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SN74AUC06 HEX INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS SCES471 - AUGUST 2003 D D D D D D D D Optimized for 1.8-V Operation and Is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation Ioff Supports Partial-Power-Down Mode Operation Sub 1-V Operable Max tpd of 2.2 ns at 1.8-V Low Power Consumption, 10-A Max ICC 8-mA Output Drive at 1.8 V Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II ESD Protection Exceeds JESD 22 - 2000-V Human-Body Model (A114-A) - 200-V Machine Model (A115-A) - 1000-V Charged-Device Model (C101) RGY PACKAGE (TOP VIEW) 1 14 13 6A 12 6Y 11 5A 10 5Y 9 4A 1Y 2A 2Y 3A 3Y 2 3 4 5 6 7 8 description/ordering information This hex inverter buffer/driver is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation. The outputs of the SN74AUC06 are open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. ORDERING INFORMATION TA PACKAGE ORDERABLE PART NUMBER TOP-SIDE MARKING -40C to 85C QFN - RGY Tape and reel SN74AUC06RGYR MS06 Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE (each inverter) INPUT A H L OUTPUT Y L H logic diagram, each buffer/driver (positive logic) A Y Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2003, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 GND 4Y VCC 1A 1 SN74AUC06 HEX INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS SCES471 - AUGUST 2003 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 3.6 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 3.6 V Output voltage range, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 3.6 V Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -50 mA Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -50 mA Continuous output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA Continuous current through VCC or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA Package thermal impedance, JA (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. The package thermal impedance is calculated in accordance with JESD 51-5. recommended operating conditions (see Note 3) MIN VCC VIH Supply voltage High-level input voltage VCC = 0.8 V VCC = 1.1 V to 1.95 V VCC = 2.3 V to 2.7 V VCC = 0.8 V VIL VI VO Low-level input voltage Input voltage Output voltage VCC = 0.8 V VCC = 1.1 V IOL Low-level output current VCC = 1.4 V VCC = 1.65 V VCC = 2.3 V t/v Input transition rise or fall rate VCC = 1.1 V to 1.95 V VCC = 2.3 V to 2.7 V 0 0 0.8 VCC 0.65 x VCC 1.7 0 0.35 x VCC 0.7 3.6 3.6 0.7 3 5 8 9 20 ns/V mA V V V MAX 2.7 UNIT V V TA Operating free-air temperature -40 85 C NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. 2 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SN74AUC06 HEX INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS SCES471 - AUGUST 2003 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER IOL = 100 A IOL = 0.7 mA VOL IOL = 3 mA IOL = 5 mA IOL = 8 mA IOL = 9 mA II Ioff ICC Ci A inputs VI = VCC or GND VI or VO = 2.7 V VI = VCC or GND, VI = VCC or GND IO = 0 TEST CONDITIONS VCC 0.8 V to 2.7 V 0.8 V 1.1 V 1.4 V 1.65 V 2.3 V 0 to 2.7 V 0 0.8 V to 2.7 V 2.5 V 2.5 MIN TYP MAX 0.2 0.25 0.3 0.4 0.45 0.6 5 10 10 A A A pF V UNIT All typical values are at TA = 25C. switching characteristics over recommended operating free-air temperature range, CL = 15 pF (unless otherwise noted) (see Figure 1) PARAMETER tpd FROM (INPUT) A TO (OUTPUT) Y VCC = 0.8 V TYP 4.2 VCC = 1.2 V 0.1 V MIN 0.8 MAX 3.6 VCC = 1.5 V 0.1 V MIN 0.5 MAX 2.6 VCC = 1.8 V 0.15 V MIN 0.5 TYP 1.4 MAX 3.1 VCC = 2.5 V 0.2 V MIN 0.4 MAX 2.2 ns UNIT switching characteristics over recommended operating free-air temperature range, CL = 30 pF (unless otherwise noted) (see Figure 1) PARAMETER tpd FROM (INPUT) A TO (OUTPUT) Y VCC = 1.8 V 0.15 V MIN 0.8 TYP 1.7 MAX 2.8 VCC = 2.5 V 0.2 V MIN 0.8 MAX 1.3 ns UNIT operating characteristics, TA = 25C PARAMETER Cpd Power dissipation capacitance TEST CONDITIONS f = 10 MHz VCC = 0.8 V TYP 2 VCC = 1.2 V TYP 2 VCC = 1.5 V TYP 2 VCC = 1.8 V TYP 3 VCC = 2.5 V TYP 3 UNIT pF POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 SN74AUC06 HEX INVERTER BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS SCES471 - AUGUST 2003 PARAMETER MEASUREMENT INFORMATION (OPEN DRAIN) S1 VLOAD Open GND RL From Output Under Test CL (see Note A) RL TEST tPZL (see Notes E and F) tPLZ (see Notes E and G) tPHZ/tPZH S1 VLOAD VLOAD VLOAD LOAD CIRCUIT INPUT VCC 0.8 V 1.2 V 0.1 V 1.5 V 0.1 V 1.8 V 0.15 V 2.5 V 0.2 V 1.8 V 0.15 V 2.5 V 0.2 V VI VCC VCC VCC VCC VCC VCC VCC tr/tf 2 ns 2 ns 2 ns 2 ns 2 ns 2 ns 2 ns VM VCC/2 VCC/2 VCC/2 VCC/2 VCC/2 VCC/2 VCC/2 VLOAD 2 x VCC 2 x VCC 2 x VCC 2 x VCC 2 x VCC 2 x VCC 2 x VCC CL 15 pF 15 pF 15 pF 15 pF 15 pF 30 pF 30 pF RL 2 k 2 k 2 k 2 k 2 k 1 k 500 V 0.1 V 0.1 V 0.1 V 0.15 V 0.15 V 0.15 V 0.15 V VI Input tPLH Output tPHL VM VM VM VM 0V tPHL VOH VM VOL tPLH VOH Output VM VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS Output Control tPZL Output Waveform 1 S1 at VLOAD (see Note B) tPZH Output Waveform 2 S1 at VLOAD (see Note B) VI VM VM 0V tPLZ VLOAD/2 VM VOL + V tPHZ VM VLOAD/2 VLOAD/2 - V 0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING VOL NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 . D. The outputs are measured one at a time with one transition per measurement. E. Since this device has open-drain outputs, tPLZ and tPZL are the same as tpd. F. tPZL is measured at VM. G. tPLZ is measured at VOL + V. H. All parameters and waveforms are not applicable to all devices. Figure 1. Load Circuit and Voltage Waveforms 4 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 30-Mar-2005 PACKAGING INFORMATION Orderable Device SN74AUC06RGYR (1) Status (1) ACTIVE Package Type QFN Package Drawing RGY Pins Package Eco Plan (2) Qty 14 1000 Green (RoHS & no Sb/Br) Lead/Ball Finish CU NIPDAU MSL Peak Temp (3) Level-2-260C-1YEAR The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. 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