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PRELIMINARY DATA SHEET
NEC's 4-PIN SOP LOW OFF-STATE LEAKAGE CURRENT PS7200U-1A 1-ch OPTICAL COUPLED MOS FET
FEATURES
* LOW OFF-STATE LEAKAGE CURRENT: ILoff = 0.1 nA TYP. * BREAK DOWN VOLTAGE: VL = 80 V * HIGH-SPEED TURN-ON TIME: ton = 0.05 ms TYP * LOW OUTPUT CAPACITANCE: Cout = 2.3 pF TYP. * C x R: C x R = 40 pF * * 1 CHANNEL TYPE: 1a Output * DESIGNED FOR AC/DC SWITCHING LINE CHANGER * SMALL AND THIN PACKAGE: 4-pin SOP, Height = 2.1 mm * LOW OFFSET VOLTAGE * ORDERING NUMBER OF TAPING PRODUCT: PS7200U-1A-E3, E4, F3, F4
DESCRIPTION
NEC's PS7200U-1A is a low output capacitance solid state relay containing GaAs LEDs on the light emitting side (input side) and MOS FETs on the output side. It is suitable for high-frequency signal control, due to its extremely low off-state leakage current, low output capacitance, and high-speed turn-on time.
APPLICATIONS
* Measurement Equipment
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
California Eastern Laboratories
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PS7200U-1A PACKAGE DIMENSIONS (UNIT: mm)
4.00.5
TOP VIEW
4 3 1. LED Anode 2. LED Cathode 3. MOS FET 4. MOS FET 1 2 7.00.3 4.4 2.05+0.08 -0.05 0.15+0.10 -0.05
0.05+0.08 -0.05
2.54 0.40+0.10 -0.05 0.25 M
0.50.3
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PS7200U-1A ORDERING INFORMATION
PART NUMBER PS7200U-1A PS7200U-1A-E3 PS7200U-1A-E4 PS7200U-1A-F3 PS7200U-1A-F4 PS7200U-1A PS7200U-1A-E3 PS7200U-1A-E4 PS7200U-1A-F3 PS7200U-1A-F4 ORDER NUMBER PS7200U-1A PS7200U-1A-E3 PS7200U-1A-E4 PS7200U-1A-F3 PS7200U-1A-F4 PS7200U-1A-A PS7200U-1A-E3-A PS7200U-1A-E4-A PS7200U-1A-F3-A PS7200U-1A-F4-A Embossed Tape 3 500 pcs/reel Pb-Free Magazine case 100 pcs Embossed Tape 900 pcs/reel Embossed Tape 3 500 pcs/reel SOLDER PLATING SPECIFICATION Solder contains lead PACKING STYLE Magazine case 100 pcs Embossed Tape 900 pcs/reel
ABSOLUTE MAXIMUM RATINGS
PARAMETER Diode Forward Current (DC) Reverse Voltage Power Dissipation Peak Forward Current *1 MOS FET Break Down Voltage Continuous Load Current Pulse Load Current*2 (AC/DC Connection) Power Dissipation Isolation Voltage *3 Total Power Dissipation Operating Ambient Temperature Storage Temperature SYMBOL IF VR PD IFP VL IL ILP PD BV PT TA Tstg
(TA = 25C, unless otherwise specified ) RATINGS 50 5.0 50 1 80 40 80 300 1 500 350 -40 to +85 -40 to +100 UNIT mA V mW A V mA mA mW Vr.m.s. mW C C
*1 PW = 100 s, Duty Cycle = 1% *2 PW = 100 ms, 1 shot *3 AC voltage for 1 minute at TA = 25 C, RH = 60% between input and output. Pins 1-2 shorted together, 3-4 shorted together.
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PS7200U-1A RECOMMENDED OPERATING CONDITIONS (TA = 25C)
PARAMETER LED Operating Current LED Off Voltage SYMBOL IF VF MIN. 2 0 TYP. 10 MAX. 20 0.5 UNIT mA V
ELECTRICAL CHARACTERISTICS
PARAMETER Diode Forward Voltage Reverse Current MOS FET Off-state Leakage Current Output Capacitance Coupled LED On-state Current On-state Resistance Turn-on Time*1 Turn-off Time*1 Isolation Resistance Isolation Capacitance SYMBOL VF IR ILoff Cout IFon Ron ton toff RI-O CI-O
(TA = 25C) CONDITIONS MIN. TYP. 1.1 0.01 0.1 2.3 MAX. 1.3 5.0 1.0 3.5 2.0 17 0.05 0.15 109 0.3 25 0.5 0.5 pF UNIT V A nA pF mA ms
IF = 5 mA VR = 5 V VD = 80 V VD = 0 V, f = 1 MHz IL = 40 mA IF = 5 mA, IL = 40 mA IF = 5 mA, VL = 5 V, RL = 500 , PW 0.5 ms VI-O = 1.0 kVDC V = 0 V, f = 1 MHz
*1 Test Circuit for Switching Time
Pulse Input IF VL
Input
50% 0
Input monitor Rin RL
VO monitor
VO = 5 V Output
90%
10% ton toff
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PS7200U-1A TAPING SPECIFICATIONS
(mm)
Outline and Dimensions (Tape)
2.00.05 4.00.1 1.750.1 1.5+0.1 -0 2.9 MAX. 12.00.2
5.50.05
1.550.1 8.00.1
7.40.1
4.60.1
2.40.1 0.3
Tape Direction
PS7200U-1A-E3
PS7200U-1A-E4
Outline and Dimensions (Reel)
2.00.5
2.00.5 13.00.2
180 21.00.8
+0 -1.5
R 1.0
60 +1 -0
13.51.0 17.51.0
Packing: 900 pcs/reel
11.9 to 15.4 Outer edge of flange
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PS7200U-1A
Outline and Dimensions (Tape)
2.00.05 4.00.1 1.750.1
1.5+0.1 -0
2.9 MAX. 12.00.2
5.50.05
1.550.1 8.00.1
7.40.1
4.60.1
2.40.1 0.3
Tape Direction
PS7200U-1A-F3
PS7200U-1A-F4
Outline and Dimensions (Reel)
2.00.5
3302.0
2.00.5 13.00.2
1001.0
R 1.0
21.00.8
13.00.2
13.51.0 17.51.0
Packing: 3 500 pcs/reel
11.9 to 15.4 Outer edge of flange
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PS7200U-1A
NOTES ON HANDLING 1. Recommended soldering conditions
(1) Infrared reflow soldering * Peak reflow temperature * Time of peak reflow temperature * Time of temperature higher than 220C * Time to preheat temperature from 120 to 180C * Number of reflows * Flux 260C or below (package surface temperature) 10 seconds or less 60 seconds or less 12030 s Three Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.)
Recommended Temperature Profile of Infrared Reflow
Package Surface Temperature T (C)
(heating) to 10 s 260C MAX. 220C to 60 s 180C 120C 12030 s (preheating)
Time (s)
(2) Wave soldering * Temperature * Time * Preheating conditions * Number of times * Flux 260C or below (molten solder temperature) 10 seconds or less 120C or below (package surface temperature) One Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.)
(3) Soldering by Soldering Iron * Peak Temperature (lead part temperature) * Time (each pins) * Flux 350C or below 3 seconds or less Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt% is recommended.) (a) Soldering of leads should be made at the point 1.5 to 2.0 mm from the root of the lead (b) Please be sure that the temperature of the package would not be heated over 100C
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PS7200U-1A
(4) Cautions * Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
USAGE CAUTIONS
1. Protect against static electricity when handling. 2. Avoid storage at a high temperature and high humidity.
Life Support Applications These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and agree to fully indemnify CEL for all damages resulting from such improper use or sale.
04/11/2005
A Business Partner of NEC Compound Semiconductor Devices, Ltd.
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