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| MICROCIRCUIT DATA SHEET MNLM2941-X REV 1A1 LOW DROPOUT ADJUSTABLE REGULATOR General Description The LM2941 positive voltage regulator features the ability to source 1A of output current with a typical dropout voltage of 0.5V and a maximum of 1V over the entire temperature range. Furthermore, a quiescent current reduction circuit has been included which reduces the ground pin current when the differential between the input voltage and the output voltage exceeds approximately 3V. The quiescent current with 1A of output current and an input-output differential of 5V is therefore only 30mA. Higher quiescent currents only exist when the regulator is in the dropout mode (Vin - Vout < 3V). Designed also for vehicular applications, the LM2941 and all regulated circuitry are protected from reverse battery installations or two-battery jumps. During line transients, such as load dump when the input voltage can momentarily exceed the specified maximum operating voltage, the regulator will automatically shut down to protect both the internal circuits and the load. Familiar regulator features such as short circuit and thermal overload protection are also provided. Original Creation Date: 03/21/97 Last Update Date: 02/11/99 Last Major Revision Date: 03/21/97 Industry Part Number LM2941 NS Part Numbers LM2941J/883 LM2941K/883 LM2941WG/883 Prime Die LM2941 Controlling Document SEE FEATURES SECTION Processing MIL-STD-883, Method 5004 Subgrp Description 1 2 3 4 5 6 7 8A 8B 9 10 11 Static tests at Static tests at Static tests at Dynamic tests at Dynamic tests at Dynamic tests at Functional tests at Functional tests at Functional tests at Switching tests at Switching tests at Switching tests at Temp ( oC) +25 +125 -55 +25 +125 -55 +25 +125 -55 +25 +125 -55 Quality Conformance Inspection MIL-STD-883, Method 5005 1 MNLM2941-X REV 1A1 MICROCIRCUIT DATA SHEET Features Output voltage adjustable from 5V to 20V Dropout voltage typically 0.5V @ Io = 1A Output current in excess of 1A Trimmed reference voltage Reverse battery protection Internal short circuit current limit Mirror image insertion protection TTL, CMOS compatible ON/OFF switch CONTROLLING DOCUMENT LM2941J/883 5962-9166701QEA LM2941K/883 5962-9166701QXA LM2941WG/883 5962-9166701QYA 2 MNLM2941-X REV 1A1 MICROCIRCUIT DATA SHEET (Absolute Maximum Ratings) (Note 1) Input Voltage (Survival Voltage < 100mS) 60V Internal Power Dissipation (Note 2, 3) Internally Limited Maximum Junction Temperature 150 C Storage Temperature Range -65 C < TA < +150 C Lead Temperature (Soldering, 10 seconds) Thermal Resistance ThetaJA T03 Pkg (Still Air) T03 Pkg (500LF/Min Air Flow) CERDIP (Still Air) CERDIP (500LF/Min Air Flow) CERAMIC SOIC (Still Air) CERAMIC SOIC (500LF/Min Air Flow) ThetaJC (Note 3) T03 Pkg CERDIP (Note 3 applicable to this Pkg only) CERAMIC SOIC Package Weight (Typcial) T03 CERDIP CERAMIC SOIC ESD Susceptibility (Note 4) 300 C 40 TBD 73 37 122 77 C/W C/W C/W C/W C/W 5 C/W 3 C/W 5 C/W TBD 1970mg 360mg 500V Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. The maximum power dissipation must be derated at elevated temperatures and is dictated by Tjmax (maximum junction temperature), ThetaJA (package junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any temperature is Pdmax = (Tjmax - TA)/ThetaJA or the number given in the Absolute Maximum Ratings, whichever is lower. The package material for these devices allows much improved heat transfer over our standard ceramic packages. In order to take full advantage of this improved heat transfer, heat sinking must be provided between the package base (directly beneath the die), and either metal traces on, or thermal vias through, the printed circuit board. Without this additional heat sinking, device power dissipation must be calculated using junction-to-ambient, rather than junction-to-case, thermal resistance. It must not be assumed that the device leads will provide substantial heat transfer out of the package, since the thermal resistance of the leadframe material is very poor, relative to the material of the package base. The stated junction-to-case thermal resistance is for the package material only, and does not account for the additional thermal resistance between the package base and the printed circuit board. The user must determine the value of the additional thermal resistance and must combine this with the stated value for the package, to calculate the total allowed power dissipation for the device. Human body model, 100pF discharged through 1.5K Ohms. Note 2: Note 3: Note 4: 3 MNLM2941-X REV 1A1 MICROCIRCUIT DATA SHEET Recommended Operating Conditions (Note 1) Input Voltage 26V Operating Temperature Range -55 C < TA < +125 C Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. 4 MNLM2941-X REV 1A1 MICROCIRCUIT DATA SHEET Electrical Characteristics DC PARAMETERS: (The following conditions apply to all the following parameters, unless otherwise specified.) DC: 5V < Vo < = 20V, Vin = Vo +5V, Cout = 22uF SYMBOL Vref PARAMETER Reference Voltage 5mA < Io < 1A 5mA < Io < 1A Vrline Vrload Iq Line Regulation Load Regulation Quiescent Current Vo + 2V < Vin < 26V, Io = 5mA 50mA < Io < 1A Vo + 2V < Vin < 26V, Io = 5mA Vo + 2V < Vin < 26V, Io = 5mA Vin = Vo + 5V, Io = 1A 3 3 CONDITIONS NOTES PINNAME MIN 1.237 1.211 MAX 1.313 1.339 10 10 15 20 45 60 Vdo Dropout Voltage Io = 1A 0.8 1.00 Io = 100mA Isc Short Circuit Current Maximum Operational Input Voltage Reverse Polarity DC Input Voltage V(TO) V(TO) ON/OFF Threshold Voltage ON ON/OFF Threshold Voltage OFF ON/OFF Threshold Current Ro = 100 Ohms, Vo > -0.6V Io < 1A Io < 1A V ON/OFF = 2.0V, Io < 1A V ON/OFF = 2.0V, Io < 1A Vin max = 26V 1.6 1.3 2 200 3.3 3.5 26 UNIT V V SUBGROUPS 1 2, 3 mV/V 1, 2, 3 mV/V 1, 2, 3 mA mA mA mA V V mV A A Vdc 1 2, 3 1 2, 3 1 2, 3 1, 2, 3 1 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 1, 2, 3 1 2, 3 1 1 1 -15 0.8 2.00 100 300 V V V uA uA 5 MNLM2941-X REV 1A1 MICROCIRCUIT DATA SHEET Electrical Characteristics AC PARAMETERS: (The following conditions apply to all the following parameters, unless otherwise specified.) AC: 5V < Vo < = 20V, Vin = Vo +5V, Cout = 22uF SYMBOL PARAMETER Maximum Line Transient Reverse Polarity Transient Input Voltage RR Ripple Rejection CONDITIONS Vo max 1V above nominal Vo, Ro = 100 Ohms, T < 100mS T < 100mS, Ro = 100 Ohms NOTES PINNAME MIN 60 -50 MAX UNIT V V SUBGROUPS 4, 5, 6 4, 5, 6 4 5, 6 fo = 1KHz, 1 Vrms, IL = 100mA 4 4 0.02 0.04 %/V %/V Note Note Note Note 1: 2: 3: 4: Functional test go no go only. Condition for Vin. Limit = mV per Volt of Vout. %/V = % of Vin per Volt of Vout. 6 MNLM2941-X REV 1A1 MICROCIRCUIT DATA SHEET Graphics and Diagrams GRAPHICS# 06152HRA1 06333HRA2 06352HRA1 J16ARL KA04BRB P000158A P000235A P000378A WG16ARC DESCRIPTION METAL CAN (K), TO-3, 4LD (B/I CKT) CERDIP (J), 16 LEAD (B/I CKT) CERPACK (W), 16 LEAD (B/I CKT) CERDIP (J), 16 LEAD (P/P DWG) METAL CAN (KA), TO-3, 4 LEAD, LOW PROFILE(P/P DWG) CERDIP (J), 16 LEAD (PINOUT) METAL CAN (K), TO-3, 4 LEAD (PINOUT) CERAMIC SOIC, 16 LEAD (PINOUT) CERAMIC SOIC (WG), 16 LEAD (P/P DWG) See attached graphics following this page. 7 N N NC NC OUTPUT ADJ GND NC NC NC 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 VIN NC N/C N/C GND GND NC ON/OFF LM2941WG 16 - LEAD CERAMIC SOIC CONNECTION DIAGRAM TOP VIEW P000378A N MIL/AEROSPACE OPERATIONS 2900 SEMICONDUCTOR DRIVE SANTA CLARA, CA 95050 MNLM2941-X REV 1A1 MICROCIRCUIT DATA SHEET Revision History Rev 0A0 ECN # Rel Date Originator Barbara Lopez Changes Initial Release of: MNLM2941-X Rev. 0A0. Added note for power dissipation and reference to thermal resistance for Aluminum Nitride package. Update MDS: MNLM2941-X, Rev. 0A0 to MNLM2941-X, Rev. 1A1. M0001075 02/11/99 1A1 M0003224 02/11/99 Rose Malone 8 |
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