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| MOSDESIGN SEMICONDUCTOR CORP. TAIPEI : TEL : FAX : H.K. : TEL : FAX : 886-2- 22783733 886-2- 22783633 852- 27569109 852- 27566961 DOOR CHIME DUAL TONE WIRELESS DOOR BELL FEATURES * 3 door chime sound. M1E/M1D-95 IC M1D-95 D2 WEST MINISTER D1 DING DING D0 DING DONG APPLICATION * Door bell system. . ELECTRICAL CHARACTERISTICS Characteristics Operating Voltage Operating Current Quiescent Current Driving Current Oscillator Frequency Operating Temperature Sym. VDD IOP ISB IOL FOSC Temp. Min. 2.4 1 0 Typ. 4.5 0.3 1 80 25 Max. 5 1 10 60 ( @VDD=4.5V unless otherwise specified ) Unit V mA A mA KHz No load @ VDS=1.2V External30% REMARKS APPLICATION DIAGRAM M1E A0 A1 A2 A3 A4 A5 A6 A7 VSS 9 10 1 18 VDD DO M1D-95 IR / RF VDD IR / RF A0 A1 1 16 X Y Rosc A2 A3 TE D3 D2 D1 D0 A4 A5 A6 A7 Y X DIN OUT 1K Rosc VDD VSS 8 9 * Rosc ~ M1E : 270K; M1D-95 : 390K * All specs and applications shown above subject to change without prior notice. ( , ) 1/3 2004-10-06 MOSDESIGN SEMICONDUCTOR CORP. TAIPEI : TEL : FAX : H.K. : TEL : FAX : 886-2- 22783733 886-2- 22783633 852- 27569109 852- 27566961 DOOR CHIME DUAL TONE WIRELESS DOOR BELL APPLICATION DIAGRAM CHIP FORM M1E/M1D-95 IC A0 A1 VDD IR / RF DO A2 A3 Y Rosc A4 A5 1.74 x 1.74 mm2 =VDD M1E X TE D3 D2 D1 D0 SOUND D2 WEST MINISTER D1 DING DONG D0 DING DONG A6 A7 VSS VDD Rosc Y A0 A1 A2 A3 A4 A5 A6 A7 VSS OUT IR / RF X 2.00 x1.39 mm2 =VDD 1K M1D-95 DIN VDD * Rosc ~ M1E : 270K; M1D-95 : 390K *All specs and applications shown above subject to change without prior notice. ( , ) 2/3 2004-10-06 MOSDESIGN SEMICONDUCTOR CORP. TAIPEI : TEL : FAX : H.K. : TEL : FAX : 886-2- 22783733 886-2- 22783633 852- 27569109 852- 27566961 DOOR CHIME DUAL TONE WIRELESS DOOR BELL ASSIGNMENT & POSITION 5 6 7 M1E/M1D-95 IC 8 4 (M1D-95) Y 9 X ( 0,0 ) 3 2 1 16 15 14 13 12 11 10 No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 NAME A0 VDD TEST3 OSC2 OSC1 DIM BZ TEST VSS A7 A6 A5 A4 A3 A2 A1 X -561 -560.25 -562.5 -560.25 -317.25 -163.5 559.5 559.5 559.5 559.5 559.5 379.5 198.75 23.25 -150 -325.5 UNIT : um Y -870 -723.75 -585.75 537 870 869.25 869.25 636.75 480 717.75 -872 -867.75 -867.75 -868.5 -867.75 -868.5 * CHIP SIZE ~ 2.00 x 1.39 mm2 * IC substrate should be connected to VDD in PCB (PCB IC VDD) 3/3 2004-10-06 |
Price & Availability of M1D-95
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