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Features
* * * * * * * * * * * *
128 bit memory array laser programmable Bit duration : 32 periods of RF field Bit coding according to ISO FDX-B On chip resonnance capacitor On chip supply buffer capacitor Wide dynamic range On chip voltage limiter Full wave rectifier Large modulation depth Operating frequency 100 - 150 kHz Very small chip size convenient for implantation Very low power consumption
EM MICROELECTRONIC-MARIN SA
H4005
ISO 11'784 / 11'785 COMPLIANT READ ONLY CONTACTLESS IDENTIFICATION DEVICE
Typical Operating Configuration
Coil 2 L
H4005
Coil 1
Description
The H4005 is a CMOS integrated circuit intented for use in electronic Read Only RF Transponders. The circuit is powered by an external coil placed in an electromagnetic field, and gets its master clock from the same field via one of the coil terminals. The other coil terminal is affected by the modulator. By turning on and off the modulation current, the chip will send back the 128 bits of information contained in a factory pre-programmed memory array. The programming of the chip is performed by laser fusing of polysilicon links in order to store a unique code on each chip. Due to the low power consumption of the logic core, no supply buffer capacitor is required. Only an external coil is needed to obtain the chip function. A parallel resonance capacitor of 75 pF is also integrated.
Fig. 1
Pin Assignment
COIL2 H4005 COIL1
VSS
VDD
Applications
* Animal implantable transponder * Animal ear tag * Industrial transponder COIL 1 COIL 2 Coil terminal / Clock input Coil terminal
Fig. 2
1
Absolute Maximum Ratings
Parameter
Maximum AC peak Current induced on COIL1 and COIL2
Power Supply
EM MICROELECTRONIC-MARIN SA
Symbol Conditions
ICOIL 30 mA Parameter Maximum coil current AC Voltage on Coil Supply Frequency VDD -0.3 to 7.5 V Tstore -55 to +200C
H4005
Symbol Top ICOIL Vcoil fcoil 100 14* 150 Min. -40 Typ. Max. Units +85 10 C mA Vpp kHz Table 2
Operating Conditions
Operating Temperature
Storage temperature Electrostatic discharge maximum to MIL-STD-883C method 3015
VESD
1000 V
*) The AC Voltage on Coil is limited by the on chip voltage limitation circuitry.
Table 1 Stresses above these listed maximum ratings may cause permanent damage to the device. Exposure beyond specified operating conditions may affect device reliability or cause malfunction.
Handling Procedures
This device has built-in protection against high static voltages or electric fields; however due to the unique properties of this device, anti-static precautions should be taken as for any other CMOS component.
System Principle
Fig. 3
Transceiver
Transponder
Oscillator
Antenna Driver
Coil 1
H4005
Data Decoder Filter & Gain Demodulator Coil 2
Data received from transponder
Signals on coils
Signal on Transponder coil
Signal on Transceiver coil
RF Carrier
Data
2
Electrical Characteristics
VDD = 1.5 V VSS = 0 V fcoil = 134 kHz Sine wave Top = 25C VC1 = 1.0 V with positive peak at VDD and negative peak at VDD - 1 V
Parameter
Supply Voltage Supply Current
EM MICROELECTRONIC-MARIN SA
Symbol
VDD IDD
H4005
Min.
1.5
unless otherwise specified
Test Conditions
Typ.
Max. Units
1)
V A V
1.5 1.5 0.9 2.1 2.1 1.3 3.0 3.0
Rectified Supply Voltage C2 pad Modulator ON voltage drop C1 pad Modulator ON voltage drop Coil1 - Coil2 capacitance Power Supply Capacitor
VDD VONC2
VC2 -VC1 = 2.8 VDC
Modulator Switch = "ON" with ref. to VDD with ref. to VDD with ref. to VDD
VDD = 1.5V IVDDC2 = 100 A VDD = 5.0V IVDDC2 = 1 mA VDD = 5.0V IVDDC1 = 1 mA
V V V
VONC1
Cres Csup
Vcoil = 100 mVRMS
f = 10 kHz
75 2) 150
pF pF Table 3
1) The maximum voltage is defined by forcing 10 mA on C1 - C2 2) The toleranceof the resonant capacitor is 15 % over the whole production. On a wafer basis and on process statistics, the tolerance is 2%
Timing Characteristics
VDD = 1.5 V VSS = 0 V fcoil = 134 kHz Sine wave Top = 25C VC1 = 1.0 V with positive peak at VDD and negative peak at VDD - 1 V unless otherwise specified Timings are derived from the field frequency and are specified as a number of RF periods.
Parameter
Read Bit Period
Symbol
trdb
Test Conditions
Value
32
Units
RF periods
Table 4
Timing Waveforms
T OC 32 T OC
Fig. 4
COIL1
Serial Data Out
BIT n
BIT n+1
BIT n+2
Binary Data
0
1
1
0
1
0
0
1
Memory Output
Modulator Output
3
Block Diagram
COIL1
EM MICROELECTRONIC-MARIN SA
CLOCK EXTRACTOR VDD AC1 FULL WAVE RECTIFIER Cres AC2 Csup SEQUENCER VSS
H4005
Logic Clock
MEMORY ARRAY
COIL2
DATA MODULATOR
Serial Data out
DATA ENCODER Modulation Control
Fig. 4
Functional Description
General The H4005 is supplied by means of an electromagnetic field induced on the attached coil. The AC voltage is rectified in order to provide a DC internal supply voltage. When the DC voltage is sufficient the chip sends data continuously. When the last bit is sent, the chip will continue with the first bit until the power goes off. Full Wave Rectifier The AC input induced in the external coil by an incident magnetic field is rectified by a Graetz bridge. The bridge will limit the internal DC voltage to avoid malfunction in strong fields. Clock extractor One of the coil terminals (COIL1) is used to generate the master clock for the logic function. The output of the clock extractor drives a sequencer. Sequencer The sequencer provides all necessary signals to address the memory array and to encode the serial data out. The data rate is set to 32 clocks per bit. Data Encoder The data is coded according to the FDX-B scheme. At the beginning of each bit, a transition will occur. A logic bit "1" will keep its state for the whole bit duration and a logic bit "0" will show a transition in the middle of the bit duration (refer to fig. 4). The FDX-B allows an advance of up to 8 clocks in the ON to OFF transition. Due to its low power consumption, there is no difference in performance for the H4005 when implementing a transition advance. No clock advance is provided on the standard version. Data Modulator The data modulator is controlled by the signal Modulation Control in order to induce a high current on COIL2 terminal when this signal is at logic "0". This will affect the magnetic field according to the data stored in the memory array. Memory The memory contains 128 bits laser programmed during manufacturing according to a customer list of codes. The bits are read serially in order to control the modulator. The 128 bits output sequence is repeated continuously until power goes off. Memory Map 128 bit pattern ISO 11785
Send bit 1 first 1 11 12 Identification code 64 + 8 bits 83 84 101 102 CRC 16 + 2 bits Extension 24 + 3 bits 128
Header 11 bits
National code
Country
Reserved
64 Send first
27 26
17 16 15
21
64 bit pattern Identification code ISO 11784
Fig. 5
4
Memory organisation The structure of the 128 bits is as follows :
The header is sent first and is used to identify the start of the sequence. It is composed of 11 bits having a bit pattern which is unique in the data stream. 00000000001 The header is followed by the Identification code which is composed of 64 bits organised in 8 blocks of 8 bits. Each block of 8 bits is trailed by a control bit set to logic "1" to prevent that the header is reproduced in the data. Bit 64 is transmitted first. Bit 1 is a flag for animal "1" or non-animal "0" application. Bits 2-15 are a reserved code for future use. Bit 16 is a flag for additional data block "1" or no additional data block "0". Bits 17-26 ISO 3166 Numeric country code Bits 27-64 National identification code The next two 8 bit blocks contain the 16 CRC-CCITT error detection bits. LSB is transmitted first, and the 2 block are trailed with with a binary "1". The data stream with 3 blocks of 8 bits trailed with a logical "1" representing the extension bits. The extension bits are planned for future extension in which for instance information from sensors or contents of trailing pages may be stored. In the current version the standard coding will be 000000001 000000001 000000001 and the flag bit 16 of the identification code "0". Resonance Capacitor The Resonance Capacitor is integrated, and its value is typically 75 pF.
EM MICROELECTRONIC-MARIN SA
H4005
Typical Capacitor Variation versus Temperature Cr Tolerance [%]
100.3 100.2 100.1 100.0 99.9 99.8 99.7 -50 -30 -10 10 30 50 70 90 100.7
Temperature [C]
Fig. 6
Pad Description
Pad
1 2 3 4
Name
COIL2 COIL1 VDD VSS
Function
Coil Terminal 2 / Data output Coil Terminal 1 / Clock input Positive Internal Supply Voltage Negative Internal Supply Voltage
1
4
2
3
Table 5
5
Package and Ordering Information
Dimensions of PCB version
EM MICROELECTRONIC-MARIN SA
CHIP Dimensions
150 1016 H4005
H4005
1118 137 137 COIL2 VSS
355
H4005
COIL1 VDD 118 118 1380 137 160 137 COIL2 VSS
8.0
150
4.0
1.0 1016
200 325
H4105 Bumped
COIL1 VDD 118 118
200 160
95 Dimensions in [mm]
600
Fig. 7
IC Thickness : 280 m 25 m Bump Height : 25 m 5 m
Dimensions in m
Fig. 8
Ordering Information The H4005 is available PCB
in chip form without Bumps in chip form with Bumps
H4005 IC H4105 Bumped IC H4005 COB
EM MICROELECTRONIC-MARIN SA cannot assume responsibility for use of any circuitry described other than circuitry entirely embodied in an EM MICROELECTRONIC-MARIN SA product. EM MICROELECTRONIC-MARIN SA reserves the right to change the circuitry and specifications without notice at any time. You are strongly urged to ensure that the information given has not been superseded by a more up to date version. (c) 1997 EM Microelectronic-Marin SA, 11/97 Rev. C/190
EM MICROELECTRONIC-MARIN SA , 2074 Marin, Switzerland, Tel. +41 32 755 5111, Fax +41 32 755 5403
6

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