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TL1591 SAMPLE-AND-HOLD CIRCUIT FOR CCD IMAGERS SOCS026B - SEPTEMBER 1989 - REVISED JUNE 1994 * * * * * 15-MHz Sampling Rate 30-ns Acquisition Time Diode-Bridge Switch 25-MHz Bandwidth Low-Voltage Supply P OR PS PACKAGE (TOP VIEW) ANLG VCC ANLG IN ANLG GND ANLG OUT 1 2 3 4 8 7 6 5 DGTL VCC DGTL IN DGTL GND SUB GND description The TL1591 is a monolithic integrated sample-and-hold circuit that uses the BiFET process with Schottky-barrier diodes and is designed for use with CCD area imagers. This device consists of an ultra-fast input-buffer amplifier, a digital-controlled diode-bridge switch, and a high-impedance output buffer amplifier. The electronic switch is controlled by an LS-TTL-compatible logic input. functional block diagram 4 ANLG OUT ANLG IN 2 A1 A2 A3 7 DGTL IN C1 This device contains circuits to protect its inputs and outputs against damage due to high static voltages or electrostatic fields. These circuits have been qualified to protect this device against electrostatic discharges (ESD) of up to 2 kV according to MIL-STD-883C, Method 3015; however, precautions should be taken to avoid application of any voltage higher than maximum-rated voltages to these high-impedance circuits. During storage or handling, the device leads should be shorted together or the device should be placed in conductive foam. In a circuit, unused inputs should always be connected to an appropriate logic voltage level, preferably either VCC or ground. Specific guidelines for handling devices of this type are contained in the publication Guidelines for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices and Assemblies available from Texas Instruments. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 1994, Texas Instruments Incorporated POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 TL1591 SAMPLE-AND-HOLD CIRCUIT FOR CCD IMAGERS SOCS026B - SEPTEMBER 1989 - REVISED JUNE 1994 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V Input voltage range, VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 to VCC Continuous total dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table Operating free-air temperature range, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . - 25C to 80C Storage temperature range, TSTG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . - 55C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. DISSIPATION RATING TABLE PACKAGE P PS TA 25C POWER RATING 1000 mW 725 mW DERATING FACTOR ABOVE TA = 25C 8.0 mW/C 5.8 mW/C TA = 80C POWER RATING 560 mW 406 mW recommended operating conditions MIN Supply voltage, VCC High-level input voltage, VIH Low-level input voltage, VIL Peak-to-peak input voltage, VI(PP) Operating free-air temperature, TA - 25 4.75 2 0.8 0.8 80 NOM 5 MAX 5.5 UNIT V V V V C electrical characteristics over ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER VIK VO(PP) IIH IIL IO ICC ri ro Input clamp voltage Peak-to-peak output voltage High-level input current Low-level input current Output current Supply current Input resistance Output resistance VCC = 5.5 V VCC = 5.5 V, VCC = 5.5 V, VIH = 2.7 V VIL = 0.4 V 1.1 20 - 0.28 0.6 15 10 50 20 - 0.4 TEST CONDITIONS MIN TYP MAX - 1.5 UNIT V V A mA mA mA k operating characteristics PARAMETER Linearity Av Voltage amplification Sample-to-hold offset error Sample-mode offset error Hold-mode feedthrough Hold-mode droop All typical values are at VCC = 5 V, TA = 25C. - 150 MIN TYP 0.7% 0.8 15 - 50 50 - 50 100 MAX 2% 0.9 V/V mV mV dB V/s UNIT 2 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 TL1591 SAMPLE-AND-HOLD CIRCUIT FOR CCD IMAGERS SOCS026B - SEPTEMBER 1989 - REVISED JUNE 1994 dynamic characteristics (see Figure 1) PARAMETER Acquisition time, 0.6 V to 2% Acquisition time, 0.6 V to 1% Hold-mode settling time Sampling-mode bandwidth Sampling rate All typical values are at VCC = 5 V and TA = 25C. MIN TYP 18 31 35 25 15 MAX UNIT ns ns ns MHz MHz PARAMETER MEASUREMENT INFORMATION Sample-to-Hold Transient Sample-and-Hold Output (see Note A) Analog Input Signal Sample Command Sampling Switch Closes Aperture Uncertainty (error band) Hold More Voltage Droop (see Note B) Hold Command Sample Switch Opens Sample-to-Hold Offset Error Aperture Uncertainty Time Sample-Control Pulse Figure 1. Sample-Hold Definitions NOTES: A. Hold-mode settling time is the time from the hold command transistion until the output has settled within a specified error band around the final value. B. Acquisition time is the time required, after the closing of the sampling switch, for the hold capacitor to charge to a full-scale voltage change and then remain within a specified error band around the final value. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 TL1591 SAMPLE-AND-HOLD CIRCUIT FOR CCD IMAGERS SOCS026B - SEPTEMBER 1989 - REVISED JUNE 1994 PARAMETER MEASUREMENT INFORMATION VCC 33 F 1 TL1591 ANLG VCC DGTL VCC 8 33 F Analog Input 50 50 2 ANLG IN DGTL IN 7 50 50 Command Input (sampling pulse) 3 ANLG GND DGTL GND 6 Analog Output 50 975 330 F 4 ANLG OUT SUB GND 5 53 Figure 2. Test Circuit 4 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 TL1591 SAMPLE-AND-HOLD CIRCUIT FOR CCD IMAGERS SOCS026B - SEPTEMBER 1989 - REVISED JUNE 1994 TYPICAL CHARACTERISTICS 5 4 3 Sample/Hold Accuracy - % 2 1 20 0 -1 -2 -3 -4 -5 30 40 50 Command Duration - ns Figure 3. Sample/Hold Accuracy Versus Command Duration POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 5 TL1591 SAMPLE-AND-HOLD CIRCUIT FOR CCD IMAGERS SOCS026B - SEPTEMBER 1989 - REVISED JUNE 1994 MECHANICAL DATA P(R-PDIP-T8) PLASTIC DUAL-IN-LINE PACKAGE 0.400 (10,20) MAX 8 5 0.260 (6,60) 0.240 (6,10) 1 4 0.070 (1,78) MAX 0.020 (0,51) MIN 0.310 (7,87) 0.290 (7,37) 0.200 (5,08) MAX Seating Plane 0.125 (3,18) MIN 0.100 (2,54) TYP 0.021 (0,53) 0.015 (0,38) 0.014 (0,36) 0.008 (0,20) 4040082/A-10/93 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. 0- 15 6 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 TL1591 SAMPLE-AND-HOLD CIRCUIT FOR CCD IMAGERS SOCS026B - SEPTEMBER 1989 - REVISED JUNE 1994 MECHANICAL DATA PS/R-PDSO-G8 6,50 5,90 8 5 PLASTIC SMALL-OUTLINE PACKAGE 8,20 7,40 5,60 5,00 1 4 2,00 MAX Seating Plane 0,10 0,05 MIN 0,40 1,27 0,25 M 0- 10 0,20 0,10 0,95 0,55 4040063/A-10/93 NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion not to exceed 0,15. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 7 IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE ("CRITICAL APPLICATIONS"). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER'S RISK. In order to minimize risks associated with the customer's applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI's publication of information regarding any third party's products or services does not constitute TI's approval, warranty or endorsement thereof. Copyright (c) 1998, Texas Instruments Incorporated |
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