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| REVISION NUMBER : REV A DATE : 1-31-05 PAGES :Page 1 of 15 PI6050D Contact Image Sensor Data Sheet PI6050D Data Sheet _________________________________________________________________________________________ Key Features * * * * * * * * * * * * 600 or 1200 dots per inch (dpi) selectable resolutions 344 or 688 image sensor elements (pixels) 21.15m (1200dpi) pixel center-to-center spacing (47.24 dots/mm) On-chip amplifier Single 5.0V power supply 3.3V input clocks 3.0 MHz maximum pixel rate Parallel / integrate and transfer Power down circuit High sensitivity Low power Low noise General Description Peripheral Imaging Corporation's PI6050D Contact Image sensor is a selectable 600 or 1200 dot per inch (dpi) resolution linear image sensor, which employs PIC's proprietary CMOS Image Sensing Technology. The sensor contains an on-chip output amplifier, power down circuitry and parallel transfer features that are uniquely combined with the present-day active-pixel-sensor technology. The image sensors are designed to be cascaded end-to-end on a printed circuit board (PCB) and packaged in an image sensing module. Applications for the sensor array includes facsimiles, PC scanners, check readers, and office automation equipment. Figure 1 is a block diagram of the sensor. Each sensor consists of 688 active pixels, their associated multiplexing switches, buffers, and an output amplifier circuit with a power down feature. The sensors pixel-pixel spacing is approximately 21.15 m. The size of each sensor without the scribe lines is 14560 m by 425 m. 14560m 21.15m 1 1 2 2 3 3 4 4 Row of 688 Pixels (1200dpi) or Selectable Row of 344 Pixels (600dpi) and Video Line Multiplexer 342 686 343 687 344 688 Parallel Transfer, Storage Cells and Readout Registers 425m Amplifier, PowerDown and Offset Control SI GBST CLK SIC SC VDD VOUT VSS VREF SO Figure 1. Sensor Block Diagram Page 2 of 15, PI6050D_rev A, Revised 1-31-05 PI6050D Data Sheet _________________________________________________________________________________________ PI6050D Unique Features There are six unique features incorporated into the PI6050D which improve the sensor's performance. 1. Pixel-to-Pixel Offset Cancellation Circuit The sensor employs a pixel-to-pixel offset cancellation circuit, which reduces the Fix Pattern Noise (FPN), and amplifier offsets. In addition, this innovative circuit design greatly improves the optical linearity and low noise sensitivity. 2. Parallel Integrate, Transfer and Hold The sensor has a parallel integrate, transfer and hold feature, which allows the sensor to be read out while photon integration is taking place. These features are approached through the use of an integrate-and-hold cell, located at each pixel site. Each pixel's charge is read from its storage site as the sensor's shift register sequentially transfers each pixel's charge onto a common video line. 3. Dual Scan Initiation Inputs, GBST and SI Each sensor has two scan initiation inputs, the Global Start Pulse (GBST) and the Start Pulse (SI), which are compatible with standard 3.3V CMOS clocks. These clocks help to reduce the sensor-to-sensor transition Fix Pattern Noise by initializing and preprocessing all sensors simultaneously before they start their readout scan. The internal shift register starts the scan after GBST is clocked in on the falling edge of the Clock input (CLK). The Start Input Control (SIC) selects the first sensor in a sequence of cascaded sensors to operate with 55 clock cycles of delay by connecting it to Vdd and to Ground for all subsequent sensors. Then, only the first sensor clocks out 110 inactive pixels (55 clocks cycles) before accessing its first active pixel. During these 55 clock cycles, the first sensor and all of the subsequent cascaded sensors cycle through their pre-scan initialization process. After initialization, only the first sensor starts its read cycle with its first-active pixel appearing on the 56th clock cycle. The second and subsequent sensors await the entry of their Start Pulse (SI). Furthermore, the first sensor's Start Pulse (SI) is left unconnected, while the subsequent sensors all have their Start Pulse's (SI) connected to the SO of their respective preceding sensor. The external scan Start Pulse (SI) is connected to all of the sensors' Global Start Pulse (GBST) inputs. For example in the 1200 dpi mode, when the first sensor completes its scan, its End-Of-Scan (SO) appears on the falling edge of 389th clock cycle after the entry of GBST and 20 pixels before its last pixel, in order to have a continuous pixel readout between sensors in a module. This SO enters as the SI clock of the second and subsequent sensors; hence all subsequent sensors will start their register scan after each of the preceding sensors completes its scan. 4. Power Saving Each sensor incorporates a power-saving feature such that each chips amplifier is only turned on when its pixels are ready to be read out. 5. Common Reference Voltage between Cascaded Sensors Each sensor has an input/output bias control (VREF), which serves as an offset voltage reference. Each bias control pad is connected to an internal bias source and tied to its own amplifier's reference bias input. In operation, these pads on every sensor are connected together. Each sensor then "shares" the same bias level to maintain a constant bias among all of the sensors. 6. Selectable Resolutions of 600 dpi or 1200 dpi The Switch Control input (SC) is connected to Ground or to Vdd to set the sensor to operate in the 600 dpi or 1200 dpi mode, respectively. In the 1200 dpi mode, all 688 pixels are clocked out, whereas in the 600 dpi mode, pixels 1 and 2 are combined, 3 and 4 are combined and so on up to pixels 687 and 688 being combined. One half of the pixel amplifiers and one half of the scanning register are then disabled. As a result, sensitivity in the 600 dpi mode will be twice that of the 1200 dpi mode. The 600 dpi readout time will be approximately half of the 1200 dpi readout time. Unlike a CCD array, both the 600 dpi and 1200 dpi arrays can operate with the same clock frequency. Page 3 of 15, PI6050D_rev A, Revised 1-31-05 PI6050D Data Sheet _________________________________________________________________________________________ Functional Description Input / Output Terminals The PI6050D image sensor has 10 input and output (I/O) pads. Their symbols and function descriptions are listed in Table 1. Signal SI I/O I GBST CLK SIC I I I SC VDD VOUT VSS VREF SO I I O I I/O O Description Start Pulse: Input to start a line scan. (See discussion of the sensors unique features for further details). Global Start Pulse: Globally initializes the start inputs of all sensors and starts the scanning process of the first sensor. (See discussion of the sensors unique features for further details). Clock: Clock input for the shift register. Start Input Control: Input to control the Start Pulse to the first sensor. (See discussion of the sensors unique features for further details). Switch Control: Selects the 600 or 1200 dpi mode. (See discussion of the sensors unique features for further details). Power Supply Video Output Voltage: Output video signal from the amplifier. Ground Reference Voltage: Reference input voltage for the amplifier output. Sets the output's reset (dark) level. End of Scan Pulse: Output from the shift register at the end of a scan. Table 1. Input and Output Terminals Page 4 of 15, PI6050D_rev A, Revised 1-31-05 PI6050D Data Sheet _________________________________________________________________________________________ Bonding Pad Layout Diagram Figure 2 shows the bonding pad locations for the PI6050D sensor. 14560m 425m Y SI GBST CLK SIC SC VDD VOUT VSS VR SO X X Pad Location Table Pad SI GBST CLK SIC SC VDD VOUT VSS VREF SO Location Start Pulse Global Start Pulse Clock Start Input Control Switch Control Power Supply Video Output Voltage Ground Reference Voltage End of Scan Pulse Y 30 30 30 30 30 34 30 34 30 30 X 1000 3442 4199 4590 4945 5414 5820 10549 10909 13259 Notes: 1. The drawing is not to scale. 2. The die length and width are given in the above sensor die figure 3. Pad locations are listed in the Pad Location Table eg. Y SI X X GBST 4. Each pad is 120 x 80um 5. All dimensions are in um 6. Die size does not include the scribe line Figure 2. PI6050D Bonding Pad Layout Wafer Scribe Line Figure 3 outlines the scribe line dimensions surrounding the sensor die on a wafer. 60m 15m 425m 55m 14560m 55m 60m Figure 3. Wafer Scribe Line Page 5 of 15, PI6050D_rev A, Revised 1-31-05 PI6050D Data Sheet _________________________________________________________________________________________ Table 2 lists the electro-optical specifications of the PI6050D sensor at 25oC and Vdd = 5.0 volts. Electro-Optical Specifications Parameter Number of Pixels (1) Pixel-to-Pixel Spacing (1) Sensitivity @ 600 dpi (2) Sensitivity @ 1200 dpi Saturation Voltage (3) Photo-Response Non-Uniformity (4) Adjacent Photo-Response Non-Uniformity (5) Dark Output Voltage Level (6) Dark Output Non-Uniformity (7) Random Thermal Noise (rms) (8) Sensor-to-Sensor Photo-Response NonUniformity (9) Photo Response Linearity (10) Analog Output Drive Current Symbol Min 344 or 688 42.3 / 21.15 Typ Max 344 or 688 42.3 / 21.15 Units m V / uJ / cm2 Sv VSat Up Upn Vd Ud Vno Usensor PRL Iout 1220 610 1.65 15 15 1.7 100 3.0 10 2 >1.0 Volts % % V mV mV % % mA Table 2. Electro-Optical Specifications * Notes for the above Table 2 are listed on the next page under "Definitions of Electro-Optical Specifications". Page 6 of 15, PI6050D_rev A, Revised 1-31-05 PI6050D Data Sheet _________________________________________________________________________________________ Definitions of Electro-Optical Specifications All electrical specifications are measured at a pixel rate of 2.5 MHz, a temperature of 25oC, Vdd=5.0 volts, Vref=1.7V and at an integration time of 2.2ms for 600 dpi and 4.4ms for 1200 dpi. The average output voltage (Vpavg) is adjusted to approximately 1.0V, unless stated otherwise. The modules' internal Green LED (525 20 nm) was used as the light source for measurements requiring illumination. As a guideline, the recommended load on the output should be 1K Page 7 of 15, PI6050D_rev A, Revised 1-31-05 PI6050D Data Sheet _________________________________________________________________________________________ Recommended Operating Conditions Table 3 lists the recommended operating conditions @ 25oC. Parameter Power Supply Clock Input Voltage high level (1) Clock Input Voltage low level (1) Power Supply Current Reference Voltage (2) Clock Frequency (3) Pixel Rate (4) Integration Time (Line Scan Rate) (5) First Die Subsequent Die Clock Pulse Duty Cycle (6) Symbol Vdd Min 4.5 3.1 0 IDD (sensor selected) IDD (sensor not selected) VREF 1.3 0.25 0.5 248 230 Typ 5.0 3.3 0 8 4 1.7 1.25 2.5 Max 5.5 3.5 0.8 10 5 1.7 1.5 3.0 Units V V V mA mA V MHz MHz s s / die Tint 50 % Table 3. Recommended Operating Conditions @ 25oC Notes: 1. Applies to all clocks; GBST, SI and CLK. The CLK line having a capacitance of approximately 20 pF. 2. The dark level is set by the voltage on VREF and is recommended to be set externally to a voltage of 1.7V for optimal module operation. 3. Although the device will operate with a pixel rate of less than 500 KHz, it is recommended that the device be operated above 500 KHz to maintain performance characteristics. Operating below 500 KHz may result in leakage current degradation. 4. 2 pixels are clocked out for every clock cycle. 5. Tint is the integration time of a single sensor and is the time between two Start Pulses. The minimum integration time is the time it takes to clock out 55 inactive pixels and 688 active pixels for the 1200 dpi mode, or 55 inactive pixels and 344 active pixels for the 600 dpi mode, at a given frequency. However, if several sensors are cascaded together in a module then the minimum integration time for the 1200 dpi mode is the time it takes to clock out 55 inactive pixels and 688 active pixels from the first sensor and 688 pixels from each of all subsequent sensors, at a given frequency. Similarly, for cascaded sensors in the 600 dpi mode, the minimum integration time is the time it takes to clock out 55 inactive pixels and 344 active pixels from the first sensor and 344 pixels from each of all subsequent sensors, at a given frequency. 6. The clock duty cycle is defined as the ratio of the positive duration of the clock to its period. Page 8 of 15, PI6050D_rev A, Revised 1-31-05 PI6050D Data Sheet _________________________________________________________________________________________ Absolute Maximum Ratings Table 4 lists the absolute maximum ratings. Parameter Power Supply Voltage (Vdd) Clock Input Voltage high level (1) Clock Input Voltage low level (1) Operating Temperature Operating Humidity Storage Temperature Storage Humidity Max 8 Vdd + 0.5 -0.5 -10 to +50 +10 to +85 -25 to +75 +10 to +90 Units V V V C RH% C RH% Table 4. Absolute Maximum Ratings Note 1. Applies to all clocks; GBST, SI and CLK. Page 9 of 15, PI6050D_rev A, Revised 1-31-05 PI6050D Data Sheet _________________________________________________________________________________________ 2. Timing Requirements Table 5 lists the timing requirements for the 600 and 1200 dpi modes, and their associated timing diagrams are shown in figures 4-9. Parameter Clock (CLK) Period Clock (CLK) Pulse Width Clock (CLK) Duty Cycle Data Setup Time (1) Data Hold Time (1) Clock (CLK) Rise Time (2) Clock (CLK) Fall Time (2) End of Scan (SO) Rise Time (2) End of Scan (SO) Fall Time (2) (3) Symbol CLKp CLKpw Tset Thold CLKrt CLKft SOrt SOft GBSTrt GBSTft Prt Pft Min 666 Typ 800 400 50 Max 4000 20 25 70 70 50 50 70 70 100 30 Units ns ns % ns ns ns ns ns ns ns ns ns ns Global Start (GBST) Rise Time (4,5) Global Start (GBST) Fall Time (3) Pixel Rise Time Pixel Fall Time (4,5) Table 5. Timing Requirements Notes: 1. The shift register will load on all falling CLK edges, so setup and hold times (Tset, Thold) are needed to prevent the loading of multiple start pulses. This would occur if the GBST remains high during two fallings edges of the CLK signal. See Figure 7 Timing Diagram. 2. SI starts the register scanning and the first active pixel is read out on the 56th clock of the CLK signal. However, when multiple sensors are sequentially scanned, as in CIS modules, the SO from the predecessor sensor becomes the SI to the subsequent sensor, hence the SI clock = the SO clock. 3. As discussed under the third unique feature, the GBST starts the initialization process and preprocesses all sensors simultaneously in the first 55 clock cycles (110 pixels) before the first pixel is scanned onto the video line from the first sensor. 4. The transition between pixels does not always reach the dark offset level as shown in the timing diagrams, see Vout. The timing diagrams show the transition doing so for illustration purposes; however a stable pixel sampling point does exist for every pixel. 5. The pixel rise time is defined as the time from when the CLK's rising edge has reached 50% of its maximum amplitude to the point when a pixel has reached 90% of its maximum amplitude. The pixel fall time is defined as the time from when a pixel's charge begins to decrease from its maximum amplitude to within 10% of the lowest point before the next pixel begins to rise. Page 10 of 15, PI6050D_rev A, Revised 1-31-05 PI6050D Data Sheet _________________________________________________________________________________________ Figures 4 and 5 show the initialization of the first sensor in relation to its subsequent cascaded sensors. The Start Input Control (SIC) selects the first sensor to operate with 55 clock cycles of delay by connecting it to Vdd on the first sensor and to Ground for all of the subsequent sensors. Hence the first sensor will operate with 110 inactive pixels being clocked out before its first active pixel is clocked out. GBST CLK 1 2 3 52 53 54 55 56 57 58 59 217 218 219 223 224 225 226 227 SO 323 324 325 326 VOUT 110 Inactive Pixels (55 Clocks) 340 341 342 343 344 339 338 336 337 335 1 2 3 4 5 6 344 Active Pixels (172 Clocks) Figure 4. Overall Timing Diagram for the 600 dpi mode GBST CLK 1 2 3 52 53 54 55 56 57 58 59 389 390 391 395 396 397 398 399 SO 667 668 669 670 VOUT 110 Inactive Pixels (55 Clocks) 684 685 686 687 688 683 682 681 680 679 1 2 3 4 5 6 688 Active Pixels (344 Clocks) Figure 5. Overall Timing Diagram for the 1200 dpi mode Page 11 of 15, PI6050D_rev A, Revised 1-31-05 PI6050D Data Sheet _________________________________________________________________________________________ Figures 6 and 7 detail the timing of the CLK, GBST, Vout and SI/SO signals in further detail, which have the same timing requirements for both the 600 and 1200 dpi modes. The rise and fall times are listed in table 5 above. In Figure 7, note that pixel 111 is the first active pixel. CLKpw CLKpw CLKp CLK Thold Tset 50% CLKrt CLKft GBST GBSTrt GBSTft Prt 90% VOUT Pft 10% SI/SO SI/SOrt SI/SOft Figure 6. Rise and Fall Times for both the 600/1200 dpi modes CLK Tset Thold 1 2 55 56 57 58 GBST Tset Thold Video Signal (Vout) 1 2 3 108 109 110 111 112 113 114 115 Figure 7. Timing of GBST-to-First Pixel of the First Sensor for both the 600/1200 dpi Modes. Page 12 of 15, PI6050D_rev A, Revised 1-31-05 PI6050D Data Sheet _________________________________________________________________________________________ Figures 8 and 9 show the timing of the End of Scan Pulse (SI/SO), which comes out in line with the 324th pixel for the 600 dpi mode and with the 668th pixel for the 1200 dpi mode. The SO from the first sensor enters as the SI clock of the second and subsequent sensors; hence all subsequent sensors will start their register scan after each of the preceding sensors completes its scan. The last active pixel of each sensor is the 344th pixel for the 600 dpi mode and 688th pixel for the 1200 dpi mode. 1st CLK of second sensor CLK 216 217 218 219 220 226 227 1 2 CLK numbers include timing for 55 inactive pixels and 344 active pixels SI / SO Vout 323 324 325 326 327 328 329 330 341 342 343 344 1 Last active pixel = pixel 344 2 3 Pixel 1 of second sensor SI/SO Timing for 600 dpi of first/second sensors Figure 8. Timing of SI/SO Clock for the 600 dpi Mode. 1st CLK of second sensor CLK 388 389 390 391 392 398 399 1 2 CLK numbers include timing for 55 inactive pixels and 688 active pixels SI / SO Vout 667 668 669 670 671 672 673 674 685 686 687 688 1 Last active pixel = pixel 688 2 3 Pixel 1 of second sensor SI/SO Timing for 1200 dpi of first/second sensors Figure 9. Timing of SI/SO Clock for the 1200 dpi Mode. Page 13 of 15, PI6050D_rev A, Revised 1-31-05 PI6050D Preliminary Data Sheet ____________________________________________________________________________________________________________________ Example of a CIS Module using cascaded PI6050D Image Sensors Figure 10 shows a typical schematic of a CIS module with 15 PI6050D image sensors serially cascaded together. Figure 10. CIS Module with PI6050D Image Sensors Page 14 of 15, PI6050D_rev A, Revised 1-31-05 PI6050D Preliminary Data Sheet _________________________________________________________________________________________ (c)2004 Peripheral Imaging Corporation. Printed in USA. All rights reserved. Specifications are subject to change without notice. Contents may not be reproduced in whole or in part without the express prior written permission of Peripheral Imaging Corporation. Information furnished herein is believed to be accurate and reliable. However, no responsibility is assumed by Peripheral Imaging Corporation for its use nor for any infringement of patents or other rights granted by implication or otherwise under any patent or patent rights of Peripheral Imaging Corporation Page 15 of 15, PI6050D_rev A, Revised 1-31-05 |
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