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 VS6590
0.5 Megapixel Camera Module
DATA BRIEF
FEATURES 1 SMIA 1.0 profile 0 compliant image sensor

0.5 Megapixel resolution (800H x 600V) CCP 1.0 serial video interface Two-wire control port (CCI) On-chip PLL with 6.5 to 27 MHz system clock Up to 30 frame per second (fps) progressive scan with smooth frame rate control Horizontal downscale at x1, x1.5, x2.0, x2.5 and x3.0 Operation from 2.4 V analog power supply Low EMI 1.8 V digital and I/O power supply 15 W power down consumption 10-bit on-chip ADC Small size 1/4-inch lens fixed focus module Integral EMC shielding The VS6590 features allow straightforward integration into mobile phone designs: low EMI video interface and package/socket shielding, low wire count (8 total), embedded power management with ultra low power-down current and embedded PLL. A minimal list of external components is required: supply decoupling capacitors, CCI pull-ups and a charge-pump capacitor. The VS6590 2-element lens design ensures high quality image capture while maintaining low module height. The overall optical stack, including lens system, IR filter and sensor optical structures is developed within ST. The VS6590 package uses the second generation of SmOP (Small Optical Package) packaging technology; sensor and lens are assembled in a fully automated test and focus process for high volume and low cost production. This 0.5 Megapixel sensor fits within a space efficient form factor (9.5 x 8.5 x 6.1 mm3). APPLICATIONS Mobile phone


DESCRIPTION The VS6590 is a 0.5 Megapixel camera module for use across a range of mobile phone platforms. The electrical and logical interfaces to the camera module are SMIA 1.0 profile 0 compliant and are capable of generating 0.5 Megapixel images at up to 30 fps. Based on the SMIA architectural concepts, the VS6590 can be used with or without image processor (e.g. STV0976). This camera module is suitable for performance-driven camera phones and cost-driven high volume designs. The embedded horizontal scaler typically enables the realization of power efficient viewfinder using host software processing. For performance driven applications, or when a different video interface is required, the STV0976 mobile imaging processor ensures state-of-the-art image reconstruction and compression of SVGA images at up to 30 fps.
PDA Wireless security camera
Table 1. Order Codes
1.Standard Mobile Imaging Architecture, visit www.smia-forum.org
Part Number VS6590V02C/T2
Description SmOP2 22" tape and reel
Rev. 1 October 2004 1/3
VS6590
Figure 1. VS6590 Application Diagram VS6590
0.5 Megapixel SMIA Camera Module
Table 2. Technical Specifications
Active pixels Pixel size Array size Color filter array Exposure control Analog gain 800H x 600V 4.0 x 4.0 m 3.232 x 2.432 mm2 RGB Bayer +120 dB +24 dB (max) 61 dB (typical) 35 dB at 100 lux 1 to 30 Hz (800H x 600V) Raw Bayer 10-bit CCP 1.0 High-speed serial 208Mbit/s 1.8 V LVDS 6.5 to 27 MHz square 13 MHz typ. (on-chip PLL) 2.4 to 2.9 V analog 1.8 V 0.1 V digital 1.8 V CMOS levels Streaming 30fps: 75mW max Power down: 15 W max. 2-element, 44.5 HFOV, F# 2.8 50 cm to infinite < |2%| 37% typ. SmOP2M 8.5 x 9.5 x 7.6 mm (wlh) 16-pin SMD socket with EMC shield
EXTCLK STV0976 XSHUTDOWN CCI CCP 1.0
Mobile Imaging DSP (optional)
Baseband or Application Processor
Figure 2. VS6590 Block Diagram
Dynamic range Signal-to-noise Ratio
VS6590
EXTCLK XSHUTDOWN PLL and Clock Management Power Mgmt CCI Receiver Sensor Control Registers Power-On Reset 808 x 608 Pixel array 1152 x 864 VDIG DGND VCAP VANA AGND
Frame rate Pixel format Video Interface
SCL SDA CLKP CLKN DATAP DATAN
CCP 1.0 Transmitter
Readout
SMIA Profile 0 Frame Formatter
Y Decoder
Column ADC X Decoder Line SRAM
Clock input Supply voltage I/O voltage Power consumption
Figure 3. VS6590 Outline Drawing
Lens Depth of field TV distortion Relative illumination Package type Package size System attach
Table 3. Temperature Range
6.100.10
Storage Functional operating Normal operating Optimal operating
-40 to +85 C -30 to +70 C -25 to +55 C +5 to +30 C
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VS6590
REVISION HISTORY
Table 4. Revision History
Date October 2004 Revision 1 First Issue Description of Changes
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners (c) 2004 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com
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