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UCC39161 LOW CURRENT HOT SWAP POWER MANAGER
SLUS410C -- NOVEMBER 1999 -- REVISED FEBRUARY 2000
D D D D D D D D
Integrated Circuit Breaker Function Integrated 0.2-W Power FET 1mA ICC When Disabled Programmable On Time Accurate 0.8-A (MAX) Current Fixed 3% Duty Cycle Unidirectional Switch Thermal Shutdown
SOIC 8-PIN DP PACKAGE (TOP VIEW)
description
The UCC39161 low-current hot-swap power manager provides complete power management, hot-swap capability, and circuit-breaker functions with minimal external components. For most applications, the only external component required to operate the device, other then supply bypassing, is a timing capacitor that sets the fault time. The maximum current level is internally programmed for 0.8 A. While the output current is below 0.8 A, the internal power MOSFET is switched on at a nominal 220 mW. When the output current exceeds 0.8 A, the MOSFET transitions from a switch to a constant current source and the fault timer starts charging CT. Once the fault time is reached, the current shuts off for a time, which equates to a 3% duty cycle. The UCC39161 also provides unidirectional current flow, emulating a diode in series with the power MOSFET. The UCC39161 can be put into sleep mode by grounding the SHTDWN pin. In sleep mode, the UCC39161 draws under 5 mA of supply current. Other features include thermal shutdown and a low thermal-resistance small-outline power package.
block diagram
VIN 4V to 6V
VIN
1
REVERSE VOLTAGE COMPARATOR CHARGE PUMP
30mV
- +
OUTPUT
MAXIMUM CURRENT LEVEL 0.8A
CURRENT SENSE
+ -
H=OPEN LINEAR CURRENT AMPLIFIER
+
POWER FET OUTPUT 8 LOAD CLOAD
CIN
+ -
OVER CURRENT COMPARATOR
ON TIME CONTROL 3% DUTY CYCLE THERMAL SHUTDOWN INTERNAL BIAS 4 + - 5 SHTDWN
1.5V
4 HEATSINK PINS GND GND GND GND 2 3 6 7 CT
CT
UDG-99168
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Copyright a 2000, Texas Instruments Incorporated
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UCC39161 LOW CURRENT HOT SWAP POWER MANAGER
SLUS410C -- NOVEMBER 1999 -- REVISED FEBRUARY 2000
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
Input voltage (VIN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 V Output current, dc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Self Limiting Output current, pulse (less than 100 ns) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 A Storage temperature, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . --65C to 150C -55C to 150C Junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Lead temperature (soldering, 10 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Currents are positive into, negative out of the specified terminal. Consult Packaging Section of Databook for thermal limitations and considerations of packages.
electrical characteristics at TJ = 0C to 70C, VIN = 5 V, SHTDWN = 2.4 V, TA = TJ (unless otherwise noted) (see Note 1)
PARAMETER Supply Current Section ICC supply current ICC supply current (sleep mode) Output Section Voltage drop Max current Reverse leakage Soft start time Short circuit response Fault Section CT charge current CT discharge current Output duty cycle CT charge threshold CT discharge threshold Thermal shutdown Thermal hysteresis Shutdown Section Shutdown threshold Shutdown hysteresis Shutdown bias current NOTE: All voltages are with respect to ground. SHTDWN = 1.0 V 1.5 150 100 3.0 300 500 V mV nA VCT = 1.0 V VCT = 1.0 V VO = 0 V --45 0.90 2.00 0.4 1.2 --36.0 1.0 3.00 0.5 1.4 170 10 --27 1.50 6.00 0.6 1.8 mA mA % V V C C VIN = 4.5 V, VIN = 0 V, Initial Startup VOUT = 5 V VOUT = 5 V IOUT = 0.5 A --1.0 0.10 --0.8 6 0.50 50 100 0.16 --0.6 20 9 V A mA mA ms ns SHTDWN = 0.2 V 1.00 0.50 2.00 5 mA mA TEST CONDITIONS MIN TYP MAX UNITS
2
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UCC39161 LOW CURRENT HOT SWAP POWER MANAGER
SLUS410C -- NOVEMBER 1999 -- REVISED FEBRUARY 2000
pin description
CT: A capacitor is applied between this pin and ground to set the maximum fault time. The maximum fault time must be more than the time to charge external capacitance. The maximum fault time is defined as: T FAULT = 28 x 10 3 x CT
Once the fault time is reached the output will shutdown for a time given by: T SD = 1 x 10 6 x CT
this results in a 3% duty cycle. SHTDWN: The IC enters a low-power sleep mode when this pin is low and exits the sleep mode when this pin is high. VIN: Input voltage to the circuit breaker, ranging from 4 V to 6 V. VOUT: Output voltage of the circuit breaker. When switched, the output voltage is approximately: V OUT = VIN - 220 m x I OUT
TERMPOWER BUS CLOAD CT GND 3 GND 6 GND 7 4 CT
VIN
1
VIN
UCC39161
OUTPUT
8
5 D1 CIN
SHTDWN GND 2
UDG-99167
Figure 1. Typical Application
APPLICATION INFORMATION
protecting the ucc39161 from voltage transients The parasitic inductance associated with the power distribution can cause a voltage spike at VIN if the load current is suddenly interrupted by the UCC39161. It is important to limit the peak of this spike to less than 6 V to prevent damage to the UCC39161. This voltage spike can be minimized by:
D Reducing the power distribution inductance (e.g., twist the positive (+) and negative (--) leads of the power
supply feeding VIN, locate the power supply close to the UCC39161 or use a PCB ground plane).
D Decoupling VIN with a capacitor, CIN (refer to Figure 1), located close to the VIN pin. This capacitor is
typically less than 1 mF to limit the inrush current. pin.
D Clamping the voltage at VIN below 6 V with a zener diode, D1 (refer to Figure 1), located close to the VIN
POST OFFICE BOX 655303
* DALLAS, TEXAS 75265
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UCC39161 LOW CURRENT HOT SWAP POWER MANAGER
SLUS410C -- NOVEMBER 1999 -- REVISED FEBRUARY 2000
APPLICATION INFORMATION safety recommendations
Although the UCC39161 is designed to provide system protection for all fault conditions, all integrated circuits can ultimately fail short. For this reason, if the UCC39161 is intended for use in safety critical applications where ULa or some other safety rating is required, a redundant safety device such as a fuse should be placed in series with the device. The UCC39161 prevents the fuse from blowing virtually all fault conditions, increasing system reliability and reducing maintainence cost, in addition to providing the hot-swap benefits of the device.
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IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI's standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. Customers are responsible for their applications using TI components. In order to minimize risks associated with the customer's applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI's publication of information regarding any third party's products or services does not constitute TI's approval, warranty or endorsement thereof.
Copyright (c) 2000, Texas Instruments Incorporated

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