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| 05192 ULLC0402FC3.3C* thru Only One Name Means ProT ek'TionTM ULLC0402FC24C* UNBUMPED LOW CAPACIT ANCE FLIP CHIP ARRA Y APPLICA TIONS Cellular Phones Personal Digital Assistant (PDA) Notebook Computers SMART Cards IEC COMPA TIBILITY (EN61000-4) 61000-4-2 (ESD): Air - 15kV, Contact - 8kV 61000-4-4 (EFT): 40A - 5/50ns FEA TURES ESD Protection > 25 kilovolts Available in Six Voltage Types Ranging From 3.3V to 24V Low ESD Overshoot Voltage Bidirectional Configuration & Monolithic Structure Protects 1 Line LOW CAPACITANCE: 6pF LOW LEAKAGE CURRENT RoHS Compliant MECHANICAL CHARACTERISTICS Standard EIA Chip Size: 0402 Weight 0.73 milligrams (Approximate) Solder Reflow Temperature: Tin-Lead - Sn/Pb: 240-245C Lead-Free: 260-270C Flammability Rating UL 94V-0 8mm Plastic & Paper Tape and Reel Per EIA Standard 481 Device Marking On Reel U0402 PIN CONFIGURA TION *U.S. Patent No. 6,867,436 05192.R2 10/05 1 www.protekdevices.com ULLC0402FC3.3C* thru ULLC0402FC24C* DEVICE CHARACTERISTICS MAXIMUM RATINGS @ 25C Unless Otherwise Specified PARAMETER Operating Temperature Storage Temperature SYMBOL TJ TSTG VALUE -55C to 150C -55C to 150C UNITS C C ELECTRICAL CHARACTERISTICS PER LINE @ 25C Unless Otherwise Specified PART NUMBER (See Note 1) RATED STAND-OFF VOLTAGE MINIMUM BREAKDOWN VOLTAGE MAXIMUM LEAKAGE CURRENT TYPICAL CAPACITANCE VWM VOLTS ULLC0402FC3.3C ULLC0402FC05C ULLC0402FC08C ULLC0402FC12C ULLC0402FC15C ULLC0402FC24C Note 1: All devices are bidirectional. @ 1mA V(BR) VOLTS 4.0 6.0 8.5 13.3 16.7 26.7 @VWM ID A 75 1.0 0.1 0.1 0.1 0.1 @0V, 1 MHz C pF 6 6 6 6 6 6 3.3 5.0 8.0 12.0 15.0 24.0 *U.S. Patent No. 6,867,436 05192.R2 10/05 2 www.protekdevices.com ULLC0402FC3.3C* thru ULLC0402FC24C* GRAPHS FIGURE 2 OVERSHOOT & CLAMPING VOLTAGE FOR ULLC0402FC05C 35 25 5 Volts per Division 15 5 -5 ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape) FIGURE 3 CAPACITANCE VS REVERSE VOLTAGE FOR ULLC0402FC05C 10 8 Cj - Capacitance - pF 6 4 2 0 0 1 2 3 4 5 6 VR - Reverse Voltage - Volts *U.S. Patent No. 6,867,436 05192.R2 10/05 3 www.protekdevices.com ULLC0402FC3.3C* thru ULLC0402FC24C* APPLICA TION INFORMA TION PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Paste Type Pad Protective Finish Tolerance - Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183C) Soldering Maximum Temperature VALUE 0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) 50m 20m 60 Seconds 270C REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-265C TP for Tin-Lead: 240-245C Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area & plating. RECOMMENDED NON-SOLDER MASK DEFINED PAD ILLUSTRATION Non-Solder Mask Defined Pad 0.275mm DIA. Solder Mask Opening 0.325mm DIA. Solder Stencil Opening 0.330mm DIA. TP Ramp-up Temperature - C Ramp-down TL TSMAX 155 TSMIN 140 TS - Preheat t 25C to Peak 30-60 seconds Ramp-up 15 seconds Solder Time 15-20 seconds Ramp-down *U.S. Patent No. 6,867,436 05192.R2 10/05 4 www.protekdevices.com ULLC0402FC3.3C* thru ULLC0402FC24C* PACKAGE OUTLINE & DIMENSIONS PACKAGE OUTLINE U0402 TOP SIDE A C B PACKAGE DIMENSIONS DIM A B C D E F I MILLIMETERS 0.61 NOM 0.86 NOM 0.99 0.0254 0.10 NOM 0.35 NOM 0.483 0.0254 0.406 NOM INCHES 0.024 NOM 0.034 NOM 0.039 0.001 0.004 NOM 0.014 NOM 0.019 0.001 0.016 NOM E F Metalized Die Contacts D END I NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx 0.05mm ( 0.002"). 3. Maximum chip size: 1.02 (0.040") by 0.51(0.020"). MOUNTING PAD DIM C B A D PAD DIMENSIONS MILLIMETERS 0.23 0.48 0.69 0.46 0.99 0.20 0.20 0.66 0.13 INCHES 0.009 0.019 0.027 0.018 0.039 0.008 0.008 0.026 0.005 SOLDER PAD DIE CONTACTS A B C D E F G H I DIE H E NOTE: 1. Top view of tape. Metal contacts are face down in tape package. F I T APE & REEL ORIENT TION A SOLDER PRINT DIAMETER 0.010" 0.012" G Single Die - 0402 TAPE & REEL ORDERING NOMENCLATURE 1. Surface mount product is taped and reeled in accordance with EIA 481. 2. 8mm Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., ULLC0402FC05C-T75-1). 3. 8mm Paper Tape: 7 Inch Reels -10,000 pieces per reel. Ordering Suffix: -T710-2 (i.e., ULLC0402FC05C-T710-2). NOTE: 1. Preferred: Using 0.1mm (0.004") stencil. Outline & Dimensions: Rev 4 - 10/05, 06020 COPYRIGHT (c) ProTek Devices 2005 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer's and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products. ProTek Devices 2929 South Fair Lane, Tempe, AZ 85282 Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Web Site: www.protekdevices.com *U.S. Patent No. 6,867,436 05192.R2 10/05 5 www.protekdevices.com |
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