 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| DATA SHEET GaAs HBT INTEGRATED CIRCUIT PG2304TK L-BAND VCO LOCAL BUFFER AMPLIFIER DESCRIPTION The PG2304TK is GaAs HBT MMIC for VCO local buffer amplifier which were developed for mobile phone and another L-band application. This device realizes excellent performance by using InGaP HBT. This device is housed in a 6-pin lead-less minimold package (1511). And this package is able to high-density surface mounting. FEATURES * Operation frequency * Supply voltage * Low current consumption * Excellent isolation : fopt1 = 679 to 768 MHz (720 MHz TYP.) : fopt2 = 1 270 to 1 371 MHz (1 320 MHz TYP.) : VCC = 2.7 to 2.9 V (2.8 V TYP.) : ICC = 3.5 mA TYP.@ VCC = 2.8 V : ISL1 = 40 dB TYP. @ fopt1 = 720 MHz, Pin = -4 dBm, VCC = 2.8 V : ISL2 = 35 dB TYP. @ fopt2 = 1 320 MHz, Pin = -4 dBm, VCC = 2.8 V * High-density surface mounting : 6-pin lead-less minimold package (1.5 x 1.1 x 0.55 mm) APPLICATION * VCO Buffer Amplifier etc. ORDERING INFORMATION Part Number Package 6-pin lead-less minimold (1511) Marking G3F Supplying Form * Embossed tape 8 mm wide * Pin 1, 6 face the perforation side of the tape * Qty 5 kpcs/reel PG2304TK-E2 Remark To order evaluation samples, contact your nearby sales office. Part number for sample order: PG2304TK Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices representative for availability and additional information. Document No. PG10162EJ01V0DS (1st edition) Date Published May 2002 CP(K) Printed in Japan NEC Compound Semiconductor Devices 2002 PG2304TK PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM Top View Top View 6 5 4 1 2 3 SW Circuit 6 5 4 Pin No. 1 Pin Name OUTPUT2 (1.5 GHz) / VCC GND OUTPUT1 (800 MHz) / VCC INPUT1 (800 MHz) N.C. INPUT2 (1.5 GHz) / VSW G3F Parameter Parameter 1 2 3 2 3 4 5 6 TRUTH TABLE VSW = 0 V INPUT1 - OUTPUT1 INPUT2 - OUTPUT2 High Low VSW = 2.8 V Low High ABSOLUTE MAXIMUM RATINGS (TA = +25C, unless otherwise specified) Symbol VCC VSW Pin PD TA Tstg ICC ISW Ratings 4.0 4.0 +10 125 Note Unit V V dBm mW C C mA mA Supply Voltage Switch Voltage Input Power Power Dissipation Operating Ambient Temperature Storage Temperature Circuit Current Control Current -30 to +85 -65 to +150 15 0.3 Note Mounted on double-sided copper-clad 50 x 50 x 1.6 mm epoxy glass PWB, TA = +85C RECOMMENDED OPERATING RENGE (TA = +25C) Symbol fopt1 fopt2 VCC VSW1 VSW2 MIN. 679 1 270 2.7 2.7 0 TYP. 720 1 320 2.8 2.8 - MAX. 768 1 371 2.9 2.9 0.5 Unit MHz MHz V V V Operating Frequency 1 Operating Frequency 2 Supply Voltage Switch Voltage 1 Switch Voltage 2 2 Data Sheet PG10162EJ01V0DS PG2304TK ELECTRICAL CHARACTERISTICS (TA = +25C, VCC = 2.8 V, Pin = -4 dBm, External input and output matching, unless otherwise specified) Parameter Circuit Current 1 Circuit Current 2 Power Gain 1 Power Gain 2 Input Return Loss 1 Input Return Loss 2 Output Return Loss 1 Output Return Loss 2 Isolation 1 Isolation 2 Noise Figure 1 Noise Figure 2 Symbol ICC1 ICC2 GP1 GP2 RLin1 RLin2 RLout1 RLout2 ISL1 ISL2 NF1 NF2 VSW = 0 V VSW = 2.8 V VSW = 0 V, f = 720 MHz VSW = 2.8 V, f = 1 320 MHz VSW = 0 V, f = 720 MHz VSW = 2.8 V, f = 1 320 MHz VSW = 0 V, f = 720 MHz VSW = 2.8 V, f = 1 320 MHz VSW = 0 V, f = 720 MHz VSW = 2.8 V, f = 1 320 MHz VSW = 0 V, f = 720 MHz VSW = 2.8 V, f = 1 320 MHz Test Conditions MIN. - - -2 -2 - - - - 30 30 - - TYP. 3.5 3.5 0 0 10 10 5 5 40 35 8.5 7.0 MAX. 4.0 4.0 +2 +2 - - - - - - 9.5 8.0 Unit mA mA dB dB dB dB dB dB dB dB dB dB Data Sheet PG10162EJ01V0DS 3 PG2304TK EVALUATION CIRCUIT (VCC = 2.8 V, Pin = -4 dBm) VCC 1 000 pF 68 k 270 100 pF OUTPUT2 1 6 1.5 pF INPUT2 56 2 SW Circuit 5 VSW 1.0 pF OUTPUT1 270 1 000 pF 3 4 68 INPUT1 VCC The application circuits and their parameters are for reference only and are not intended for use in actual design-ins. 4 Data Sheet PG10162EJ01V0DS PG2304TK ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD Dual HBT LNA 6pin L2MM Vcc C4 R 2 800 M IN 800 M OUT 3 R C 1.5 G IN R 1 R 3 2 C 1 R 4 1.5 G OUT C 3 C4 Vsw USING THE NEC EVALUATION BOARD Symbol R1 R2 R3 R4 C1 C2 C3 C4 Values 56 68 270 68 k 1 pF 1.5 pF 100 pF 1 000 pF Part Number RR0816P-560-D RR0816P-680-D RR0816P-271-D RR0816P-683-D GRM39CH010C50PB GRM39CH1R5C50PB GRM39CH101J50PB GRM39CH102J25PB Maker Susumu Susumu Susumu Susumu muRata muRata muRata muRata Vcc Data Sheet PG10162EJ01V0DS 5 PG2304TK TYPICAL CHARACTERLISTICS (TA = +25C, unless otherwise specified) INPUT1 - OUTPUT1 CIRCUIT CURRENT vs. INPUT POWER 5 f = 720 MHz, VCC = 2.8 V, VSW = 0 V CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE 5 f = 720 MHz, Pin = -4 dBm 4 VCC = 2.8 V, VSW = 0 V 3 Circuit Current ICC (mA) 3 2 Circuit Current ICC (mA) 4 2 1 1 0 -20 -15 -10 -5 0 +5 0 -40 -20 0 +20 +40 +60 +80 +100 Input Power Pin (dBm) Operating Ambient Temperature TA (C) OUTPUT POWER vs. INPUT POWER +5 f = 720 MHz, VCC = 2.8 V, VSW = 0 V POWER GAIN vs. OPERATING AMBIENT TEMPERATURE +3 f = 720 MHz, Pin = -4 dBm +2 VCC = 2.8 V, VSW = 0 V +1 0 -1 -2 -3 -40 Output Power Pout (dBm) 0 -5 -10 -15 -20 -20 -15 -10 -5 0 +5 Power Gain GP (dB) -20 0 +20 +40 +60 +80 +100 Input Power Pin (dBm) Operating Ambient Temperature TA (C) Remark The graphs indicate nominal characteristics. 6 Data Sheet PG10162EJ01V0DS PG2304TK INPUT2 - OUTPUT2 CIRCUIT CURRENT vs. INPUT POWER 5 f = 1 320 MHz, VCC = 2.8 V, VSW = 2.8 V CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE 5 f = 1 320 MHz, Pin = -4 dBm 4 VCC = 2.8 V, VSW = 2.8 V 3 Circuit Current ICC (mA) 3 2 Circuit Current ICC (mA) 4 2 1 1 0 -20 -15 -10 -5 0 +5 0 -40 -20 0 +20 +40 +60 +80 +100 Input Power Pin (dBm) Operating Ambient Temperature TA (C) OUTPUT POWER vs. INPUT POWER +5 f = 1 320 MHz, VCC = 2.8 V, VSW = 2.8 V POWER GAIN vs. OPERATING AMBIENT TEMPERATURE +3 f = 1 320 MHz, Pin = -4 dBm +2 VCC = 2.8 V, VSW = 2.8 V +1 0 -1 -2 -3 -40 Output Power Pout (dBm) 0 -5 -10 -15 -20 -20 -15 -10 -5 0 +5 Power Gain GP (dB) -20 0 +20 +40 +60 +80 +100 Input Power Pin (dBm) Operating Ambient Temperature TA (C) Remark The graphs indicate nominal characteristics. Data Sheet PG10162EJ01V0DS 7 PG2304TK PACKAGE DIMENSIONS 6-PIN LEAD-LESS MINIMOLD (1511) (UNIT: mm) 1.30.1 1.10.1 (0.48) (0.48) 1.50.1 (0.96) Remark () : Reference value 8 Data Sheet PG10162EJ01V0DS 0.550.05 0.11+0.1 -0.05 0.16+0.1 -0.05 PG2304TK RECOMMENDED SOLDERING CONDITIONS This product should be soldered and mounted under the following recommended conditions. methods and conditions other than those recommended below, contact your nearby sales office. Soldering Method Infrared Reflow Soldering Conditions Peak temperature (package surface temperature) Time at peak temperature Time at temperature of 220C or higher Preheating time at 120 to 180C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Peak temperature (package surface temperature) Time at temperature of 200C or higher Preheating time at 120 to 150C Maximum number of reflow processes Maximum chlorine content of rosin flux (% mass) Peak temperature (molten solder temperature) Time at peak temperature Preheating temperature (package surface temperature) Maximum number of flow processes Maximum chlorine content of rosin flux (% mass) Peak temperature (pin temperature) Soldering time (per side of device) Maximum chlorine content of rosin flux (% mass) : 260C or below : 10 seconds or less : 60 seconds or less : 12030 seconds : 3 times : 0.2%(Wt.) or below : 215C or below : 25 to 40 seconds : 30 to 60 seconds : 3 times : 0.2%(Wt.) or below : 260C or below : 10 seconds or less : 120C or below : 1 time : 0.2%(Wt.) or below : 350C or below : 3 seconds or less : 0.2%(Wt.) or below Condition Symbol IR260 For soldering VPS VP215 Wave Soldering WS260 Partial Heating HS350 Caution Do not use different soldering methods together (except for partial heating). Data Sheet PG10162EJ01V0DS 9 PG2304TK * The information in this document is current as of May, 2002. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. * No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. * NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. * Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. * While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. * NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd. and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). M8E 00. 4 - 0110 10 Data Sheet PG10162EJ01V0DS |
Price & Availability of UPG2304TK-E2
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |