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AMC1117
www.addmtek.com DESCRIPTION The AMC1117 series of positive adjustable and fixed regulators is designed to provide 1A for applications requiring high efficiency. All internal circuitry is designed to operated down to 800mV input to output differential and the dropout voltage is fully specified as a function of load current. The AMC1117 offers current limiting and thermal protection. The on chip trimming adjusts the reference voltage accuracy to 1%.
1A LOW DROPOUT POSITIVE REGULATOR
FEATURES Output current of 1A typical Three-terminal adjustable or fixed 1.5V, 1.8V, 2.5V, 3.3V, 5.0V outputs Low dropout of typical 800mV Thermal protection built in Typical 0.015% line regulation Typical 0.01% load regulation Fast transient response Available in SOT-223 and TO-252 packages Pin assignment identical to earlier LT1117 series.
APPLICATIONS 2.85V Model for SCSI-2 Active Termination Battery Charger High Efficiency Linear Regulators Battery Powered Instrumentation Post Regulator for Switching DC/DC Converter VOLTAGE OPTIONS AMC1117-1.5 AMC1117-1.8 AMC1117-2.5 AMC1117-3.3 AMC1117-5.0 AMC1117 - 1.5V Fixed - 1.8V Fixed - 2.5V Fixed - 3.3V Fixed - 5.0V Fixed - Adjustable Output
PACKAGE PIN OUT
3. VIN 2. VOUT 1. ADJ/GND
3-Pin Plastic SOT-223 Surface Mount (Top View)
3. VIN 2. V out 1. ADJ/GND
3-Pin Plastic TO-252 Surface Mount (Top View)
ORDER INFORMATION TA (OC) 0 to 70
Note:
SK
SOT-223 3-pin
SJ
TO-252 3-pin
AMC1117-X.XSKF (Lead Free) AMC1117SKF (Lead Free)
AMC1117-X.XSJF (Lead Free) AMC1117SJF (Lead Free)
Append the letter "T" to part number (i.e. AMC1117-X.XSJT).
1.All surface-mount packages are available in Tape & Reel. 2.The letter "F" is marked for Lead Free process.
Copyright (c) 2006 ADDtek Corp.
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BLOCK DIAGRAM
VIN
VOUT
ADJ
For Fixed Output Options GND
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ABSOLUTE MAXIMUM RATINGS Input Voltage Operating Junction Temperature Range, TJ Storage Temperature Range Lead Temperature (soldiering, 10 seconds)
Note 1: Exceeding these ratings could cause damage to the device. out of the specified terminal. All voltages are with respect to Ground. (Note1)
7V 0 OC to 150 OC -65 OC to 150 OC 260 OC
Currents are positive into, negative
Package SKF SJF
JA (OC /W ) 136 80
POWER DISSIPATION TABLE TA=70 OC Derating factor ( mW/ OC) TA 25 OC TA 25 OC Power rating(mW) Power rating(mW) 7.35 12.5 919 1562 588 1000
TA= 85 OC Power rating (mW) 478 812
Note : 1. JA: Thermal Resistance-Junction to Ambient, DF : Derating factor, Po: Power consumption. Junction Temperature Calculation: TJ = TA + (PD x JA), Po = DF x (TJ- TA) The JA numbers are guidelines for the thermal performance of the device/PC-board system. All of the above assume no ambient airflow. 2. JT: Thermal Resistance-Junction to Tab, TC: case(Tab) temperature, TJ = TC + (PD x JT) For SK package, JT = 15.0 OC /W. For SJ package, JT = 7.0 OC /W.
RECOMMENDED OPERATING CONDITIONS Recommended Operating Conditions Parameter Symbol Min. Typ. Max. Input Voltage VIN 2.7 7 Load Current (with adequate heat sinking) IO 5 Input Capacitor (VIN to GND) 10 Output Capacitor with ESR of 10 max., (VOUT to GND) 10 Junction temperature TJ 125
Units V mA F F
O
C
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ELECTRICAL CHARACTERISTICS Unless otherwise specified, IO =10mA, and TJ = 25 OC. Parameter Reference Voltage AMC1117 AMC1117-1.5 AMC1117-1.8 Output Voltage AMC1117-2.5 AMC1117-3.3 AMC1117-5.0 AMC1117 Line Regulation AMC1117-X.X AMC1117 Load Regulation AMC1117-X.X Dropout Voltage Minimum Load Current Quiescent Current
(Note 1)
Symbol VREF
Test Conditions IO = 10mA, VIN = 5V 10mA IO 1A, 2.65V VIN 7V IO = 10mA, VIN = 3.0V 10mA IO 1A, 3.0V VIN 7V IO = 10mA, VIN = 3.3V 10mA IO 1A, 3.3V VIN 7V IO = 10mA, VIN = 4.0V 10mA IO 1A, 4.0V VIN 7V IO = 10mA, VIN = 4.8V 10mA IO 1A, 4.8V VIN 7V IO = 10mA, VIN = 6.5V 10mA IO 1A, 6.5V VIN 7V IO = 10mA, VOUT +1.5V VIN 7V IO = 10mA, VOUT +1.5V VIN 7V 10mA IO 1A, VIN = VOUT +1.5V 10mA IO 1A, VIN = VOUT +1.5V IO = 10mA, VIN2.65V IO = 500mA, VIN2.65V IO = 1A, VIN2.65V VIN 7V
AMC1117 Min Typ Max 1.238 1.225 1.485 1.470 1.782 1.764 2.475 2.450 3.267 3.235 4.950 4.900 1.250 1.250 1.500 1.500 1.8 1.8 2.500 2.500 3.300 3.300 5.000 5.000 0.04 1.0 0.10 1.0 0.8 0.8 0.8 2 6 1 1.2 50 0.01 60 75 120 0.1 1.262 1.275 1.515 1.530 1.818 1.836 2.525 2.550 3.333 3.365 5.050 5.100 0.20 6.0 0.40 10.0 1.15 1.25 1.30 7 13
Units V
VOUT
V
VOI VOL
% mV % mV V mA mA A A %/W dB
V
AMC1117-X.X
IQ ICL
VIN 7V VIN - VOUT = 3V IO = 10mA, VIN - VOUT = 2V TA = 25 C, 30 ms pulse
O
Current Limit Adjust Pin Current Thermal Regulation
(Note 2)
Ripple rejection (Note 2)
Note 1: Note 2:
RR
fO = 120HZ, 1V RMS, I O = 400mA, VIN - VOUT = 3V
For the adjustable device, the minimum load current is the minimum current required to maintain regulation. Normally the current in the resistor divider used to set the output voltage is selected to meet the minimum load current requirement. These parameters, although guaranteed, are not tested in production.
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CHARACTERIZATION CURVES Unless otherwise specified, VIN= VOUT+2VCIN=1FCOUT=4.7FTA=25 OC
Load Regulation
2.53 2.52 2.51
Load Regulation
2.88 2.87
AMC1117-2.85
AMC1117-2.5
VO (V)
2.5 2.49 2.48 2.47 2.46 0 200 400 600 800 1000
VO (V)
2.86 2.85 2.84 2.83 2.82 0 200 400 600 800 1000
IO (mA)
IO (mA)
Load Regulation
3.34 3.33 3.32 3.31 3.3 3.29 3.28 3.27 3.26 0
AMC1117-3.3
5.02 5.01 5 4.99 4.98 4.97 4.96 4.95 4.94
Load Regulation
AMC1117-5.0
VO (V)
VO (V)
200
400
600
800
1000
0
200
400
600
800
1000
IO (mA)
IO (mA)
Temperature Stability
Output Voltage Change (%)
2 1.5 1 0.5 0 -0.5 -1 -1.5 -2 -40 -20 0 20 40 60 80 100 120 10
Quiescent Current vs. Temperature
Quiescent Current (mA)
8 6 4 2 0 -40 -20 0 20 40 60 80 100 120
TA (OC)
TA (OC)
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Copyright (c) 2006 ADDtek Corp.
AMC1117
APPLICATION INFORMATION
VIN VOUT AMC1117 121 1%
VIN
AMC1117
VOUT
R1
121
C1
10F
C2 R2
1k 100F TTL
10F
1k 100F 1k 365 1%
Adjustable Regulator VOUT = 1.25V ( 1+ R2 ) R1
5V Regulator with Shutdown
VIN
AMC1117-X.X
VOUT
C1
10F
C2
100F
Fixed Voltage Regulator
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Application Note:
Maximum Power Calculation: TJ(MAX) - TA(MAX) JA TJ(OC): Maximum recommended junction temperature TA(OC): Ambient temperature of the application JA(OC/W): Junction-to-junction temperature thermal resistance of the package, and other heat dissipating materials. The maximum power dissipation of a single-output regulator : PD(MAX) = [(VIN(MAX) - VOUT(NOM))] x IOUT(NOM) + VIN(MAX) x IQ PD(MAX)= Where: VOUT(NOM) = the nominal output voltage IOUT(NOM) = the nominal output current, and IQ = the quiescent current the regulator consumes at IOUT(MAX) VIN(MAX) = the maximum input voltage JA = (150 OC - TA)/ PD
Then Thermal consideration:
When power consumption is over about 404 mW (for SOT-223 package, 687mW for TO-252 package, at TA=70 OC), additional heat sink is required to control the junction temperature below 125 OC. The junction temperature is: TJ = P D (JT + CS + SA) + TA P D: Dissipated power. JT: Thermal resistance from the junction to the mounting tab of the package. CS: Thermal resistance through the interface between the IC and the surface on which it is mounted. (Typically, CS < 1.0C/W) SA: Thermal resistance from the mounting surface to ambient (thermal resistance of the heat sink). If PC Board copper is going to be used as a heat sink, below table can be used to determine the appropriate size of copper foil required. For multi-layered PCB, these layers can also be used as a heat sink. They can be connected with several through hole vias. 59 PCB SA (OC /W) 2 PCB heat sink size (mm ) 500 45 1000 38 1500 33 2000 27 3000 24 4000 21 5000
Recommended figure of PCB area used as a heat sink.
through hole vias
(Top View)
(Bottom View)
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PACKAGE
3-Pin Surface Mount SOT-223 (SK)
D A
c
MIN A A1 B 1.50 0.02 0.60 2.90 0.28 6.30 3.30
MILLIMETERS TYP 1.65 0.05 0.70 0.30 6.50 3.50 2.3 BSC 4.6 BSC
MAX 1.80 0.08 0.80 3.15 0.32 6.70 3.70
B1
H
E
B1 c D
K L
E
A1
e e1
e e1 H L K 6.70 0.91 1.50 0
7.00 1.00 1.75 5 3
7.30 1.10 2.00 10
B

3-Pin Surface Mount TO-252 (SJ)
INCHES
E b2 L2
SEATING PLAN
MILLIMETERS MAX 0.094 0.050 0.215 0.023 0.023 0.220 0.265 MIN 2.18 1.02 5.21 0.46 0.46 5.33 6.35 TYP 0.61 2.29 BSC 4.58 BSC 9.40 0.51 0.64 1.52 10.41 1.02 2.03 JULY 2006 MAX 2.39 1.27 5.46 0.58 0.58 5.59 6.73
A A1 c1
MIN A 0.086
TYP 0.024 -
A1 0.040 b -
b2 0.205
D H
c
0.018
c1 0.018 D 0.210
L1 b e1 L
E
e c
0.250
e e1
0.090 BSC 0.180 BSC 0.410 0.040 0.080
H 0.370 L 0.020
L1 0.025 L2 0.060 Copyright (c) 2006 ADDtek Corp. 8
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IMPORTANT NOTICE
ADDtek reserves the right to make changes to its products or to discontinue any integrated circuit product or service without notice, and advises its customers to obtain the latest version of relevant information to verify, before placing orders, that the information being relied on is current. A few applications using integrated circuit products may involve potential risks of death, personal injury, or severe property or environmental damage. ADDtek integrated circuit products are not designed, intended, authorized, or warranted to be suitable for use in life-support applications, devices or systems or other critical applications. Use of ADDtek products in such applications is understood to be fully at the risk of the customer. In order to minimize risks associated with the customer's applications, the customer should provide adequate design and operating safeguards. ADDtek assumes to no liability to customer product design or application support. ADDtek warrants the performance of its products to the specifications applicable at the time of sale.
ADDtek Corp. 9F, No. 20, Sec. 3, Bade Rd., Taipei, Taiwan, 105 TEL: 2-25700299 FAX: 2-25700196
Copyright (c) 2006 ADDtek Corp. 9 DD004_K -JULY 2006

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