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| *Customer: Yamasa Co.,Ltd. SPECIFICATION ITEM MODEL 1. Features TOP LED DEVICE SSC-UBMGFRT722 [Contents] -------------------------------------------------------------- 2 2. Application -------------------------------------------------------------- 2 3. Absolute Maximum Ratings ----------------------------------------------- 2 4. Electro-optical Characteristics --------------------------------------------- 3 5. Ranks of UBMGFRT722 --------------------------------------------- 4 6. Chromaticity Coordinate Diagram ----------------------------------- 5 7. Soldering Profile ------------------------------------------------------------- 7 8. Outline Dimension And Material -------------------------------------------- 8 9. Packing -------------------------------------------------------- 9 10. Reel Packing Structure -------------------------------------------- 10 11. Precaution for Use --------------------------------------------- 11 12. Characteristic Diagram ---------------------------------------- 12 CUSTOMER Checked by Approved by SUPPLIER Drawn by Checked by Approved by 070119 070119 SSC-QP-7-03-08(REV.11) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-UBMGFRT722 - 1/12 - 1. Features Pb-free Reflow Soldering application RoHS Compliant Material : InGaN(Blue) / InGaN(Green) / AlGaInP(Red) 6-Pin (R,G,B separate) type Suitable for all SMT assembly methods ; Suitable for all soldering methods White colored SMT package and colorless clear window 2. Application Indoor and outdoor displays LCD Backlights etc. R G B - displays Indicator 3. Absolute Maximum Ratings *1 Parameter Forward Current Forward Peak Surge Current Reverse Voltage (per die) Power Dissipation Operating Temperature Storage Temperature *2 (Ta=25C) Symbol IF IFM VR Pd Topr Tstg Red 30 100 78*3 Value Green 30 100 5 123*3 268*4 -40 ~ +100 -40 ~ +100 Blue 30 100 120*3 Unit mA mA V mW C C *1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. *2 IFM was measured at TW 1msec of pulse width and D 1/10 of duty ratio. *3 The value for one LED device.(Single color) *4 The value for total power dissipation when two and more devices are lit simultaneously. SSC-QP-7-03-08(REV.11) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-UBMGFRT722 - 2/12 - 4. Electro-Optical Characteristics (Ta=25C) Parameter Red Forward Voltage Green Blue Red Reverse Current Green Blue Red Green Luminance Intensity *1 Blue Total Iv Rank Symbol Condition IF =12mA Min - Typ 1.9 3.6 3.5 210 520 100 632 518 468 625 527 470 20 35 26 120 Max 2.6 4.1 4.0 10 10 10 745 970 1200 0.328 0.335 632 536 476 - Unit VF IF =20mA IF =20mA V IR VR=5V IF =12mA 520 745 970 A IV Rank N Rank O Rank P x y IF =20mA IF =20mA IF =52mA Total IF =52mA Total IF =12mA mcd Color Coordinate Red Peak Wavelength Green Blue Red Dominant Wavelength Green Blue Red Spectral Bandwidth Green Blue Viewing Angle *2 R, G, B 0.256 0.233 618 519 464 - - P IF =20mA IF =20mA IF =12mA nm d IF =20mA IF =20mA IF =12mA nm IF =20mA IF =20mA IF =52mA Total nm 21/2 deg. *1 The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is 10%. *2 21/2 is the off-axis where the luminous intensity is 1/2 of the peak intensity. [Note] All measurements were made under the standardized environment of SSC. SSC-QP-7-03-08(REV.11) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-UBMGFRT722 - 3/12 - 5. Ranks of UBMGFRT722 SSC-QP-7-03-08(REV.11) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-UBMGFRT722 - 4/12 - 6. Chromaticity Coordinate Diagram 0.9 0.8 0.7 505 515 510 520 525 530 535 540 545 550 555 560 565 500 570 575 580 585 590 595 600 610 620 630 830 0.6 0.5 y 0.4 0.3 0.2 0.1 0.0 0.0 495 490 485 480 475 470 460 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 x SSC-QP-7-03-08(REV.11) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-UBMGFRT722 - 5/12 - 0.34 0.33 0.32 0.31 0.30 0.29 g e c a y w 0.26 0.28 h f d b z x x 0.30 0.32 0.34 y 0.28 0.27 0.26 0.25 0.24 0.23 0.22 0.24 White Color Rank (Ta=25OC) a Rank x 0.266 0.287 0.292 0.271 x 0.276 0.297 0.302 0.281 y 0.267 0.267 0.284 0.284 y 0.301 0.301 0.318 0.318 b Rank x 0.287 0.308 0.313 0.292 f Rank x 0.297 0.318 0.323 0.302 y 0.301 0.301 0.318 0.318 y 0.267 0.267 0.284 0.284 c Rank x 0.271 0.292 0.297 0.276 x 0.281 0.302 0.307 0.286 y 0.284 0.284 0.301 0.301 y 0.318 0.318 0.335 0.335 d Rank x 0.292 0.313 0.318 0.297 x 0.302 0.323 0.328 0.307 y 0.284 0.284 0.301 0.301 y 0.318 0.318 0.335 0.335 e Rank g Rank h Rank w Rank 0.256 0.233 0.277 0.282 0.261 0.233 0.250 0.250 x Rank 0.277 0.233 0.298 0.303 0.282 0.233 0.250 0.250 y Rank 0.261 0.250 0.282 0.287 0.266 0.250 0.267 0.267 z Rank 0.282 0.250 0.303 0.308 0.267 0.250 0.267 0.267 * Measurement Uncertainty of the Color Coordinates : 0.01 SSC-QP-7-03-08(REV.11) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-UBMGFRT722 - 6/12 - 7. Soldering Profile (1) Reflow Soldering Conditions / Profile Lead Solder Pre-heat 130~160 Pre-heat time 120 sec. Max. Peak-Temperature 240 Max. Soldering time Condition 10 sec. Max. . * Condition 1~5 oC / sec. Pre-heating 130~160 oC 240 oC Max. 10 sec. Max. 60sec. Max. Above 210 oC 1~5 oC / sec. 120sec. Max. (2) Lead-free solder Lead-free Solder Pre-heat 180~200 Pre-heat time 120 sec. Max. Peak-Temperature 260 Max. Soldering time Condition 10 sec. Max. * Condition 1~5 oC / sec. Pre-heating 180~200 o C 260 oC Max. 10 sec. Max. 60sec. Max. Above 220 oC 1~5 oC / sec. 120sec. Max. (3) Reflow soldering should not be done more than two times. (4) Hand Soldering conditions Do not exceed 3 seconds at maximum 300C under soldering iron. . Note : In case that the soldered products are reused in soldering process, we don't guarantee the products. SSC-QP-7-03-08(REV.11) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-UBMGFRT722 - 7/12 - 8. Outline Dimension Package Outlines 6 5 4 Package Marking (Cathode) Front View 1 2 3 Right View Rear View ( Tolerance: 0.2, Unit: mm ) Circuit Diagram Red Anode 6 Recommended Solder Pad Green Anode 5 Blue Anode 4 1 2 3 Red Cathode Green Cathode Blue Cathode * MATERIALS PARTS Package Encapsulating Resin Electrodes MATERIALS Heat-Resistant Polymer Epoxy Resin Ag Plating Copper Alloy SSC-QP-7-03-08(REV.11) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-UBMGFRT722 - 8/12 - 9. Packing Package Marking ( Tolerance: 0.2, Unit: mm ) (1) Quantity : 700pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be 0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10 to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package SSC-UBMGFRT722 SSC-QP-7-03-08(REV.11) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 - 9/12 - 10. Reel Packing Structure Reel X OR XX QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : XXXXXXXXXX SEOUL SEMICONDUCTOR CO., LTD. HUMIDITY INDICATOR DESI PAK Aluminum Vinyl Bag X OR XX QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : XXXXXXXXXX SEOUL SEMICONDUCTOR CO., LTD. Outer Box Structure Material : Paper(SW3B(B)) SIZE (mm) TYPE a c b 7inch 245 220 142 1 SIDE X OR XX QUANTITY : XXXX LOT NUMBER : XXXXXXXXXX PART NUMBER : XXXXXXXXXX SEOUL SEMICONDUCTOR CO., LTD. c 1 TOP LED RoHS b a SSC-QP-7-03-08(REV.11) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-UBMGFRT722 - 10/12 - 11. Precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5C ~30C Humidity : maximum 65%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; a. After opened and mounted the soldering shall be quickly. b. Keeping of a fraction Temperature : 5 ~ 40C Humidity : less than 30% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 605C. (4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ray design is not considered for the products. (8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (10) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (11) The LEDs must be soldered within seven days after opening the moisture-proof packing. (12) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (13) The appearance and specifications of the product may be modified for improvement without notice. SSC-QP-7-03-08(REV.11) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-UBMGFRT722 - 11/12 - 12. Characteristic Diagram Relative Luminous Intensity vs. Forward Current (TA=25C) Forward Current vs. Forward Voltage (TA=25C) Relative Luminous Intensity IV / IV (20mA) [Rel.] 2.8 2.6 2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 IF [mA] R ed Red Green Blue B lu e G re e n Forward Current 10 1 .5 1 .8 2 .1 2 .4 2 .7 3 .0 3 .3 3 .6 3 .9 0 5 10 15 20 25 30 Forward Voltage VF [V] Forward Current IF [mA] Ambient Temperature vs. Power Dissipation Radiation Diagram (TA=25C) 280 260 240 220 200 180 160 140 120 100 80 60 40 20 0 0 20 40 60 80 100 3 CHIP ON 0 -30 30 Power Dissipation PD(mW) -60 1 CHIP ON 60 -90 90 Ambient Temperature Ta [C] SSC-QP-7-03-08(REV.11) SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6 SSC-UBMGFRT722 - 12/12 - |
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