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 QSC112, QSC113, QSC114 Plastic Silicon Infrared Phototransistor
October 2006
QSC112, QSC113, QSC114 Plastic Silicon Infrared Phototransistor
Features
Tight production distribution Steel lead frames for improved reliability in solder
Description
The QSC112/113/114 is a silicon phototransistor encapsulated in an infrared transparent, black T-1 package.
PACKAGE DIMENSIONS
mounting
Good optical-to-mechanical alignment Plastic package is infrared transparent black to
attenuate visible light Can be used with QECXXX LED Black plastic body allows easy recognition from LED
Package Dimensions
0.116 (2.95) REFERENCE SURFACE 0.052 (1.32) 0.032 (0.082) 0.193 (4.90)
0.030 (0.76) NOM 0.800 (20.3) MIN
0.050 (1.27)
EMITTER 0.100 (2.54) NOM
Schematic
COLLECTOR
0.155 (3.94) 0.018 (0.46) SQ. (2X)
Notes: 1. Dimensions of all drawings are in inches (mm). 2. Tolerance is 0.10 (.25) on all non-nominal dimensions unless otherwise specified.
EMITTER
(c)2005 Fairchild Semiconductor Corporation
1
www.fairchildsemi.com
QSC112, QSC113, QSC114 Rev. 1.0.1
QSC112, QSC113, QSC114 Plastic Silicon Infrared Phototransistor
Absolute Maximum Ratings (TA = 25C unless otherwise specified)
Symbol
TOPR TSTG TSOL-I TSOL-F VCE VEC PD
Parameter
Operating Temperature Storage Temperature Soldering Temperature (Iron)(2,3,4) Soldering Temperature (Flow)(2,3) Collector-Emitter Voltage Emitter-Collector Voltage Power Dissipation(1)
Rating
-40 to +100 -40 to +100 240 for 5 sec 260 for 10 sec 30 5 100
Units
C C C C V V mW
Notes: 1. Derate power dissipation linearly 1.33 mW/C above 25C. 2. RMA flux is recommended. 3. Methanol or isopropyl alcohols are recommended as cleaning agents. 4. Soldering iron 1/16" (1.6mm) minimum from housing.
Electrical/Optical Characteristics (TA =25C)
Symbol Parameter
PS ICEO BVCEO BVECO IC(ON) Peak Sensitivity Wavelength Reception Angle Collector-Emitter Dark Current Collector-Emitter Breakdown Emitter-Collector Breakdown On-State Collector Current QSC112 On-State Collector Current QSC113 On-State Collector Current QSC114 VCE(sat) tr tf Saturation Voltage Rise Time Fall Time Ee = 0.5 mW/cm2, IC = 0.5 mA(5) VCC = 5 V, RL = 100 , IC = 2 mA 5.0 5.0 VCE = 10 V, Ee = 0 IC = 1 mA IE = 100 A Ee = 0.5 mW/cm2, VCE = 5 V(5) 30 5 1 2.40 4.00 0.4 V s 4 9.60
Test Conditions
Min.
Typ.
880 8
Max. Units
nm 100 nA V V mA
Note: 5. = 880 nm, AlGaAs.
2 QSC112, QSC113, QSC114 Rev. 1.0.1
www.fairchildsemi.com
QSC112, QSC113, QSC114 Plastic Silicon Infrared Phototransistor
Typical Performance Curves
Figure 1. Light Current vs. Radiant Intensity
102
VCE = 5V GaAs Light Source
Figure 2. Angular Response Curve
110 100 90 80 70 60 50 40 30 20 10 0 1.0
IC(ON) - Light Current (mA)
120 130
10
1
140 150 160 170 180 1.0
10
-1
100
0.8
0.6
0.4
0.2
0.0
0.2
0.4
0.6
0.8
0.1
Ee - Radiant Intensity (mW/cm 2)
1
Figure 3. Dark Current vs. Collector - Emitter Voltage
101
101
Figure 4. Light Current vs. Collector - Emitter Voltage
Ie = 1mW/cm 2
I CEO - Dark Current (nA)
100
I L - Normalized Light Current
Ie = 0.5mW/cm 2 100 Ie = 0.2mW/cm 2 Ie = 0.1mW/cm 2
10-1
10-1 Normalized to: VCE = 5V Ie = 0.5mW/cm 2 TA = 25 oC 10-2 0.1
10-2
10-3 0
5
10
15
20
25
30
1
10
VCE - Collector-Emitter Voltage (V)
VCE - Collector-Emitter Voltage (V)
Figure 5. Dark Current vs. Ambient Temperature
104
Normalized to: VCE = 25V
I CEO - Normalized Dark Current
103
TA = 25 C
o
VCE = 25V
VCE = 10V
102
101
100
10-1 25
50
75
100
o TA - Ambient Temperature ( C )
3 QSC112, QSC113, QSC114 Rev. 1.0.1
www.fairchildsemi.com
QSC112, QSC113, QSC114 Plastic Silicon Infrared Phototransistor
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. FACT Quiet SeriesTM GlobalOptoisolatorTM GTOTM HiSeCTM I2CTM i-LoTM ImpliedDisconnectTM IntelliMAXTM ISOPLANARTM LittleFETTM MICROCOUPLERTM MicroFETTM MicroPakTM MICROWIRETM MSXTM MSXProTM Across the board. Around the world.TM The Power Franchise(R) Programmable Active DroopTM ACExTM ActiveArrayTM BottomlessTM Build it NowTM CoolFETTM CROSSVOLTTM DOMETM EcoSPARKTM E2CMOSTM EnSignaTM FACTTM FAST(R) FASTrTM FPSTM FRFETTM DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD'S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
OCXTM OCXProTM OPTOLOGIC(R) OPTOPLANARTM PACMANTM POPTM Power247TM PowerEdgeTM PowerSaverTM PowerTrench(R) QFET(R) QSTM QT OptoelectronicsTM Quiet SeriesTM RapidConfigureTM RapidConnectTM SerDesTM ScalarPumpTM
SILENT SWITCHER(R) SMART STARTTM SPMTM StealthTM SuperFETTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TCMTM TinyBoostTM TinyBuckTM TinyPWMTM TinyPowerTM TinyLogic(R) TINYOPTOTM TruTranslationTM UHCTM
UniFETTM UltraFET(R) VCXTM WireTM
LIFE SUPPORT POLICY
FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS Definition of Terms
Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. I20
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production
4 QSC112, QSC113, QSC114 Rev. 1.0.1
www.fairchildsemi.com


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