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ML145583
3.3 Volt Only Driver/Receiver with an Integrated Standby Mode
RS 232/EIA-232-E and CCITT V.28
Legacy Device: Motorola MC145583
The ML145583 is a CMOS transceiver composed of three drivers and five receivers that fulfills the electrical specifications of EIA-232-E, EIA-562, and CCITT V while operating from a single + 3.3 or + 5.0 V .28 power supply. This transceiver is a high-performance, low-power consumption device that is equipped with a standby function. A voltage tripler and inverter converts the + 3.3 V to 8.8 V or a volt, age doubler and inverter converts the + 5.0 V to 8.8 V This is accom. plished through an on-chip 40 kHz oscillator and five inexpensive external capacitors. FEATURES Drivers: * 5 V Minimum Output Swing at 3.3 or 5.0 V Power Supply * 300 Power-Off Impedance * Output Current Limiting * Three-State Outputs During Standby Mode
C5+
28 1
SOIC 28W = -7P SOG PACKAGE CASE 751F
PACKAGE SOIC 28W
MOTOROLA MC145583DW
LANSDALE ML145583-7P
Note: Lansdale lead free (Pb) product, as it becomes available, will be identified by a part number prefix change from ML to MLE.
PIN ASSIGNMENT
1 2 3 4 5 6 7 8 9 10 11 12 13 14 RING MONITOR CIRCUIT (INVERTING) 28 27 26 25 24 23 22 21 20 19 18 17 16 15 C2+ VCC C2- C1+ C1- VDD DO1 DO2 DO3 DI1 DO4 DI2 DO5 DI3
Receivers: * 25 V Input Range * 3 to 7 k Input Impedance * 0.8 V Hysteresis for Enhanced Noise Immunity * Three-State Outputs During Standby Mode Ring Monitor Circuit: * Invert the Input Level on Rx1 to Logic Output Level on RIMON at Standby Mode
GND C5- RIMON VSS STB Rx1 Rx2 Rx3 Tx1 Rx4 Tx2 Rx5 Tx3
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ML145583
FUNCTION DIAGRAM
CHARGE PUMPS OSC
LANSDALE Semiconductor, Inc.
VCC VOLTAGE TRIPLER VOLTAGE INVERTER
GND
C3
+ C1
+ C4
VDD
C2 C5+ +
C5 C5-
VSS
C1-
C1+
C2- +
C2+
**
RECEIVER VDD
*
15 k + - 5.4 k
STB
VCC
DO
1.0 V TURN OFF
* Protection Circuit. ** Capacitors C1 and C2 are replaced by a 1 F capacitor at VCC = 5.0 V supply. DRIVER VDD STB
1.8 V TURN ON
VCC
Tx
300
LEVEL SHIFTER
+ -
DI 1.4 V
VSS
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LANSDALE Semiconductor, Inc.
ML145583
MAXIMUM RATINGS (Voltage polarities referenced to GND)
Rating DC Supply Voltage Input Voltage DC Current per Pin Power Dissipation Operating Temperature Range Storage Temperature Range Rx1 - Rx5 Inputs DI1 - DI3 Inputs Symbol VCC VIR I PD TA Tstg Value - 0.5 to + 6.0 VSS - 15 to VDD + 15 - 0.5 to VCC + 0.5 100 1 - 40 to + 85 - 85 to + 150 Unit V V mA W C C This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, it is recommended that the voltage at the DI and DO pins be constrained to the range GND VDI VCC and GND VDO VCC. Also, the voltage at the Rx pin should be constrained to (VSS - 15 V) VRx1 - Rx5 (VDD + 15 V), and Tx should be constrained to VSS VTx1 - Tx3 VDD. Unused inputs must always be tied to an appropriate logic voltage level (e.g., GND or VCC for DI, and GND for Rx). Min 3.0 4.5 - 40 Typ 3.3 5.0 -- Max 3.6 5.5 85 Unit V C
RECOMMENDED OPERATING LIMITS
Parameter Power Supply Operating Temperature Range * Capacitors C1 and C2 are replaced by a 1 F capacitor at VCC = 5 V. Symbol VCC VCC* TA
DC ELECTRICAL CHARACTERISTICS (Voltage polarities referenced to GND = 0 V; C1 - C5 = 1 F; TA = 25C)
Parameter DC Power Supply Quiescent Supply Current (Output Unloaded, Input Low) Quiescent Supply Current (Standby Mode; STB = 1, Output Unloaded) Control Signal Input Voltage (STB) Control Signal Input Current (STB) Charge Pumps Output Voltage (VCC = 3 V; C1, C2, C3, C4, C5 = 1 F) Output Voltage (VDD) Iload = 0 mA Iload = 6 mA Output Voltage (VSS) Iload = 0 mA Iload = 6 mA Symbol VCC ICC ICC(STB) VIL VIH IIL IIH VDD 8.5 7.5 VSS -- -- 8.8 7.9 - 8.8 - 7.8 -- -- - 8.5 - 7.0 Min 3.0 -- -- -- VCC - 0.5 -- -- Typ 3.3 2.8 <5 -- -- -- -- Max 3.6 6.0 10 0.5 -- 10 10 Unit V mA A V A V
RECEIVER ELECTRICAL SPECIFICATIONS
(Voltage polarities referenced to GND = 0 V; VCC = + 3.3 V Parameter Input Turn-On Threshold (VDO1 - DO5 = VOL; Rx1 - Rx5) Input Turn-Off Threshold (VDO1 - DO5 = VOH; Rx1 - Rx5) Input Resistance High-Level Output Voltage (DO1 - DO5) VRx1 - Rx5 = - 3 to - 25 V Low-Level Output Voltage (DO1 - DO5) VRx1 - Rx5 = + 3 to + 25 V Ring Monitor Circuit (Input Threshold) High-Level Output Voltage (RIMON) Low-Level Output Voltage (RIMON) Iout = - 20 A Iout = - 1 mA Iout = + 20 A Iout = + 1.6 mA Iout = - 20 A Iout = - 1 mA Iout = + 20 A Iout = + 1.6 mA 3.3 V 5.0 V 3.3 V 5.0 V 10%; C1 - C5 = 1 F; TA = 25C) Symbol Von Voff Rin VOH VOL VTH VOH VOL Min 1.35 2.00 0.75 1.20 3 VCC - 0.1 VCC - 0.6 -- -- -- VCC - 0.1 VCC - 0.6 -- -- Typ 1.8 2.5 1.0 1.5 5.4 -- 2.7 0.01 0.5 1.1 -- 2.7 0.01 0.5 Max 2.35 3.10 1.25 1.80 7 -- -- 0.1 0.7 -- -- -- 0.1 0.7 Unit V V k V V V V V
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ML145583
LANSDALE Semiconductor, Inc.
DRIVER ELECTRICAL SPECIFICATIONS
(Voltage polarities referenced to GND = 0 V; VCC = + 3.3 V or + 5.0 V Parameter Digital Input Voltage Logic Low Logic High DI1 - DI3 VIL VIH IIL IIH VOH -- 1.8 -- -- 5.0 8.5 VOL -- -- VRF Zoff ISC -- -- -- -- -- 300 - 7.0 - 8.8 -- -- - 5.0 - 8.5 5% -- 60 100 mA -- -- 7 -- 7.0 8.8 0.7 -- A -- 1.0 V -- -- V 10%; C1 - C5 = 1 F; TA = 25C) Symbol Min Typ Max Unit V
Digital Input Current DI1 - DI3 VDI = GND VDI = VCC Output High Voltage Load on All Tx1 - Tx3, RL = 3 k; CP = 2500 pF, VDI1 - DI3 = Logic Low No Load Output Low Voltage Load on All Tx1 - Tx3, RL = 3 k; CP = 2500 pF, VDI1 - DI3 = Logic High No Load Ripple (Refer to VDD - VSS Value) *** Off Source Impedance Output Short Circuit Current (VCC = 3.3 V or 5.5 V) Tx1 - Tx3 Shorted to GND* Tx1 - Tx3 Shorted to 15 V** Tx1 - Tx3
* Specification is for one Tx output to be shorted at a time. Should all three driver outputs be shorted simultaneously, device power dissipation limits could be exceeded. ** This condition could exceed package limitations. *** Ripple VRF would not exceed 5% of (VDD - VSS).
SWITCHING CHARACTERISTICS (VCC = + 3.3 V or + 5 V, 10%; C1 - C5 = 1 F; TA = 25C)
Parameter Symbol Min Typ Max Unit
Drivers
Propagation Delay Time Low-to-High (RL = 3 k, CL = 50 pF or 2500 pF) High-to-Low (RL = 3 k, CL = 50 pF or 2500 pF) Output Slew Rate (Source R = 300 ) Loading: RL = 3 - 7 k; CL = 2500 pF Output Disable Time* Output Enable Time* Tx1 - Tx3 Tx1 - Tx3 tDPLH -- tDPHL -- SR tDAZ tDZA 4 -- -- 0.5 -- 4 25 1 30 10 50 V/s s ms 0.5 1 s
Receivers
Propagation Delay Time Low-to-High High-to-Low Output Rise Time Output Fall Time Output Disable Time* Output Enable Time* * Including the charge pump setup time. DO1 - DO5 DO1 - DO5 DO1 - DO5 tRPLH tRPHL tr tf tRAZ tRZA -- -- -- -- -- -- -- -- 120 40 4 25 1 1 200 100 10 50 ns ns s ms s
TRUTH TABLES Drivers
DI X H L * VSS STB H L L VTx VDD Tx Z* L H X = Don't Care
Receivers
Rx X H L * GND STB H L L VDO VCC DO Z* L H X = Don't Care
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LANSDALE Semiconductor, Inc.
ML145583
PIN DESCRIPTIONS VCC Digital Power Supply (Pin 27) This digital supply pin is connected to the logic power supply. This pin should have a not less than 0.33 F capacitor GND. GND Ground (Pin 2) Ground return pin is typically connected to the signal ground pin of the EIA-232-E connector (Pin 7) as well as to the logic power supply ground. VDD Positive Power Supply (Pin 23) This is the positive output of the on-chip voltage tripler and the positive power supply input of the driver/receiver sections of the device. This pin requires an external storage capacitor to filter the 50% duty cycle voltage generated by the charge pump. VSS Negative Power Supply (Pin 5) This is the negative output of the on-chip voltage tripler/inverter and the negative power supply input of the driver/ receiver sections of the device. This pin requires an external storage capacitor to filter the 50% duty cycle voltage generated by the charge pump. RIMON Ring Monitor Circuit (Pin 4) The Ring Monitor Circuit will convert the input level on Rx1 pin at standby mode and output on the RIMON pin. STB Standby Mode (Pin 6) The device enters the standby mode while this pin is connected to
the logic high level. During the standby mode, driver and receiver output pins become high-impedance state. In this condition, supply current ICC is below 5 A (typ). C5+, C5-, C2+, C2-, C1+, C1- Voltage Tripler and Inverter (Pins 1, 3, 28, 26, 25, 24) These are the connections to the internal voltage tripler and inverter, which generate the VDD and VSS voltages. Rx1, Rx2, Rx3, Rx4, Rx5 Receive Data Inputs (Pins 7, 8, 9, 11, 13) These are the EIA-232-E receive signal inputs. A voltage between + 3 and + 25 V is decoded as a space, and causes the corresponding DO pin to swing to GND (0 V). A voltage between - 3 and - 25 V is decoded as a mark, and causes the DO pin to swing up to VCC. DO1, DO2, DO3, DO4, DO5 Data Outputs (Pins 22, 21, 20, 18, 16) These are the receiver digital output pins, which swing from VCC to GND. Output level of these pins is high impedance while in standby mode. DI1, DI2, DI3 Data Inputs (Pins 19, 17, 15) These are the high impedance digital input pins to the drivers. Input voltage levels on these pins must be betweenVCC and GND. Tx1, Tx2, Tx3 Transmit Data Output (Pins 10, 12, 14) These are the EIA-232-E transmit signal output pins, which swing toward VDD and VSS. A logic 1 at a DI input causes the corresponding Tx output to swing toward VSS. The actual levels and slew rate achieved will depend on the output loading (RL/CL). The minimum output impedance is 300 when turned off.
SWITCHING CHARACTERISTICS
DRIVER DI1 - DI3 (INPUT) +3V 50% 0V tf Tx1 - Tx3 (OUTPUT) tDPHL RECEIVER Rx1 - Rx5 (INPUT) +3V 50% 0V DO1 - DO5 (OUTPUT) tRPHL 90% 10% tf tr tRPLH VOH VOL tRAZ DO1 - DO5 (OUTPUT) 90% 10% tRZA HIGH Z 90% 10% STB (INPUT) + 1.5 V + 1.5 V 0V VOH VOL 90% 10% tDPLH RECEIVER + 3.3 V tr VOH VOL Tx1 - Tx3 (OUTPUT) tDAZ +5V -5V tDZA HIGH Z +5V STB (INPUT) + 1.5 V + 1.5 V 0V VOH DRIVER + 3.3 V
-5V V OL
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ML145583
LANSDALE Semiconductor, Inc.
ESD PROTECTION ESD protection on IC devices that have their pins accessible to the outside world is essential. High static voltages applied to the pins when someone touches them either directly or indirectly can cause damage to gate oxides and transistor junctions by coupling a portion of the energy from the I/O pin to the power supply buses of the IC. This coupling will usually occur
through the internal ESD protection diodes which are designed to do just that. The key to protecting the IC is to shunt as much of the energy to ground as possible before it enters the IC. Figure 1 shows a technique which will clamp the ESD voltage at approximately 15 V using the MMBZ15VDLT1. Any residual voltage which appears on the supply pins is shunted to ground through the capacitors C1and C2.
C5+ GND MMBZ15VDLT1 x 8 C5- RIMON VSS STB Rx1 Rx2 Rx3 Tx1 Rx4 Tx2 Rx5 Tx3
C2+ VCC C2- C1+ C1- VDD DO1 DO2 DO3 DI1 DO4 DI2 DO5 DI3 0.1 F C2 0.1 F C1
Figure 1. ESD Protection Scheme
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ML145583
LANSDALE Semiconductor, Inc.
OUTLINE DIMENSIONS
SOIC 28W = -7P (ML145583-7P) SOG PACKAGE CASE 751F-04
15 14X NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM A B C D F G J K M P R MILLIMETERS MIN MAX 17.80 18.05 7.60 7.40 2.65 2.35 0.49 0.35 0.90 0.41 1.27 BSC 0.32 0.23 0.29 0.13 8 0 10.05 10.55 0.25 0.75 INCHES MIN MAX 0.701 0.711 0.292 0.299 0.093 0.104 0.014 0.019 0.016 0.035 0.050 BSC 0.009 0.013 0.005 0.011 0 8 0.395 0.415 0.010 0.029
-A28
-B1 28X D 14
P 0.010 (0.25)
M
B
M
0.010 (0.25)
M
TA
S
B
S
M R X 45
-T26X
C G K -TSEATING PLANE
F J
Lansdale Semiconductor reserves the right to make changes without further notice to any products herein to improve reliability, function or design. Lansdale does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights nor the rights of others. "Typical" parameters which may be provided in Lansdale data sheets and/or specifications can vary in different applications, and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by the customer's technical experts. Lansdale Semiconductor is a registered trademark of Lansdale Semiconductor, Inc.
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