Part Number Hot Search : 
IP5561C 1858113W 6K204 RS0103 1N963B 0906B C4010 KRF4905S
Product Description
Full Text Search
 

To Download MADS-001317-1320AG Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
 GaAs Solder Bump Flip Chip Schottky Diode
Features * Low Series Resistance, 4 * Low Capacitance, 45 fF * High Cutoff Frequency * Silicon Nitride Passivation * Polyimide Scratch Protection * Solderable Bump Die Attach
MADS-001317-1320AG V1
Mounting Side with Solder Bumps
Description
M/A-COM's MADS-001317-1320AG is a Gallium Arsenide Flip-Chip Schottky diode with solder bumps.These devices are fabricated on OMCVD epitaxial wafers using a process designed for high device uniformity and extremely low parasitics. This device can be used up to 80 GHz. This diode is fully passivated with silicon nitride and has an additional layer of a polymer for scratch protection. The protective coatings prevent damage to the junction during handling and circuit attachment.
Applications
The high cutoff frequency of this device allows use through millimeter wave frequencies. Typical applications include single and double balanced mixers in PCN tranceivers, radios, police radar detectors and automotive radar detectors
Electrical Specifications TA = 25 C
Parameters and Test Conditions Symbol Units MADS-0001317-1320AG Min
Junction Capacitance at 0V at 1 MHz Total Capacitance at 0V at 1 MHz
1
Typ.
.020 .045 4 7
Ct Rs Vf Vb
pF Volts Volts
.030 4.5
Max 0.030
.060 7
Dynamic Resistance at 9.5 mA - 10.5 mA Reverse Breakdown Voltage at 10uA
Notes:
1.
Total capacitance is equivalent to the sum of junction capacitance Cj and parasitic capacitance Cp.
Specification Subject to Change Without Notice
M/A-COM, Inc. ________________________________________________________________________________ 1
North America: Tel. (800) 366-2266 Fax (800) 618-8883 Asia/Pacific: Tel. Fax +85 2 2375 0618 +85 2 2375 0350 Europe: Tel. Fax +44 (1344) 869 595 +44 (1344) 300 020
GaAs Solder Bump Flip Chip Schottky Diode
MADS-001317-1320AG
V1.00
0.008"
0.013" (2) PL
0.011" (2) PL
Circuit Mounting Dimensions ( Inches )
Specification Subject to Change Without Notice
2
________________________________________________________________________________ M/A-COM, Inc.
Asia/Pacific: Tel. Fax +85 2 2375 0618 +85 2 2375 0350 Europe: Tel. Fax +44 (1344) 869 595 +44 (1344) 300 020
North America: Tel. (800) 366-2266 Fax (800) 618-8883
GaAs Solder Bump Flip Chip Schottky Diode Device Installation Procedures
The following guidelines should be observed to avoid damaging GaAs Flip-Chips.
MADS-001317-1320AG
V1.00
Cleanliness
These devices should be handled in a clean environment. Do Not attempt to Clean Die After installation.
Static Sensitivity
Gallium arsenide Schottky diodes are ESD sensitive and can be damaged by static electricity. Since Schottky diodes are rated as Class 0, proper ESD techniques should be used when handling these devices.
General Handling
These devices have a polymer layer which provides scratch protection for the junction area and the anode air bridge. Die can be handled with plastic tweezers or picked and placed automatically with a #27 tip vacuum pencil.
Assembly Requirements using Tin Lead Solder
This Flip Chip Diode employs a 6um thick, Sn 63 / Pb 37 Solderable interface as part of the 50m high solder bump. These chips are designed to be soldered onto hard or soft substrates with the junction side down. They should be mounted onto silkscreened circuits using 60/40 Sn/Pb solder paste. A typical profile for a Sn 63/ Pb 37 Soldering process is provided in Application Note, M538 Surface Mounting Instructions on the M/A-COM website www.macom.com
Typical SPICE PARAMETERS
Is (A) 1.7E-14 Rs () 4.6 N 1.08 Ct0 ( pF ) .047 M .38 Ik (A) .016 Vj (V) .86 FC .99 BV (V) 7 IBV (A) 1.0E-5
Absolute Maximum Ratings @ 25C1
Parameter Operating Temperature Storage Temperature Incident LO Power Incident RF Power Mounting Temperature Maximum Ratings -65 C to +125 C -65 C to +150 C + 20 dBm + 20 dBm +300 C for 10 seconds
Ordering Information
Part Number MADS-001317-1320AG Packaging Gel Pack
Notes 1.Exceeding these limits may cause permanent damage.
Specification Subject to Change Without Notice
M/A-COM, Inc. ________________________________________________________________________________ 3
North America: Tel. (800) 366-2266 Fax (800) 618-8883 Asia/Pacific: Tel. Fax +85 2 2375 0618 +85 2 2375 0350 Europe: Tel. Fax +44 (1344) 869 595 +44 (1344) 300 020


▲Up To Search▲   

 
Price & Availability of MADS-001317-1320AG

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X