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RF3802
0
RoHS Compliant & Pb-Free Product Typical Applications
* GaAs HBT Pre-Driver for Basestation Amplifiers * Class AB Operation for GSM/EDGE/CDMA * Power Amplifier Stage for Commercial Wireless Infrastructure Transmitter Applications GaAs HBT PRE-DRIVER AMPLIFIER
Product Description
The RF3802 is specifically designed for wireless infrastructure applications. Using a highly reliable GaAs HBT fabrication process, this high-performance dual-stage amplifier achieves high output power over a broad frequency range. The RF3802 amplifier also provides excellent efficiency and thermal stability through the use of a thermally-enhanced surface-mount AlN package. Ease of integration is accomplished through the incorporation of an optimized evaluation board design provided to achieve proper 50 operation. Various evaluation board configurations are available to address a broad range of wireless infrastructure applications: * AMPS/GSM850/EDGE850 * GSM900/EDGE900 * IS-95/CDMA2000/AMPS Optimum Technology Matching(R) Applied
Si BJT Si Bi-CMOS InGaP/HBT GaAs HBT SiGe HBT GaN HEMT GaAs MESFET Si CMOS SiGe Bi-CMOS
Pin 1
0.005 A
-A0.0025
0.200 REF
0.024
0.200
0.180 REF
0.238
Dimensions in inches.
0.050 REF 0.078 REF
0.156
0.025
R.008
0.050 TYP
0.025 TYP 0.175
0.005 TYP 0.022 7 PL
SCALE - 16:1
0.003 TYP
Package Style: AlN
Features * 5W Output Power * High Linearity * 35% Power-Added Efficiency * Thermally Enhanced AlN Packaging * Broadband Platform Design Approach
VCC1 1 VREF 2 RF IN 3 VBIAS 4 Bias Circuit
PACKAGE BASE GND
8 RF OUT/VCC2 7 RF OUT/VCC2 6 RF OUT/VCC2 5 RF OUT/VCC2
Ordering Information
RF3802 GaAs HBT Pre-Driver Amplifier RF3802PCBA-410 Fully Assembled Evaluation Board - GSM850 RF3802PCBA-411 Fully Assembled Evaluation Board - GSM900
Functional Block Diagram
RF Micro Devices, Inc. 7628 Thorndike Road Greensboro, NC 27409, USA
Tel (336) 664 1233 Fax (336) 664 0454 http://www.rfmd.com
Rev A6 050609
4-631
RF3802
Absolute Maximum Ratings Parameter
Supply Voltage (VCC) Power Control Voltage (VREF) DC Supply Current Input RF Power Output Load VSWR Operating Ambient Temperature Storage Temperature
Rating
9 9 2000 23 5:1 +85 +125
Unit
VPC V mA dBm C C Caution! ESD sensitive device.
RF Micro Devices believes the furnished information is correct and accurate at the time of this printing. RoHS marking based on EUDirective2002/95/EC (at time of this printing). However, RF Micro Devices reserves the right to make changes to its products without notice. RF Micro Devices does not assume responsibility for the use of the described product(s).
Parameter
Overall 850MHz Band
Frequency P1dB Total Efficiency Total Power Added Efficiency Large Signal Power Gain Second Harmonic Third Harmonic Input Return Loss Output Return Loss OIP3
Specification Min. Typ. Max.
Unit
Condition
IREF =22mA, VCC =VBIAS =VREF =8V, Temp=+25C
869 36.0 35.5 34.5 17.5
36.5 36.5 35.5 18.5
894 37.0 39.0 38.0 19.5 -40 -40
12 12
Noise
15 15 41.0 46.0 48.0 49.0 6.4
MHz dBm dBm % % dB dBc dBc dB dB dBm dBm dBm dBm dB
@ P1dB @ P1dB 20dBm23dBm/tone 26dBm/tone 28dBm/tone 30dBm/tone IREF =22mA, VCC =VBIAS =VREF =8V, Temp=+25C
900MHz Band
Frequency P1dB Total Efficiency Total Power Added Efficiency Large Signal Power Gain Second Harmonic Third Harmonic Input Return Loss Output Return Loss OIP3 920 35.5 34.5 33.5 17 36.5 35.5 34.5 18 960 37.0 37.0 36.5 20 -30 -50 MHz dBm dBm % % dB dBc dBc dB dB dBm dBm dBm dBm dB
@ P1dB @ P1dB 20dBm12 12
45.0 Noise
15 15 42.0 46.0 46.0 46.0 6.4
54.0
23dBm/tone 26dBm/tone 28dBm/tone 30dBm/tone IREF =22mA, VCC =VBIAS =VREF =8V, Temp=+25C
Power Supply
Power Supply Voltage Supply Current Power Down Current 7 200 8 270 9 350 50 V mA A ICCQ for IREF =22mA VREF =0V, VCC =8V
4-632
Rev A6 050609
RF3802
Pin 1 2 3 4 5 6 7 8 Pkg Base Function VCC1 VREF RF IN VBIAS RF OUT/VCC2 RF OUT/VCC2 RF OUT/VCC2 RF OUT/VCC2 GND Description
For input stage. Control for active bias. For input stage. Requires RF match and DC block. Supply for active bias. For output stage. Requires RF match, bias feed and DC block. See pin 5. See pin 5. See pin 5. Must be soldered to ground pad through as short a path as possible. This path also forms the thermal path for minimum TJ.
Rev A6 050609
4-633
RF3802
Evaluation Board Schematic GSM850 (869MHz to 894MHz)
VCC R10 1.2 C33 0.1 F + C34 10 F C35 33 pF L4 33 nH VREF C38 33 pF C39 1000 pF C41 0.1 F + C40 10 F R4 360 R5 360 R7 DNI R8 DNI 1 2 3 C18 DNI C19 DNI C20 DNI L5 6.8 nH 4 Bias Circuit 8 7 6 5 C12 1.5 pF C13 33 pF C15 3.6 pF C8 DNI C9 2.7 pF C10 DNI C16 6.8 pF L2 33 nH C5 1000 pF C11 0.1 F C7 33 pF + C6 10 F C48 33 pF C49 1000 pF C51 0.1 F + C50 10 F
C27 27 pF
J1 RF IN
50 strip
C28 3.6 pF
C14 15 pF
50 strip
J2 RF OUT
3802400 r.-
VBIAS C43 33 pF C46 0.1 F C44 + C45 1000 pF 10 F P1 P1-1 1 VREF BANANA JACK P2 P2-1 1 VCC BANANA JACK P3 P3-1 1 VBIAS BANANA JACK P4 1 GND BANANA JACK
Evaluation Board Schematic GSM900 (920MHz to 960MHz)
VCC R10 1.2 C33 0.1 F + C34 10 F C35 33 pF L4 33 nH VREF C38 33 pF C39 1000 pF C41 0.1 F + C40 10 F R4 360 R5 360 R7 Open R8 Open 1 2 3 C18 Open C19 Open C20 Open L5 6.8 nH 4 Bias Circuit 8 7 6 5 C12 1.5 pF C13 27 pF C15 2 pF C8 Open C9 1 pF C10 Open C16 6.8 pF L2 33 nH C5 1000 pF C11 0.1 F C7 33 pF + C6 10 F C48 33 pF C49 1000 pF C51 0.1 F + C50 10 F
C27 22 pF
J1 RF IN
50 strip
C28 3.6 pF
C14 15 pF
50 strip
J2 RF OUT
3802401 r.-
VBIAS C43 33 pF C46 0.1 F C44 + C45 1000 pF 10 F P1 P1-1 1 VREF BANANA JACK P2 P2-1 1 VCC BANANA JACK P3 P3-1 1 VBIAS BANANA JACK P4 1 GND BANANA JACK
4-634
Rev A6 050609
RF3802
Evaluation Board Layout Board Size 2.0" x 2.0"
Board Thickness 0.020", Board Material Rogers 4350
Rev A6 050609
4-635
RF3802
GSM850 Evaluation Board S-Parameters
30.0 30.0
GSM900 Evaluation Board S-Parameters
20.0
20.0
10.0 S11 S21 S12 S22
10.0 S11 S21 S12 S22
0.0
0.0
dB
-10.0
dB Frequency (MHz)
-10.0
-20.0
-20.0
-30.0
-30.0
-40.0
-40.0
-50.0 855.0 860.0 865.0 870.0 875.0 880.0 885.0 890.0 895.0 900.0 905.0
-50.0 915.0 920.0 925.0 930.0 935.0 940.0 945.0 950.0 955.0 960.0 965.0
Frequency (MHz)
GSM850 Gain Phase versus POUT
25.0
GSM900 Gain Phase versus POUT
25.0
(882 MHz)
(940 MHz)
20.0
20.0
Gain (dB)/Phase ()
Gain (dB) 10.0 Normalized Phase ()
Gain (dB)/Phase ()
15.0
15.0
10.0
Gain (dB) Normalized Phase ()
5.0
5.0
0.0
0.0
-5.0 20.0 25.0 30.0 35.0 40.0
-5.0 20.0 25.0 30.0 35.0 40.0
POUT (dBm)
POUT (dBm)
GSM850 P1dB versus Frequency
40.0 40.0
GSM900 P1dB versus Frequency
35.0
35.0
30.0
30.0
P1dB (dBm)
25.0
25.0
20.0
P1dB (dB)
20.0
15.0
15.0
10.0
10.0
5.0
Pin Pout
5.0
Pin Pout
0.0 865.0 870.0 875.0 880.0 885.0 890.0 895.0 900.0
0.0 915.0 920.0 925.0 930.0 935.0 940.0 945.0 950.0 955.0 960.0 965.0
Frequency (MHz)
Frequency (MHz)
4-636
Rev A6 050609
RF3802
GSM850 OIP3 versus POUT
49.0 48.0 47.0 46.0
GSM900 OIP3 versus POUT
49.0 48.0 47.0 46.0
(Two-Tone 882 MHz)
(Two-Tone 940 MHz)
OIP3 (dBm)
44.0 43.0 42.0 41.0 40.0 39.0 21.0 23.0 25.0 27.0 29.0 31.0 33.0
OIP3 (dBm)
45.0
45.0 44.0 43.0 42.0 41.0 40.0 39.0 21.0 23.0 25.0 27.0 29.0 31.0 33.0
POUT per Tone (dBm)
POUT per Tone (dBm)
GSM850/CDMA2K Current versus POUT
1200.0 1100.0 1000.0 900.0
ICC Total (mA)
800.0 700.0 600.0 500.0 400.0 300.0 200.0 15.0 17.0 19.0 21.0 23.0 25.0 27.0 29.0 31.0 33.0 35.0
POUT (dBm)
GSM850/CDMA2K Efficiency versus POUT
25.0
20.0
Efficiency (%)
15.0
10.0
5.0
0.0 15.0 17.0 19.0 21.0 23.0 25.0 27.0 29.0 31.0 33.0 35.0
POUT (dBm)
Rev A6 050609
4-637
RF3802
882 MHz CDMA2K 9-Channel SR1 ACPL and ALT1
-30.0
-35.0
-40.0
ACPR and ALT1 (dBc)
-45.0
-50.0
-55.0
-60.0
-65.0
ACPR ALT1
-70.0 15.0 17.0 19.0 21.0 23.0 25.0 27.0 29.0 31.0 33.0 35.0
POUT (dBm)
GSM850 Thermal Data
150.0 10.0 9.0 140.0
Thermal Resistance at 940 MHz
Channel Temp (Baseplate = +85C)
8.0 7.0 130.0 6.0 5.0 4.0 110.0 3.0 2.0 100.0 PA 1.0 Driver 90.0 0.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0 40.0 0.0 10.0 12.0 14.0 16.0 18.0 20.0 22.0 24.0 26.0 28.0 30.0 32.0 34.0 36.0 38.0 40.0
120.0
Rth (C/W)
POUT (dBm)
POUT (dBm)
GSM900 Thermal Data
150.0
140.0
Channel Temp (Baseplate = +85C)
130.0
120.0
110.0
100.0
PA Driver
90.0 0.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0 40.0
POUT (dBm)
4-638
Rev A6 050609
RF3802
PCB Design Requirements
PCB Surface Finish The PCB surface finish used for RFMD's qualification process is electroless nickel, immersion gold. Typical thickness is 3inch to 8inch gold over 180inch nickel. PCB Land Pattern Recommendation PCB land patterns for PFMD components are based on IPC-7351 standards and RFMD empirical data. The pad pattern shown has been developed and tested for optimized assembly at RFMD. The PCB land pattern has been developed to accommodate lead and package tolerances. Since surface mount processes vary from company to company, careful process development is recommended. PCB Metal Land Pattern
A = 1.14 x 0.71 B = 1.02 x 0.71 Typ. C = 3.96 x 4.44
Dimensions in mm.
5.93
Pin 1
A 1.27 Typ. B C B B 3.00 5.99 Typ.
B B B B 1.90 3.81 Typ.
PCB Solder Mask Pattern Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the PCB metal land pattern with a 2mil to 3mil expansion to accommodate solder mask registration clearance around all pads. The center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create solder mask clearance can be provided in the master data or requested from the PCB fabrication supplier.
A = 1.30 x 0.86 B = 1.17 x 0.86 Typ. C = 4.11 x 4.60
Dimensions in mm.
5.93
Pin 1
A 1.27 Typ. B C B B 3.00 5.99 Typ.
B B B B 1.90 3.81 Typ.
Rev A6 050609
4-639
RF3802
Thermal Pad and Via Design The DUT must be connected to the PCB backside ground through a low inductance, low thermal resistance path. The required interface is achieved with the via pattern shown below for both low inductance as well as low thermal resistance. The footprint provided below worked well on the RFMD 20mil thick Rogers 4350 PCB and also standard FR4. The vias are 8mil vias that are partially plated through and are finished to 8mils2mils with a minimum plating of 1.5mil. Failure to place these vias within the DUT mounting area on the PCB in this prescribed manner may result in electrical performance and/or reliability degradation.
4-640
Rev A6 050609
RF3802
Tape and Reel Information
Carrier tape basic dimensions are based on EIA481. The pocket is designed to hold the part for shipping and loading onto SMT manufacturing equipment, while protecting the boyd and the solder terminals from damaging stresses. The individual pocket design can vary from vendor to vendor, but wide and pitch will be consistent. Carrier tape is wound or placed on a shipping reel with a diameter of either 330mm (13inches) or 178mm (7inches). The center hub design is large enough to ensure the radius formed by the carrier tape around it does not put unnecessary stress on the parts. Prior to shipping, moisture sensitive parts (MSL level 2a to 5a) are baked and placed into the pockets of the carrier tape. A cover tape is sealed over the top of the entire length of the carrier tape. The reel is sealed in a moisture barrier, ESD bag, which is placed in a cardboard shipping box. It is important to note that unused moisture sensitive parts need to be resealed in the moisture barrier bag. If the reels exceed the exposure limit and need to be rebaked, most carrier tape and shipping reels are not rate as bakeable at 125C. If baking is required, devices may be baked according to section 4, table 4-1, column 8 of Joint Industry Standard IPC/JEDECJ-STD-033A. The following table provides useful information for carrier tape and reels used for shipping the devices described in this document. Reel Diameter Inch (mm)
13 (330) 7 (178)
RFMD Part Number
RF3802TR13 RF3802TR7
Hub Diameter Inch (mm)
4 (102) 2.4 (61)
Width (mm)
12 12
Pocket Pitch (mm)
8 8
Feed
Single Single
Units per Reel
2500 750
Carrier Tape Drawing with Part Orientation
Notes: 1. All dimensions are in millimeters (mm). 2. Unless otherwise specified, all dimension tolerances per EIA-481. Ao = 6.70 0.10 Bo = 5.40 0.10 F = 5.50 0.05 Ko = 2.10 0.10 P = 8.00 0.10 W = 12.00 +0.30/-0.10
4.00 0.10 2.00 0.05 O1.50.10 1.75.10 0.292 .013
15 inch Trailer Sprocket holes toward rear of reel
Pin 1 Location
PART NUMBER YYWW Trace Code PART NUMBER YYWW Trace Code
Top View
15 inch Leader
F
PART NUMBER YYWW Trace Code PART NUMBER YYWW Trace Code
W Bo
P
Ao Ko
Direction of Feed
Rev A6 050609
4-641
RF3802
4-642
Rev A6 050609

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