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| HSMx-C110/C170/C190/C191/C150 High Performance ChipLED Data Sheet HSMA-C110/C170/C190/C191/C150 HSML-C110/C170/C190/C191/C150 HSMC-C110/C170/C190/C191/C150 HSMZ-C110/C170/C190 Description These chip-type LEDs utilize Aluminum Indium Gallium Phosphide (AlInGaP) material technology. The AlInGaP material has a very high luminous efficiency, capable of producing high light output over a wide range of drive currents. The available colors in this surface mount series are 592 nm Amber, 605 nm Orange, 626 nm Red for AS AlInGaP and 631 nm red for TS AlInGaP. All packages are binned by both color and intensity, except for red color. These ChipLEDs come either in two top emitting packages (HSMx-C170/C190/C191/C150) or in a side emitting package (HSMx-C110). The right angle ChipLEDs are suitable for applications such as LCD backlighting. The top emitting ChipLEDs with wide viewing angle are suitable for light piping and direct backlighting of keypads and panels. In order to facilitate pick and place operation, these ChipLEDs are shipped in tape and reel, with 4000 units per reel for HSMx-C170/C190/C191 and 3000 units per reel for HSMx-C110/C150. These packages are compatible with IR soldering process. Features * High brightness AlInGaP material * Small size * Industry standard footprint * Diffused optics * * * * * Top emitting or right angle emitting Available in 3 colors (red, orange, amber) Compatible with IR soldering Available in 8 mm tape on 7" diameter reel Reel sealed in zip locked moisture barrier bags Applications * LCD backlighting * Push button backlighting * Front panel indicator * Symbol indicator * Microdisplays * Small message panel signage Package Dimensions LED DIE CATHODE LINE LED DIE CATHODE MARK 1.0 (0.039) 1.25 (0.049) 2.6 (0.102 ) 0.62 (0.024) 3.2 (0.126 ) CLEAR EPOXY 2.0 (0.079 ) POLARITY 1.4 (0.055) DIFFUSED EPOXY POLARITY 1.5 (0.059) PC BOARD 0.5 (0.020) 0.3 (0.012) PC BOARD 0.8 (0.031) CATHODE LINE 0.4 0.15 (0.016 0.006) 0.3 (0.012) 0.4 0.15 (0.016 0.006) 1.6 (0.063 ) 3.2 (0.126 ) 0.8 (0.031) CATHODE LINE 1.0 (0.039) SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C110 HSMx-C170 LED DIE CATHODE MARK LED DIE CATHODE MARK 0.8 (0.031) 0.4 (0.016) 0.8 (0.031) 0.4 (0.016) 1.6 (0.063 ) 1.6 (0.063 ) 1.0 (0.039) 0.3 (0.012) DIFFUSED EPOXY PC BOARD CATHODE LINE 0.3 0.15 (0.012 0.006) POLARITY 0.3 (0.012) DIFFUSED EPOXY PC BOARD 0.8 (0.031) 0.3 (0.012) 0.3 0.15 (0.012 0.006) 0.7 (0.028) MIN. CATHODE LINE 0.3 0.15 (0.012 0.006) 1.0 (0.039) POLARITY 0.6 (0.023) 0.3 (0.012) 0.3 0.15 (0.012 0.006) 0.7 (0.028) MIN. SOLDERING TERMINAL SOLDERING TERMINAL HSMx-C190 NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS 0.1 mm ( 0.004 IN.) UNLESS OTHERWISE SPECIFIED. HSMx-C191 2 LED DIE CATHODE MARK Package Dimensions, continued 1.6 (0.063) 0.8 (0.031) 3.2 (0.126 ) DIFFUSED EPOXY 0.6 (0.024) 2.0 (0.079) POLARITY 1.1 (0.043) PC BOARD CATHODE LINE 0.50 0.2 (0.020 0.008) 0.5 (0.020) 0.50 0.2 (0.020 0.008) SOLDERING TERMINAL HSMx-C150 NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS 0.1 mm ( 0.004 IN.) UNLESS OTHERWISE SPECIFIED. Device Selection Guide Footprint (mm)[1,2] 1.6 x 0.8 x 0.8 2.0 x 1.25 x 0.8 3.2 x 1.0 x 1.5 1.6 x 0.8 x 0.6 3.2 x 1.6 x 1.1 AS AlInGaP Amber HSMA-C190 HSMA-C170 HSMA-C110 HSMA-C191 HSMA-C150 AS AlInGaP Orange HSML-C190 HSML-C170 HSML-C110 HSML-C191 HSML-C150 AS AlInGaP Red HSMC-C190 HSMC-C170 HSMC-C110 HSMC-C191 HSMC-C150 TS AlInGaP Red HSMZ-C190 HSMZ-C170 HSMZ-C110 Package Description Untinted, Diffused Untinted, Diffused Untinted, Nondiffused Untinted, Diffused Untinted, Diffused Notes: 1. Dimensions in mm. 2. Tolerance 0.1 mm unless otherwise noted. Absolute Maximum Ratings TA = 25C HSMA-C110/170/190/191/150 HSML-C110/170/190/191/150 HSMC-C110/170/190/191/150 25 60 5 95 -30 to +85 -40 to +85 Parameter DC Forward Current[1,2] Power Dissipation Reverse Voltage (IR = 100 A) LED Junction Temperature Operating Temperature Range Storage Temperature Range Soldering Temperature HSMZ-C110/170/190 25 65 5 95 -30 to +85 -40 to +85 Units mA mW V C C C See reflow soldering profile (Figure 7 & 8) Notes: 1. Derate linearly as shown in Figure 4. 2. Drive currents above 5 mA are recommended for best long term performance. 3 Electrical Characteristics TA = 25C Forward Voltage VF (Volts) @ IF = 20 mA Typ. Max. 1.9 1.9 1.9 2.2 1.9 1.9 1.9 2.2 2.4 2.4 2.4 2.8 2.4 2.4 2.4 2.6 Reverse Breakdown VR (Volts) @ IR = 100 A Min. 5 5 5 5 5 5 5 5 Capacitance C (pF), VF = 0, f = 1 MHz Typ. 45 45 45 35 45 45 45 35 Thermal Resistance RJ-PIN = (C/W) Typ. 600 600 600 600 300 300 300 300 Parameter Number HSMA-C110 HSML-C110 HSMC-C110 HSMZ-C110 HSMA-C170/190/191/150 HSML-C170/190/191/150 HSMC-C170/190/191/150 HSMZ-C170/190 Optical Characteristics TA = 25C Luminous Intensity Iv (mcd) @ 20 mA[1] Min. Typ. 28.5 28.5 28.5 28.5 28.5 28.5 45 45 95 90 95 90 95 90 170 165 Peak Wavelength peak (nm) Typ. 595 595 609 609 637 637 643 643 Color, Dominant Wavelength d[2] (nm) Typ. 592 592 605 605 626 626 631 631 Viewing Angle 2 1/2 Degrees[3] Typ. 130 170 130 170 130 170 130 170 Luminous Efficacy v (lm/w) Typ. 480 480 370 370 155 155 122 122 Part Number HSMA-C110 HSMA-C170/190/191/150 HSML-C110 HSML-C170/190/191/150 HSMC-C110 HSMC-C170/190/191/150 HSMZ-C110 HSMZ-C170/190 Color AS Amber AS Amber AS Orange AS Orange AS Red AS Red TS Red TS Red Notes: 1. The luminous intensity, Iv, is measured at the peak of the spatial radiation pattern which may not be aligned with the mechanical axis of the lamp package. 2. The dominant wavelength, d, is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 3. 1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity. 4 Color Bin Limits[1] Orange Color Bins[1] Dom. Wavelength (nm) Min. Max. 597.0 600.0 600.0 603.0 603.0 606.0 606.0 609.0 609.0 612.0 612.0 615.0 Bin ID A B C D E F Tolerance: 1 nm. Bin ID A B C D E F Tolerance: 1 nm. Amber Color Bins[1] Dom. Wavelength (nm) Min. Max. 582.0 584.5 584.5 587.0 587.0 589.5 589.5 592.0 592.0 594.5 594.5 597.0 Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins. Light Intensity (Iv) Bin Limits[1] Intensity (mcd) Bin ID Min. Max. A 0.11 0.18 B 0.18 0.29 C 0.29 0.45 D 0.45 0.72 E 0.72 1.10 F 1.10 1.80 G 1.80 2.80 H 2.80 4.50 J 4.50 7.20 K 7.20 11.20 L 11.20 18.00 M 18.00 28.50 Tolerance: 15%. Bin ID N P Q R S T U V W X Y Intensity (mcd) Min. Max. 28.50 45.00 45.00 71.50 71.50 112.50 112.50 180.00 180.00 285.00 285.00 450.00 450.00 715.00 715.00 1125.00 1125.00 1800.00 1800.00 2850.00 2850.00 4500.00 Note: 1. Bin categories are established for classification of products. Products may not be available in all categories. Please contact your Avago representative for information on currently available bins. 5 1.0 AS AlInGaP AMBER RELATIVE INTENSITY AS AlInGaP RED AS AlInGaP ORANGE 0.5 TS AlInGaP RED 0 500 550 600 650 700 750 WAVELENGTH - nm Figure 1. Relative intensity vs. wavelength. 100 IF MAX. - MAXIMUM FORWARD CURRENT - mA 1.4 AS AlInGaP 30 25 20 HSMx-C110 15 10 5 0 HSMx-C150/170/ 190/191 IF - FORWARD CURRENT - mA LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 1.2 1.0 0.8 0.6 0.4 0.2 0 0 5 10 15 20 25 30 10 1 TS AlInGaP 0.1 1.5 1.7 1.9 2.1 2.3 2.5 0 20 40 60 80 100 VF - FORWARD VOLTAGE - V IF - FORWARD CURRENT - mA TA - AMBIENT TEMPERATURE - C Figure 2. Forward current vs. forward voltage. Figure 3. Luminous intensity vs. forward current. Figure 4. Maximum forward current vs. ambient temperature. 6 1.00 0.90 RELATIVE INTENSITY - % 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE 1.00 0.90 RELATIVE INTENSITY - % 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 5. Relative intensity vs. angle for HSMx-C110. 1.00 0.90 RELATIVE INTENSITY - % 0.80 0.70 0.60 0.50 0.40 0.30 0.20 0.10 0 -90 -80 -70 -60 -50 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 ANGLE Figure 6. Relative intensity vs. angle for HSMx-C170, C190, C191, and C150. 7 10 - 30 SEC. 255 - 260 C 3 C/SEC. MAX. 6 C/SEC. MAX. 3 C/SEC. MAX. 60 - 120 SEC. 100 SEC. MAX. TEMPERATURE 10 SEC. MAX. TEMPERATURE 217 C 200 C 150 C 230C MAX. 140-160C 4C/SEC. MAX. OVER 2 MIN. TIME 4C/SEC. MAX. -3C/SEC. TIME (Acc. to J-STD-020C) Figure 7. Recommended reflow soldering profile. Figure 8. Recommended Pb-free reflow soldering profile. 5.0 (0.200) 0.9 (0.035) 0.9 (0.035) 1.0 (0.039) 0.2 (0.008) CENTERING BOARD 1.5 (0.059) 2.0 (0.079) 1.5 (0.059) 1.2 (0.047) 1.2 (0.047) 1.2 (0.047) 0.9 (0.035) Figure 9. Recommended soldering pattern for HSMx-C110. Figure 10. Recommended soldering pattern for HSMx-C170. 0.8 (0.031) 1.5 (0.059) 0.8 (0.031) 0.7 (0.028) 0.8 (0.031) 1.5 (0.059) 2.0 (0.079) 1.5 (0.059) Figure 11. Recommended soldering pattern for HSMx-C190 and C191. Figure 12. Recommended soldering pattern for HSMx-C150. Note: All dimensions in millimeters (inches). 8 USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 13. Reeling orientation. O 13.1 0.5 (O 0.516 0.020) 3.0 0.5 (0.118 0.020) 178.40 1.00 (7.024 0.039) 4.0 0.5 (0.157 0.020) 6 PS 5.0 0.5 (0.197 0.020) Figure 14. Reel dimensions. ;; ;; ;; ;; ;; ;; O 20.20 MIN. (O 0.795 MIN.) 8.0 1.0 (0.315 0.039) 10.50 1.0 (0.413 0.039) 59.60 1.00 (2.346 0.039) Note: All dimensions in millimeters (inches). 9 DIM. A (SEE TABLE 1) DIM. B (SEE TABLE 1) 2.00 0.05 (0.079 0.002) HSMx-C110 POSITION IN CARRIER TAPE ;;; ;;;;;; ;;; ;;;;;;;;; 4.00 (0.157) 1.50 (0.059) CATHODE DIM. C (SEE TABLE 1) 1.75 (0.069) 3.50 0.05 (0.138 0.002) 8.00 0.30 (0.315 0.012) 0.20 0.05 (0.008 0.002) DIM. A (SEE TABLE 1) DIM. B (SEE TABLE 1) Figure 15. Tape dimensions. ;;; ;;; ;; 4.00 (0.157) MOUNTED WITH COMPONENTS CARRIER TAPE USER FEED DIRECTION COVER TAPE TABLE 1 DIMENSIONS IN MILLIMETERS (INCHES) PART NUMBER DIM. A DIM. B DIM. C 0.10 ( 0.004) 0.10 ( 0.004) 0.10 ( 0.004) 1.86 (0.073) 1.75 (0.069) 2.30 (0.091) 3.40 (0.134) 3.50 (0.138) 0.89 (0.035) 0.90 (0.035) 1.45 (0.057) 1.70 (0.067) 1.88 (0.074) 0.87 (0.034) 0.90 (0.035) 0.95 (0.037) 1.20 (0.047) 1.27 (0.050) HSMx-C191 SERIES HSMx-C190 SERIES HSMx-C170 SERIES HSMx-C110 SERIES HSMx-C150 SERIES R 1.0 0.05 (0.039 0.002) END START Convective IR Reflow Soldering For more information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Indicator Components. Storage Condition: 5 to 30C @ 60% RH max. Baking is required under the condition: a) Humidity Indicator Card is >10% when read at 23 5C. b) Device exposed to factory conditions <30C/60% RH more than 672 hours. Baking recommended condition: 60 +/- 5C for 20 hours. THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. THERE SHALL BE A MINIMUM OF 160 mm (6.3 INCH) OF EMPTY COMPONENT POCKETS SEALED WITH COVER TAPE. MINIMUM OF 230 mm (9.05 INCH) MAY CONSIST OF CARRIER AND/OR COVER TAPE. Figure 16. Tape leader and trailer dimensions. NOTES: 1. ALL DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE IS 0.1 mm ( 0.004 IN.) UNLESS OTHERWISE SPECIFIED. 10 For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright (c) 2007 Avago Technologies Limited. All rights reserved. Obsoletes 5989-3604EN AV02-0112EN January 25, 2007 |
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