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| Filtronic Solid State Features * * * * * * * * 10dB Typical Gain 19dBm 1-dB Gain Compression Power 15dB Input/Output Return Loss Typical 2-26GHz Frequency Bandwidth DC Decoupled RF Input and Output Chip Size : 1.986mmX1.082mm (.078"X.043") Chip Thickness : 100m 2 Pad Dimension : 100m 2-26GHz PHEMT Amplifier LMA208G Description The Filtronic LMA208G is a medium power PHEMT amplifier that operates from 2 to 26GHz. This 5-stage travelling wave amplifier provides 10dB nominal gain and 1-dB gain compression power output of greater than 19dBm. The LMA208G is designed for use as wideband driver amplifer in ECM (Electronic Counter-Measure) and commercial communication system applications. Ground is provided to the circuitry through vias to the backside metallization. Electrical Specifications at Ta=25C (VDD=+4.0V, Zin=Zout=50) Limit Typ. 10 260 1.2 -13 -14 -30 19 21 Symbol BW S21 Idss S21 RLin RLout S12 P-1dB Psat Parameter Operating Bandwidth Small Signal Gain Drain Current at Saturation Small Signal Gain Flatness Input Return Loss Output Return Loss Reverse Isolation 1-dB Gain Compression Power Saturated Output Power Test Conditions @ .75Idss Idss @ Vg=0 V Min. 2 8 120 -9.5 -6.5 -20 16 Max. 26 360 1.5 @ .75Idss Units GHz dB mA dB dB dB dB dBm dBm Absolute Maximum Ratings Symbol Vdd Idd Pin Pt Tch Tstg Tmax. Parameter/Conditions Drain Supply Voltage Total Drain Current RF Input Power Power Dissipation Operating Channel Temperature Storage Temperature Max. Assembly Temp. (1 min. max.) Min. Max. 7 225 12 1.5 150 165 300 Units Volts mA dBm W C C C -65 Notes: 1. This GaAs MMIC is susceptible to damage from Electrostatic Discharge. Proper precautions should be used when handling these devices. 2. Specifications subject to change without notice. DSS 010 WC Phone: (408) 988-1845 Internet: http://www.FiltronicSolidState.com Fax: (408) 970-9950 Filtronic Solid State 2-26GHz PHEMT Amplifier LMA208G Assembly Diagram STANDARD BIAS Notes: 1.) Recommended lead bond technique is thermocompression wedge bonding with 0.001" (25m) diameter wire. The bond tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240C, heated tool (150-160C) is recommended. Ultrasonic bonding is not recommended. 2.) The recommended die attach is an eutectic 80/20 Gold/Tin solder, using a stage temperature of 285-290C. Maximum time at temperature is 1 minute. Use of forming gas (90% N2 , 10% H2 ) for best results. 3.) Bond on bond or stitch bond acceptable. 4.) Conductor over conductor acceptable. Conductors must not short. DSS 010 WC Phone: (408) 988-1845 Internet: http://www.FiltronicSolidState.com Fax: (408) 970-9950 Filtronic Solid State Assembly Diagram VARIABLE BIAS 2-26GHz PHEMT Amplifier LMA208G Notes: 1.) Recommended lead bond technique is thermocompression wedge bonding with 0.001" (25m) diameter wire. The bond tool force shall be 35-38 gram. Bonding stage temperature shall be 230-240C, heated tool (150-160C) is recommended. Ultrasonic bonding is not recommended. 2.) The recommended die attach is an eutectic 80/20 Gold/Tin solder, using a stage temperature of 285-290C. Maximum time at temperature is 1 minute. Use of forming gas (90% N2 , 10% H2 ) for best results. 3.) Bond on bond or stitch bond acceptable. 4.) Conductor over conductor acceptable. Conductors must not short. DSS 010 WC Phone: (408) 988-1845 Internet: http://www.FiltronicSolidState.com Fax: (408) 970-9950 Filtronic Solid State Mechanical Outline 2-26GHz PHEMT Amplifier LMA208G Notes: 1.) Unless Otherwise specified. 2.) All units are in micron (m). 3.) All bond pads are 100 X 100 m2. 4.) Bias pad (VDD) size is 100 X 121.5 m2. DSS 010 WC Phone: (408) 988-1845 Internet: http://www.FiltronicSolidState.com Fax: (408) 970-9950 |
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