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CCD Area Image Sensor
MW39962AE
Diagonal 11 mm (type-2/3) FIT CCD Area Image Sensor
Overview
The MW39962AE is a type-2/3 2.2M-pixel frame interline transfer (FIT-CCD) solid state image sensor. This device uses photodiodes in the opto-electric conversion section and CCDs for signal read-out. The electronic shutter function allows for an exposure time of 1/10 000 seconds. Further, it features high sensitivity, low noise, broad dynamic range and low smear level. The device has a total of 2 182 860 pixels (2 010 horizontal x 1 086 vertical) and provides stable and clear images with a resolution of 1 100 horizontal and 730 vertical TV lines. Part Number CCD size System HDTV Color or B/W B/W
(Top View)
Pin Assignments
PW RG RD OD VO LG HL H1 H2 PW IG HS OG N.C. B4 B3
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
32 31 30 29 28 27 26 25 24 23 22 21 OB section 20 19 18 17
VS Sub A1 A2 A3 A4 A1 A2 A3 A4 B1 B2 B3 B4 B1 B2
MW39962AE 11 mm (type-2/3)
Features
* Effective pixel number: 1 936 (horizontal) x 1 086 (vertical) * High sensitivity * High resolution * Low smear level * Continuously variable-speed electronic shutter function * Frame interline transfer system
Applications
* Broadcasting and professional use camera * Front-edge surveillance camera
Publication date: December 2002
SMD00016AEC
1
MW39962AE
Device Configuration
Parameter Horizontal drive frequency Total pixel number Effective pixel number (including transient ones) Effective pixel number Pixel size Effective image sensor size Aspect ratio Aspect ration error * Element Construction Value fCK = 2 200 fH = 74.25 2 010 (H) x 1 086 (V) 1 936 (H) x 1 086 (V) 1 920 (H) x 1 080 (V) 5.0 (H) x 5.0 (V) 9.6 (H) x 5.4 (V) 16 : 9 0.0 Unit MHz Pixel Pixel Pixel m2 mm2 H:V %
PD area
1 3 2 8 Effective pixel 1 080 3 3 1 091 Storage area Vertical dummy bit 1 920 8 72 OB shading part
Transient area
Shading part Vertical dummy bit
3 Horizontal dummy bit
2 010 Effective horizontal HCCD
0 Horizontal dummy bit
Note) The horizontal dummy bit is based on 2 gates = 1 unit.
Pin Descriptions
Pin No. Symbol 1 2 3 4 5 6 7 8 9 10 2 PW RG RD OD VO LG HL H1 H2 PW P-well Reset gate Reset drain Output drain Video output Output load transistor gate Horizontal CCD final gate Horizontal CCD gate 1 Horizontal CCD gate 2 P-well Description Pin No. Symbol 11 12 13 14 15 16 17 18 19 20
SMD00016AEC
Description Horizontal input gate Horizontal input source Output gate Non Connection Storage area vertical CCD gate 4 Storage area vertical CCD gate 3 Storage area vertical CCD gate 2 Storage area vertical CCD gate 1 Storage area vertical CCD gate 4 Storage area vertical CCD gate 3
IG HS OG N.C. B4 B3 B2 B1 B4 B3
MW39962AE
Pin Descriptions (continued)
Pin No. Symbol 21 22 23 24 25 26 B2 B1 A4 A3 A2 A1 Description Storage area vertical CCD gate 2 Storage area vertical CCD gate 1 Sensor area vertical CCD gate 4 Sensor area vertical CCD gate 3 Sensor area vertical CCD gate 2 Sensor area vertical CCD gate 1 Pin No. Symbol 27 28 29 30 31 32 A4 A3 A2 A1 Sub VS Description Sensor area vertical CCD gate 4 Sensor area vertical CCD gate 3 Sensor area vertical CCD gate 2 Sensor area vertical CCD gate 1 Substrate Vertical input source
Absolute Maximum Ratings and Operating Conditions
Absolute maximum rating Pin No. 1 2 PW RG Amplitude Low 3 4 5 6 7 RD OD VO LG HL H1 H2 High Low 8 High Low 9 High Low 10 11 12 13 14 15 PW IG HS OG N.C. B4 B3 B2 B1 B4 Middle Low 16 Middle Low 17 Middle Low 18 Middle Low 19 Middle Low Parameter Lower limit Upper limit Reference voltage 0 0 0 0 0 0 0 0 9.0 18 18 6 10 10 10 5 18 5 18 18 18 18 18
SMD00016AEC
Operating condition Min 4.7 1.0 14.3 14.3 1.0 2.7 0.0 2.7 0.0 2.7 0.0 15.7 0.0 - 0.3 -9.3 - 0.3 -9.3 - 0.3 -9.3 - 0.3 -9.3 - 0.3 -9.3 Typ 0.0 5.0 adj. 14.5 14.5 adj. 3.0 0.0 3.0 0.0 3.0 0.0 0.0 0.0 16.0 adj. 0.0 -9.0 0.0 -9.0 0 -9.0 0.0 -9.0 0.0 -9.0 Max 5.3 8.0 14.7 14.7 4.0 3.3 0.3 3.3 0.3 3.3 0.3 16.3 0.3 0.3 -8.7 0.3 -8.7 0.3 -8.7 0.3 -8.7 0.3 -8.7 Unit V V V V V V V V V V V V V V V V V V V V V V V V V V V 3
Reference voltage 0 0 0 -12 -12 -12 -12 -12
MW39962AE
Absolute Maximum Ratings and Operating Conditions (continued)
Absolute maximum rating Pin No. 20 B3 B2 B1 A4 A3 Parameter Middle Low 21 Middle Low 22 Middle Low 23 Middle Low 24 High Middle Low 25 A2 A1 Middle Low 26 High Middle Low 27 A4 A3 Middle Low 28 High Middle Low 29 A2 A1 Middle Low 30 High Middle Low 31 Sub
*1
Operating condition Min - 0.3 -9.3 - 0.3 -9.3 - 0.3 -9.3 - 0.3 -8.3 14.7 - 0.3 -8.3 0.7 -8.3 14.7 - 0.3 -8.3 - 0.3 -8.3 14.7 - 0.3 -8.3 0.7 -8.3 14.7 - 0.3 -8.3 3.0 24.0 15.7 Typ 0.0 -9.0 0.0 -9.0 0.0 -9.0 0.0 -8.0 15.0 0.0 -8.0 1.0 -8.0 15.0 0.0 -8.0 0.0 -8.0 15.0 0.0 -8.0 1.0 -8.0 15.0 0 -8.0 adj. 25.0 16.0 25 Max 0.3 -8.7 0.3 -8.7 0.3 -8.7 0.3 -7.7 15.3 0.3 -7.7 1.3 -7.7 15.3 0.3 -7.7 0.3 -7.7 15.3 0.3 -7.7 1.3 -7.7 15.3 0.3 -7.7 14.0 26.0 16.3 Unit V V V V V V V V V V V V V V V V V V V V V V V V V V V V V C C
Lower limit Upper limit -12 -12 -12 -12 -12 -12 -12 -12 -12 -12 -12 0 0 0 -10 -30 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 40 *2 18 60 70
1 2
32
VS
Operating temperature Storage temperature
Note) *1 : Sub pulse at the electronic shutter
*2 : Upper limit of Sub maximum rating: Sub 1 + Sub 2 40 V
Sub 2 Sub 1 0V
4
SMD00016AEC
MW39962AE
Image Sensor Characteristics Ta = 25C
Parameter Saturation output Standard output Image lag Vertical smear Dark shading Electronic shutter H V Specified driving No abnormality within 1/100 to 1/2 000 seconds Conditions F value adjust J chart standard light intensity 1/10 light intensity 1/10 V 60C, dark condition Min 650 140 Typ 800 155 0 -127 Max -124 2 Unit mV mV % dB mV Remarks at CCD out
(Minimum point in image)
at CCD out Able to be swept out directly to substrate
Ratio to standard output
2 MHz driving at CCD out
Note) 1. The substrate voltage (Sub 1) should be adjusted to the minimum voltage that would not cause blooming, overflow and injection at image sensor of light input of 1 600 times the standard light intensity. 2. The standard light intensity is the one when the exposure is done at an aperture of F/11 using a light source of 2 856K and 920 nt and placing a color temperature conversion filter LB-40 (HOYA) and an IR cutting filter CAW-500S (t = 2.5 mm) in the light path.
Package Dimensions (unit: mm)
* WDIP032-G-0750A (Lead-free package)
33.000.3 25.500.3
Tolerance: 0.20 unless otherwise specified
B
16.320.3 2.0 x 2.5 32 17
D
7.640.3
18.800.2
1
16
C
A
18.550.1
1.7780.13
(0.80)
0.460.05
0.25 M
1. The package center does not meet the center of the effective pixel area. A is the center of the effective pixel area. 2. The reference of a vertical direction(V) is the side B. The reference of a horizontal direction(H) is the side C. The reference of a height direction is the package bottom D. 3. The rotation precision of the effective pixel area: maximum 1.5 4. The distance from the package bottom D to the effective pixel area : 1.69 mm 0.3 mm 5. The tilt of the effective pixel area toward the package bottom D : Up to 60 m (D' = DO max. 0.03 mm) 6. The thickness of the seal glass is: 0.7 mm 0.1 mm, and the refractive index: 1.50
1.270.3
4.200.3
3.200.2
17.550.1
19.300.2
2.00
0.250.05
SMD00016AEC
5
Request for your special attention and precautions in using the technical information and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the product or technologies as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: * Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. * Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.
2002 JUL

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