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DISCRETE SEMICONDUCTORS
DATA SHEET
OM2070 Wideband amplifier module
Product specification File under Discrete Semiconductors, SC16 1995 Nov 14
Philips Semiconductors
Product specification
Wideband amplifier module
DESCRIPTION
OM2070
A three-stage wideband amplifier in hybrid integrated circuit form on a thin-film substrate. The device is intended for use in mast-head booster amplifiers, as an amplifier in MATV and CATV systems and as a general purpose amplifier for VHF and UHF applications. PINNING PIN 1 2 3 4 5 6 7 8 9 DESCRIPTION input common common common common supply (+) common common output/supply (+) Fig.1 Simplified outline.
9 87 65 4 321
MLA418
pin 1 identification
handbook, halfpage
1
QUICK REFERENCE DATA SYMBOL f ZS, ZL GT GT Vo(rms) PARAMETER frequency range source and load impedance transducer gain = S212 flatness of frequency response output voltage (RMS value) dim = -60 dB; 3rd order intermodulation (3-tone) VHF UHF F VB Tamb noise figure DC supply voltage ambient operating temperature - - - 10.8 -20 113 112 4.8 12 - - - - 13.2 +70 dBV dBV dB V C CONDITIONS - - - MIN. 40 - 75 28 1 TYP. MAX. 860 - - - UNIT MHz dB dB
1995 Nov 14
2
Philips Semiconductors
Product specification
Wideband amplifier module
CIRCUIT DIAGRAM AND PRINTED-CIRCUIT BOARD
OM2070
C1
handbook, full pagewidth
C3 R8
C6 R13 9
R3
R1 1 R2 2,3,4,5 R4 TR1 C2
R6 TR2 C4
R11 TR3
R5
R7
R9
R10
R12 R14 7,8 C5 6
MGA201
Fig.2 Circuit diagram.
handbook, full pagewidth
1
9
1 (9x)
TOP VIEW
L 75 track C C
MGA202
75 track
BOTTOM VIEW
L > 5 H; e.g. catalogue No. 3122 108 20150, or 27 turns enamelled 0.3 mm copper wire wound on a ferrite core (material 4B1; catalogue No. 3122 104 91110) with a diameter of 1.6 mm. C > 220 pF ceramic capacitor.
Fig.3 Printed-circuit board holes and tracks.
1995 Nov 14
3
Philips Semiconductors
Product specification
Wideband amplifier module
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL Tamb Tstg VB PIM storage temperature DC supply voltage peak incident powers on pins 1 and 8 PARAMETER ambient operating temperature MIN. -20 -40 - -
OM2070
MAX. +70 +125 15 100
UNIT C C V mW
CHARACTERISTICS SYMBOL Measuring conditions Tamb VB ZS ZL Z0 f Performance IB GT GT VSWRin VSWRout S122 Vo(rms) supply current transducer gain = S212 input; note 1 output; note 1 f = 100 MHz f = 860 MHz output voltage (RMS value) dim = -60 dB; 3rd order intermodulation (3-tone) VHF UHF F noise figure Operating conditions Tamb VB f ZS ZL Note 1. Highest value (for sample) occurring in the frequency range. ambient operating temperature DC supply voltage frequency range source impedance load impedance -20 10.8 40 - - - 12 - 75 75 +70 13.2 860 - - C V MHz 111 110 - 113 112 4.8 - - - dBV dBV dB flatness of frequency response individual maximum VSWR individual maximum VSWR back attenuation - 26 - - - - - 100 28 1 2.3 1.9 45 35 - 31 - - - - - dB dB mA dB dB ambient operating temperature DC supply voltage source impedance load impedance characteristic impedance of HF connections frequency range - - - - - 40 25 12 75 75 75 - - - - - - 860 C V MHz PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
1995 Nov 14
4
Philips Semiconductors
Product specification
Wideband amplifier module
OM2070
handbook, full pagewidth
30
MGD070
GT (dB) 29
typ
28
27
26
25 0 Gain over entire frequency range. Z0 = 75 . 200 400 600 800 f (MHz) 1000
Fig.4 Transducer gain as a function of frequency.
MGD071
MGD072
handbook, halfpage
120
300 IB (mA) Vo(rms) 200
handbook, halfpage
2.5
Vo(rms) (dBV)
GT (dB)
0
110
-2.5 -5.0
(1) (2) (3)
100
IB
100
-7.5 -10.0
90 5 10 VB (V) 15
20
-12.5
5
10
VB (V)
15
Reference 0 dB at 12 V. (1) f = 100 MHz. (2) f = 860 MHz. (3) f = 500 MHz.
Fig.5
Output voltage and supply current as a function of supply voltage; typical values.
Fig.6
Variation of transducer gain as a function of supply voltage; typical values.
1995 Nov 14
5
Philips Semiconductors
Product specification
Wideband amplifier module
OM2070
1
handbook, full pagewidth
0.5
2
0.2
5 10
+j 0 -j 0.2 0.5 700 860 MHz 0.2
500 100 300 2 5 10
10 5
0.5 1
2
MGD073
Fig.7 Input impedance derived from input reflection coefficient (S11), co-ordinates in ohms x 75; typical values.
1
handbook, full pagewidth
0.5
2
0.2 700
5 10
+j 0 -j 0.2 500 0.5 100 300 860 MHz 2 5 10
10 5
0.2
0.5 1
2
MGD074
Fig.8 Output impedance derived from output reflection coefficient (S22), co-ordinates in ohms x 75; typical values. 1995 Nov 14 6
Philips Semiconductors
Product specification
Wideband amplifier module
MOUNTING The module should preferably be mounted on a double-sided printed-circuit board, see Fig.3. Input and output should be connected to 75 tracks. The connection to the common pins should be as close to the seating plane as possible. SOLDERING Hand soldering The maximum contact time for a soldering iron temperature of 260 C up to the seating plane is 5 s. Dip or wave soldering
OM2070
The maximum permissible temperature for the solder is 260 C. It must not be in contact with the joint for more than 5 s. The total contact time of successive solder waves must not exceed 5 s. The device may be mounted against the printed-circuit board, but the temperature of the device must not exceed 125 C. If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature below the allowable limit.
PACKAGE OUTLINE
pin 1 identification 5 max
handbook, full pagewidth
27 max
seating plane
22 max
1
4.5 3.0 0.56 0.40
1
2
3
4
5
6
7
8
9 0.2 2.54 (9x)
MGD069
Dimensions in mm.
Fig.9 Resin coated encapsulation.
1995 Nov 14
7
Philips Semiconductors
Product specification
Wideband amplifier module
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
OM2070
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1995 Nov 14
8

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