontinue product at any time. Copyright (c) 2007 Rev. 1.2, 2007-03-20 Microsemi Analog Mixed Signal Group 11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570 Page 17 |
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