 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D189 BY614 Miniature high-voltage soft-recovery rectifier Product specification Supersedes data of May 1996 1996 Sep 26 Philips Semiconductors Product specification Miniature high-voltage soft-recovery rectifier FEATURES * Glass passivated * High maximum operating temperature * Low leakage current * Excellent stability * Soft-recovery switching characteristics * Very compact construction. k handbook, halfpage a BY614 expansion of all used parts are matched. The package is designed to be used in an insulating medium such as resin, oil or SF6 gas. DESCRIPTION Miniature glass package, using a high temperature alloyed construction. This package is hermetically sealed and fatigue free as coefficients of MAM162 APPLICATIONS * Miniature high-voltage assemblies such as voltage multipliers. The cathode lead is marked with a black band. Fig.1 Simplified outline (SOD61H2) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VRSM VRRM VRW VR IF(AV) PARAMETER non-repetitive peak reverse voltage repetitive peak reverse voltage working reverse voltage continuous reverse voltage average forward current averaged over any 20 ms period; PCB mounting (see Fig.5); Tamb = 65 C; see Fig.2; see also Fig.3 t 10 ms; half sinewave; Tj = Tj max prior to surge; VR = VRWmax CONDITIONS MIN. - - - - - MAX. 2200 2200 2000 2000 50 V V V V mA UNIT IFRM IFSM repetitive peak forward current non-repetitive peak forward current - - 500 1 mA A Tstg Tj storage temperature junction temperature -65 -65 +150 +150 C C 1996 Sep 26 2 Philips Semiconductors Product specification Miniature high-voltage soft-recovery rectifier ELECTRICAL CHARACTERISTICS Tj = 25 C; unless otherwise specified. SYMBOL VF IR Qr PARAMETER forward voltage reverse current recovery charge CONDITIONS IF = 50 mA; Tj = Tj max; see Fig.4 VR = VRWmax; Tj = 120 C when switched from IF = 100 mA to VR 100 V and dIF/dt = -200 mA/s; see Fig.6 when switched from IF = 100 mA to VR 100 V and dIF/dt = -200 mA/s; see Fig.6 when switched from IF = 100 mA to VR 100 V and dIF/dt = -200 mA/s; see Fig.6 VR = 0 V; f = 1 MHz MIN. - - - TYP. - - - BY614 MAX. 6 3 1 V UNIT A nC tf fall time 100 - - ns trr reverse recovery time - - 300 ns Cd diode capacitance - 2 - pF THERMAL CHARACTERISTICS SYMBOL Rth j-tp Rth j-a Note 1. Device mounted on epoxy-glass printed-circuit board, 1.5 mm thick; thickness of copper 40 m, see Fig.5. For more information please refer to the "General Part of associated Handbook". PARAMETER thermal resistance from junction to tie-point thermal resistance from junction to ambient note 1 CONDITIONS lead length = 10 mm VALUE 100 155 UNIT K/W K/W 1996 Sep 26 3 Philips Semiconductors Product specification Miniature high-voltage soft-recovery rectifier GRAPHICAL DATA MBH389 BY614 handbook, halfpage 80 handbook, halfpage 1000 MBH390 IF(AV) (mA) 60 P (mW) a = 3 2.5 2 1.57 1.42 40 500 20 0 0 40 80 160 120 Tamb (C) 0 0 50 IF(AV) (mA) 100 a = 1.57; = 0.5; VR = VRWmax; device mounted as shown in Fig.5. a = IF(RMS)/IF(AV); = 0.5; VR = VRWmax. Fig.2 Maximum permissible average forward current as a function of ambient temperature (including losses due to reverse leakage). Fig.3 Maximum steady state power dissipation (forward plus leakage losses) as a function of average forward current. handbook, halfpage handbook, halfpage 200 MBH402 50 25 IF (mA) 7 50 100 2 3 0 0 10 VF (V) 20 MGA200 Dotted line: Tj = 150 C. Solid line: Tj = 25 C. Dimensions in mm. Fig.4 Forward current as a function of maximum forward voltage. Fig.5 Device mounted on a printed-circuit board. 1996 Sep 26 4 Philips Semiconductors Product specification Miniature high-voltage soft-recovery rectifier BY614 handbook, halfpage I F dI F dt t rr 10% t Qr 90% IR tf MGD569 Fig.6 Reverse recovery definitions. 1996 Sep 26 5 Philips Semiconductors Product specification Miniature high-voltage soft-recovery rectifier PACKAGE OUTLINE BY614 k handbook, full pagewidth a 3 max 0.6 2.2 max 32.5 min 3 max 32.5 min MGD602 Dimensions in mm. The marking band indicates the cathode. Fig.7 SOD61H2. DEFINITIONS Data Sheet Status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. 1996 Sep 26 6 |
Price & Availability of BY614
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |