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ZEVIO TM
Application Processor Architecture
OVERVIEW
The ZEVIOTM application processor architecture enables fast time-to-market for a wide variety of lower-cost, low-power consumer electronics products. The architecture enables system designers to cost-effectively design System-on-Chips (SoC) and provides an alternative to standard products that are available on the market. The ZEVIO architecture simplifies custom design and allows system designers to move from specification to prototypes in as little as six months. When combined with the LSI Logic 3D graphics and sound processors, the ZEVIO architecture can bring new dimensions to products such as GPS navigation systems, electronic toys and edutainment applications, personal media players, and handheld products.
ZEVIO BENEFITS
Specification to prototype in as little as six months Low-power design ideal for portable applications Cost effectively design SoC products Lowers the barrier-to-entry of 3D technology in consumer electronics
FEATURES
Multi-core architecture Integrates essential IPs for consumer SoCs Seamless connection of the LSI Logic CoreWare library and user logic Advanced power management and precise clock control for each individual module Programmable reference board enables pre-silicon validation and software development
FLEXIBLE ARCHITECTURE
ZEVIO is a multi-core architecture that allows seamless connection of IP cores, using the LSI CoreWare library or customer IP, to develop a complex SoC. It breaks away from the traditional CPU-centric architecture and enables other cores, such as media processors, to be the primary processing units. With a menu of preverified IP cores-from ARM and ZSP DSP to video codecs and 3D graphics and Figure 1. Example of an electronic toy 2D/3D sound processors-the ZEVIO SoC based on the ZEVIO architecture architecture enables fast and reliable customization of products. Because the ZEVIO architecture alleviates steps in a complex system design, customers can concentrate on the design and implementation of their differentiating product features.
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3D GRAPHICS PROCESSOR
Highly autonomous 3D graphics processor integrating geometry and rendering engines 3D graphics performance of 1.5M polygons/sec at 75MHz Cost-effective implementation in 200k gates Low power consumption of 0.25mW/MHz in 0.13m technology
Inside the ZEVIO architecture are peripherals, including four 16-bit timers, a 32-channel interrupt controller, an 8-channel DMA controller, a watch dog timer and a real-time clock which runs off a separate power supply. The memory controller supports a cost-effective 16bit-wide SDRAM interface by running at twice the frequency of the system bus. The advanced power management unit (PMU) precisely controls the clock and minimizes logic toggling to reduce average power consumption
3D SOUND PROCESSOR
ARBITER AHB Masters AHB2AHB BRIDGE INTC MEMORY CTRL CONFIG RTC / PMU WDT REMAP AHB2APB BRIDGE Multi-layer AHB
Figure 2. ZEVIO Application Processor Architecture Block Diagram
GPIO UART I2C TIMER APB Slaves APB
3D sound processor with 64 configurable voices Advanced 3D voices utilizing cross-talk cancellation, low-pass filter and 3D positioning using HRTF coefficients Drivers and converters for standard MIDI format playback Cost-effective implementation in 80k gates Low power consumption of 0.05mW/MHz in 0.13m technology
Memories AHB Slaves
ZEVIOTM Application Processor Architecture
of the entire system. The PMU can control on chip power islands to reduce leakage for power-sensitive applications.
PROGRAMMABLE REFERENCE BOARD
The ZEVIO programmable reference board enables system designers to evaluate the SoC in a cycle-accurate environment as the chip is being developed, allowing enhanced validation and early software development. The software can then be ready for immediate bring up on the SoC, significantly reducing product time-to-market.
64 voices. The sound processor is designed to operate at 24 MHz, and its output is 44.1 KHz 16-bit PCM samples. Drivers and converters for standard MIDI format playback are provided with sound font optimization capabilities. Despite its rich feature set, the sound processor is implemented in only 80k gates reducing power consumption in 0.13m process technology to 0.05mW/MHz.
SYSTEM AND SOFTWARE PARTNERS
Industry leaders in consumer 3D graphics, embedded systems and software technologies have chosen to work with LSI to support the ZEVIO architecture. Mobile entertainment hardware and software design experts from KOTO Co., Ltd. collaborated on the creation of the 3D graphics and sound processors with a focus on low cost, low power, and ease of programmability. To streamline product and application software development, LSI has engaged with strategic partners ACCESS CO., Ltd., and HI CORPORATION to contribute 3D graphics and embedded system expertise. ACCESS' flagship NetFrontTM web browser for portable devices and its MoreTM real-time operating system and HI's MascotCapsule 3D graphics API ensure fast time-to-market for products built on the ZEVIO architecture. For more information about LSI ZEVIO application processor architecture partners please visit their respective websites: KOTO Co., LTD. ACCESS CO., LTD. HI CORPORATION http://www.koto.co.jp http://www.access.co.jp/english/ http://www.hicorp.co.jp
3D GRAPHICS PROCESSOR
The 3D graphics processor is designed to achieve optimal cost performance and reduce overall software development time by including the features most requested by software developers. Careful trade-offs have been made to achieve the best, cost performance and lowest power that can be accepted by both developers and the cost-sensitive consumer market. The graphics processor only requires 200k gates including both the geometry and rendering engines and boasts a peak performance of 1.5M polygons per second when running at 75MHz. The power consumption in 0.13m process technology is only 0.25mW/MHz. Some of the key features supported by the geometry engine include near clipping, back-face culling and specular lighting. The rendering engine features include depth buffering, fog generation, bilinear interpolation and perspective correct textures.
3D SOUND PROCESSOR
The 2D/3D sound processor also aims to efficiently meet the sound synthesizing requirements for consumer products. It supports up to 48 2D voices and 16 3D voices for a total of
For more information and sales office locations, please visit the LSI Logic web sites at:
www.lsilogic.com
Technical Support Tel: 800 633 4545 LSI Logic Corporation North American Headquarters Milpitas, CA Tel: 866 574 5741 (within U.S) 408 954 3108 (outside U.S.) LSI Logic Europe Ltd. European Headquarters United Kingdom Tel: 44 1344 413200 LSI Logic KK Headquarters Tokyo, Japan Tel: 81 3 5463 7165
LSI Logic, LSI Logic logo design, CoreWare, and ZEVIO are trademarks or registered trademarks of LSI Logic Corporation. ACCESS, NetFront and More (Micro More) are trademarks or registered trademarks of ACCESS CO., LTD. in Japan and other countries. All other brand and product names may be trademarks of their respective companies.
http://lsilogic.com/contacts
LSI Logic Corporation reserves the right to make changes to any products and services herein at any time without notice. LSI Logic does not assume any responsibility or liability arising out of the application or use of any product or service described herein, except as expressly agreed to in writing by LSI Logic; nor does the purchase, lease, or use of a product or service from LSI Logic convey a license under any patent rights, copyrights, trademark rights, or any other of the intellectual property rights of LSI Logic or of third parties. Copyright (c)2005 by LSI Logic Corporation. All rights reserved. Order No. 10023 12/05/JG

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