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19-2038; Rev 0; 5/01
KIT ATION EVALU ILABLE AVA
Miniature Chip-Scale GSM900/DCS1800/PCS1900 Power Amplifier
General Description Features
o Miniature Chip-Scale Package (UCSP): 2.5mm 3.0mm o +34.5dBm Output Power (VCC +3.2V) o Low Voltage Operation--Down to 2.5V o Low-Cost Solution
MAX2216
The MAX2216 is a miniature chip-scale, low-voltage power amplifier for GSM/DCS/PCS. This dual power amplifier is packaged in a tiny UCSPTM to minimize implementation size and solution cost. Output power is +34.5dBm (VCC +3.2V) in the GSM band and +32dBm in the DCS or PCS band. The power amplifier is functional at supply voltages as low as 2.5V, at a reduced output power level. Frequency of operation is from 880MHz to 915MHz for the low band, 1710MHz to 1785MHz for the high band tuned for DCS applications, and 1850MHz to 1910MHz for the high band tuned for PCS applications. Peak efficiency is 50% in the GSM band. An analog power-control input permits more than 40dB power-control range for each band. The device operates from three NiCd/NiMH cells or a single Li+ cell, allowing single-supply operation from +2.5V to +5.5V.
Ordering Information
PART MAX2216EBV TEMP. RANGE -40C to +85C PIN-PACKAGE 30 5 x 6 UCSP
Applications
Dual-Mode GSM/DCS Handsets Dual-Mode GSM/PCS Handsets PCS Handsets Dual-Mode AMPS/PCS Handsets
Typical Operating Circuit
VCC
GSM RF INPUT
Z0 = 50 GSM RF INPUT GAIN CTRL BIAS GAIN CTRL MAX2216 VCC
GSM GAIN CONTROL DCS/PCS GAIN CONTROL
DCS/PCS RF INPUT
Z0 = 50
DCS/PCS RF INPUT
VCC
UCSP is a trademark of Maxim Integrated Products, Inc. ________________________________________________________________ Maxim Integrated Products 1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim's website at www.maxim-ic.com.
Miniature Chip-Scale GSM900/DCS1800/PCS1900 Power Amplifier MAX2216
ABSOLUTE MAXIMUM RATINGS
VCC, GSMOUT, DCSOUT to GND.........................-0.3V to +6.0V GC to GND .................................................-0.3V to (VCC + 0.3V) GSMIN, DCSIN Input Power .............................................14dBm GSMOUT, DCSOUT Maximum VSWR Tolerance..................10:1 Continuous Power Dissipation 30-bump 5 x 6 UCSP (derate 45mW/C above +70C) ...3.6W JA ....................................................................................22C/W Operating Temperature Range ...........................-40C to +85C Junction Temperature ......................................................+150C Storage Temperature Range .............................-65C to +150C Bump Temperature (soldering) Infrared (15s) ...............................................................+220C Vapor Phase (60s) .......................................................+215C
This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile it can be exposed to during board level solder attach and rework. This limit permits only the use of solder profiles recommended in the industry standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IT/VPR and convection reflow. Preheating is required. Hand or wave soldering is not allowed. See application note "Wafer-Level Chip-Scale Package" on Maxim's website for more information. Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
(VCC = +2.5V to +5.5V, RF inputs and outputs terminated in 50, no RF signal applied. Typical values are at VCC = +3.2V, TA = +25C, unless otherwise noted.) (Note 1)
PARAMETER Supply Voltage Range Shutdown Supply Current SYMBOL VCC ICC Full shutdown mode, VGSMGC < 0.4V, VDCSGC < 0.4V TA = +25C TA = -40C to +85C CONDITIONS MIN 2.5 TYP MAX 5.5 5 A 50 5 10 mA A UNITS V
GC Input Current
IGC
VGSMGC = +2.4V, VDCSGC = +2.4V VGSMGC < 0.4V, VDCSGC < 0.4V
2
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Miniature Chip-Scale GSM900/DCS1800/PCS1900 Power Amplifier
AC ELECTRICAL CHARACTERISTICS (GSM900 Operation)
(MAX2216 EV Kit, VCC = +3.2V, +4dBm < PIN < +12dBm, fIN = 900MHz, 1:8 duty cycle (TON = 577s), 50 system. Typical values are at PIN = +8dBm, TA = +25C.) (Note 2)
PARAMETER Frequency Range SYMBOL fIN (Note 3) VCC = +3.2V VGSMGC = 2.4V Output Power POUT VGSMGC = 0.4V Maximum POUT Efficiency Maximum Gain Control Slope Maximum Operating Duty Cycle Maximum Operating VCC Under Load Mismatch POUT = 34.5dBm POUT = 20dBm POUT > -10dBm (Note 4) TA = +85C (Note 4) TA = +65C (Note 4) Noise in 100kHz BW, +2.5V < VCC < +5.5V, 0V < VGSMGC < 2.4V Duty cycle = 12.5% Duty cycle = 25% Duty cycle = 12.5% Duty cycle = 25% 925MHz to 935MHz band 935MHz to 960MHz band 2nd harmonic; some harmonic attenuation achieved from EV kit matching circuit; this is included in this specification. 2nd harmonic falling in DCS output 3rd harmonic Input VSWR Maximum Nonharmonic Spurious Output Due to Load Mismatch Power Rise/Fall-Time VSWR POUT > +20dBm -10dBm < POUT < +20dBm +2.5V < VCC < 5.5V, +0.4V < VGSMGC < +2.4V (Note 5) VGSMGC stepped from 0 to +2.4V (Note 6) 3.2:1 5.1:1 -36 1 dBm s -84.5 25 5.5 3.2 5.5 4.2 -78 dBm V 50 VCC = +2.7V, TA = -40C to +85C VCC = +2.5V +2.5V < VCC < +5.5V, TA = -40C to +85C 50 48 9 325 dB/V % % CONDITIONS MIN 880 34.5 31.8 31.9 35.2 33.7 32.6 -23 dBm TYP MAX 915 UNITS MHz
MAX2216
Noise Power
-6.6 dBm -10 -18
Harmonic Levels
-10dBm < POUT < +35dBm
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Miniature Chip-Scale GSM900/DCS1800/PCS1900 Power Amplifier MAX2216
AC ELECTRICAL CHARACTERISTICS (DCS1800 Operation)
(MAX2216 EV Kit, VCC = +3.2V, +6dBm < PIN < +12dBm, fIN = 1750MHz, 1:8 duty cycle (TON = 577s), 50 system. Typical values are at PIN = +8dBm, TA = +25C.) (Note 2)
PARAMETER Frequency Range SYMBOL fIN (Note 3) VCC = +3.2V VDCSGC = 2.4V Output Power POUT VDCSGC = 0.4V VCC = +2.7V, TA = -40C to +85C VCC = +2.5V +2.5V < VCC < +5.5V, TA = -40C to +85C 41 38 12 315 25 Duty cycle = 12.5% Duty cycle = 25% 5.5 4.8 -74 -8 -15 3.1:1 10.8:1 -36 1 dBm s dBm 50 dB/V % V % CONDITIONS MIN 1710 32 29.5 29.5 33.2 31.6 30.8 -30 dBm TYP MAX 1785 UNITS MHz
Maximum POUT, VGCDCS = 2.1V Efficiency Maximum Gain Control Slope Maximum Operating Duty Cycle Maximum Operating VCC Under Load Mismatch Noise Power POUT = 32dBm POUT = 22dBm POUT > -10dBm (Note 4) TA = +85C (Note 4)
Noise in 100kHz BW, +2.5V < VCC < +5.5V, 0 < VDCSGC < 2.4V, noise in 1805MHz to 1880MHz band -10dBm < POUT < +32.5dBm VSWR POUT > +20dBm -10dBm < POUT < +20dBm +2.5V < VCC < 5.5V, +0.4V < VDCSGC < +2.4V (Note 5) VDCSGC stepped from 0 to +2.4V (Note 6) 2nd harmonic 3rd harmonic
Harmonic Levels Input VSWR Maximum Nonharmonic Spurious Output Due to Load Mismatch Power Rise/Fall-Time
dBm
Contact Factory for PCS1900 AC Electrical Characteristics. Note 1: Parameters are 100% production tested at TA = +25C and guaranteed over temperature by design and characterization. Note 2: Parameters guaranteed by design and characterization. Note 3: Output power, harmonic levels, and maximum nonharmonic spurious outputs due to load mismatch specifications are met over this frequency range. Note 4: Maximum duty cycle is determined by maximum die temperature (150C) with JA = 22C/W, load VSWR = 8:1, GSMGC adjusted for POUT = 34.5dBm; DCSGC adjusted for POUT = 32dBm; POUT measured using directional coupler. Note 5: GSMGC adjusted for POUT = 34.5dBm; DCSGC adjusted for POUT = 32dBm; POUT measured using directional coupler. Note 6: For shutdown, time is for POUT to fall below -20dBm.
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Miniature Chip-Scale GSM900/DCS1800/PCS1900 Power Amplifier
Typical Operating Characteristics
(MAX2216 EV Kit, 50 system, VCC = +3.2V; GSM measurements: fGSMIN = 900MHz, VGSMGC = 2.4V, VDCSGC = 0; DCS measurements: fDCSIN = 1750MHz, VGSMGC = 0, VDCSGC = 2.4V; CW input of +8dBm, 1:8 duty cycle (TON = 577s) TA = +25C,unless otherwise noted.)
MAXIMUM OUTPUT POWER vs. FREQUENCY GSM BAND
MAX2216 toc01
MAX2216
MAXIMUM OUTPUT POWER vs. FREQUENCY GSM BAND
MAX2216 toc02
MAXIMUM OUTPUT POWER vs. FREQUENCY DCS BAND
VCC = +3.2V MAXIMUM OUTPUT POWER (dBm) 32 VCC = +3.0V
MAX2216 toc03
36 MAXIMUM OUPUT POWER (dBm)
VGSMDC = +2.4V VCC = +3.2V VCC = +3.0V
36.0 MAXIMUM OUTPUT POWER (dBm)
VCC = +3.2V VGSMGC = -2.4V TA = -40C TA = +25C
33
35
35.5
34 VCC = +2.7V 33 VCC = +2.5V
35.0
TA = +85C
31
VCC = +2.7V
34.5
30
VCC = +2.5V
VGSMGC = +2.4V 32 875 885 895 905 915 925 FREQUENCY (MHz) 34.0 875 885 895 905 915 925 FREQUENCY (MHz) 29 1700 1720 1740 1760 1780 1800 FREQUENCY (MHz)
MAXIMUM OUTPUT POWER vs. FREQUENCY DCS BAND
MAX2216 toc04
OUTPUT POWER vs. GSMGC CONTROL VOLTAGE GSM BAND
30 OUTPUT POWER (dBm) 20 10 0 -10 -20 PIN = +0dBm -30 -30 0.75 1.25 1.75 2.25 PIN = +4dBm PIN = +12dBm
MAX2216 toc05
OUTPUT POWER vs. DCSGC CONTROL VOLTAGE DCS BAND
PIN = +12dBm
MAX2216 toc06
34 MAXIMUM OUTPUT POWER (dBm)
40
40 30 OUTPUT POWER (dBm) 20 PIN = +8dBm 10 0 -10 -20 PIN = +0dBm PIN = +4dBm
33
TA = -40C
TA = +25C
PIN = +8dBm
32
TA = +85C
31 VCC = +3.2V VDCSGC = +2.4V 1700 1720 1740 1760 1780 1800
30
0.75
1.25
1.75
2.25
FREQUENCY (MHz)
GSMGC GAIN CONTROL VOLTAGE (V)
DCSGC GAIN CONTROL VOLTAGE (V)
EFFICIENCY vs. OUTPUT POWER
MAX2216 toc07
NOISE AND HARMONIC LEVELS vs. OUTPUT POWER GSM BAND
-120 NOISE IN 100kHz BW AT 20MHz OFFSET RMS DETECTOR HARMONIC LEVELS (dBm) NOISE POWER (dBm/Hz) NOISE POWER (dBm/Hz) -125 -10 -125
MAX2216 toc08
NOISE AND HARMONIC LEVELS vs. OUTPUT POWER DCS BAND
0 -120 NOISE IN 100kHz BW AT 20MHz OFFSET RMS DETECTOR HARMONIC LEVELS (dBm) -10
MAX2216 toc09
50 45 40 EFFICIENCY (%) 35 30 25 20 15 10 5 0 15 20 25 30 35 OUTPUT POWER (dBM) GSM DCS
0
-130
-20
-130
-20
-135
-30
-135
-30
-140 15 20 25 30 35 OUTPUT POWER (dBm)
-40
-140 15 20 25 30 35 OUTPUT POWER (dBm)
-40
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Miniature Chip-Scale GSM900/DCS1800/PCS1900 Power Amplifier MAX2216
Pin Description
PIN A1, A3, A5, B5, C3, C5, D5, E1, E3, E5 A2, A4, E2, E4 A6, B6, C6 B1 B2 B3 C2 D1 D2 D3 D6, E6 NAME FUNCTION
GND
Ground Connection. Provide a low-inductance path to ground plane.
VCC GSMOUT GSMIN GSMGC GSMCAP VCC DCSIN DCSGC DCSCAP DCSOUT
Interstage Power-Supply Connections. Bypass capacitor values and placement are critical for proper operation. See MAX2216 Evaluation Kit data sheet for component placement guide. GSM PA Output. Open-collector output of GSM power amplifier. Connect together, DC-bias with an RF choke, and reactively tune to 50. GSM PA Input. AC-couple to this bump. GSM Gain Control Input. Connect GSM gain control to this bump. Bias Filter Capacitor Power-Supply Connection. Decouple with 100pF capacitor to GND. DCS PA Input. AC-couple to this bump. Shunt capacitor is required for best match. DCS Gain Control Input. Connect DCS DC gain control to this bump. Decouple this signal with 100pF to GND near the IC for noise filtering. Bias Filter Capacitor DCS PA Output. Open-Collector output of DCS power amplifier. Connect together, and DC-bias with an RF choke, and reactively tune to 50.
There are no solder bumps located at the following positions: B4, C1, C4, D4.
Detailed Description
The MAX2216 offers two fully independent three-stage power amplifiers (PAs), one for the GSM band and one for the DCS/PCS band, integrated into a tiny 5 6 chipscale package. This dual PA is perfect for tri-band GSM/DCS/PCS, dual-band GSM/DCS, single-band PCS handsets, and US GSM/PCS handsets. The PAs are fully characterized over the 880MHz to 915MHz European GSM band, the 1710MHz to 1785MHz European DCS band, and the 1850MHz to 1910MHz US PCS band (contact Factory for PCS characterization data). The MAX2216 operates from a single +2.5V to +5.5V supply, allowing for single-cell Li+ or three-cell NiCd/NiMH battery operation.
DCS/PCS Power Amplifier
The DCS/PCS band PA is optimized for operation in the 1710MHz to 1785MHz European DCS band and the 1850MHz to 1910MHz US PCS band. The amplifier requires input and output matching circuits (see Applications Information section). A gain-control input (DCSGC) offers analog control of output power, providing more than 40dB dynamic range. The PA enters a low-power shutdown when VGC < 0.4V. Maximum output power is +32dBm from a +3.2V supply.
Applications Information
Optimizing the Output Match
For best results, base the new design on the MAX2216 EV kit layout and component values. Use Table 1 for modeling output-match design. Further adjustment will be necessary to optimize output power and efficiency.
GSM Power Amplifier
The GSM band PA is optimized for operation in the 880MHz to 915MHz European GSM band. The amplifier requires an output-matching circuit (see Applications Information section). A gain-control input (GSMGC) offers analog control of output power, providing more than 40dB dynamic range. The PA enters a low-power shutdown when VGSMGC < 0.4V. Guaranteed output power is +34.5dBm from a +3.2V supply.
Optimizing the Input Match
The GSM input is adequately matched to 50, and requires no matching. A good match for the DCS input is achieved with a single shunt capacitor placed on a 50 line (see MAX2216 EV kit). An external shunt resistor to ground at GSMIN is intended to help flatten the
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Miniature Chip-Scale GSM900/DCS1800/PCS1900 Power Amplifier
gain-control slope. It affects the input match minimally, so its position is at the circuit designer's discretion. missible. Refer to the Maxim application note, "Wafer Level Ultra-Chipscale Packaging" for additional detailed information on UCSP layout and handling.
MAX2216
Table 1. Required Load Impedance as Seen From Output
GSM DCS PCS 1.8 + j 0.3 2.7 - j 1.0 2.7 - j 1.2
Prototype Chip Installation
Alignment keys on the PC board around the area where the chip is located will be helpful in the prototype assembly process. It is best to align the chip on the board before any other components are placed, and then place the board on a hotplate until the solder begins to flow. After about 20 seconds, carefully remove the board from the hotplate without disturbing the position of the IC, and let it cool down to room temperature before stuffing any more components. To remove an IC, place the PC board on a hotplate preheated to about 300C until the IC begins to reflow. Remove the IC so as not to disturb other components. Remove the PC board from the hotplate--do not attempt to solder a new IC yet. Allow the PC board to cool and, under a microscope, carefully clean the residual solder and flux away from the mounting pads. The MAX2216 EV kit has a few particularly narrow traces. When cleaning the mounting area, do not use excessive heat; in particular, the gain control traces can easily lift and be destroyed. Once the area is clean, repeat the steps above to reinstall the IC.
Tuning the First- and Second-Stage Amplifiers
Supply bumps A2 and A4 feed the collectors of the first- and second-stage amplifiers, respectively, for the GSM PA. Likewise, supply bumps E2 and E4 feed the first- and second-stage amplifiers for the DCS/PCS PA. The PC board trace together with a properly placed decoupling capacitor creates the proper matching impedance required at these pins. Additional decoupling capacitors may be required for long supply lines.
Multislot Operation
Thermal dissipation is the limiting factor when considering the maximum duty-cycle of the PA. Although the UCSP is very small, the fact that there are 26 solder connections to the PC board allows excellent thermal performance. As measured on the MAX2216 EV kit, the thermal resistance of the IC (JC) is 16C/W, and the total thermal resistance from the IC to ambient ( JA ) is 22C/W. Therefore at +70C, the IC can dissipate 3.6W with the IC's junction temperature below 150C. These results will vary dependent upon PC board construction and ground plane layout. Maximum PA power dissipation occurs under worstcase load mismatch conditions and maximum supply voltage. See "Maximum Operating VCC Under Load Mismatch" in the Electrical Characteristics table.
UCSP Reliability
The UCSP represents a unique package that greatly reduces board space compared to other packages. UCSP reliability is integrally linked to the user's assembly methods, circuit board material, and usage environment. The user should closely review these areas when considering use of a UCSP. This form factor may not perform equally to a packaged product through traditional mechanical reliability tests. Performance through operating life test and moisture resistance remains uncompromised as it is primarily determined by the wafer-fabrication process. Mechanical stress performance is a greater consideration for a UCSP. UCSP solder-joint contact integrity must be considered since the package is attached through direct solder contact to the user's PC board. Testing done to characterize the UCSP reliability performance shows that it is capable of performing reliably through environmental stresses. Results of environmental stress tests and additional usage data and recommendations are detailed in the UCSP application note, "Wafer-Level Chip-Scale Package" on Maxim's website, www.maxim-ic.com.
Grounding
Proper grounding of the GND bumps is fundamental. For best results, ground bumps should use vias in pads. A separate via should be used for each ground bump, connecting to a shallow ground plane.
Pad Layout
The UCSP has a bump pitch of 0.5mm (19.7mil) and a bump diameter of 0.3mm (12mil). Therefore, lay out the solder pad spacing on 0.5mm (19.7mil) centers; use a pad size of 0.25mm (10mil); and a solder mask opening of 0.33mm (13mil). Round or square pads are per-
Chip Information
TRANSISTOR COUNT: 2302
7
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Miniature Chip-Scale GSM900/DCS1800/PCS1900 Power Amplifier MAX2216
Functional Diagram
VCC VCC
GSMIN GAIN CTRL BIAS DCSGC GAIN CTRL MAX2216
GSMOUT
GSMGC
VCC GND DCSOUT
DCSIN
VCC
VCC
Pin Configuration
1 2 (BUMPS ON BOTTOM) 3 4 5 6
A
GND
VCC
GND
VCC
GND
GSMOUT
B
GSMIN
GSMGC
GSMCAP
GND
GSMOUT
MAX2216 C VCC GND GND GSMOUT
D
DCSIN
DCSGC
DCSCAP
GND
DCSOUT
E
GND
VCC
GND
VCC
GND
DCSOUT
8
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Miniature Chip-Scale GSM900/DCS1800/PCS1900 Power Amplifier
Package Information
MAX2216
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 _____________________ 9 (c) 2001 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.

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