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| HAT1023R Silicon P Channel Power MOS FET High Speed Power Switching ADE-208-436 F (Z) 7th. Edition October. 1996 Features * * * * Low on-resistance Capable of 2.5 V gate drive Low drive current High density mounting Outline SOP-8 8 5 76 56 7 8 DD D D 3 12 4 4 G 1, 2, 3 Source 4 Gate 5, 6, 7, 8 Drain SSS 123 HAT1023R Absolute Maximum Ratings (Ta = 25C) Item Drain to source voltage Gate to source voltage Drain current Drain peak current Symbol VDSS VGSS ID ID(pulse)Note1 Ratings -20 10 -7 -56 -7 2.5 150 -55 to +150 Unit V V A A A W C C Body-drain diode reverse drain current IDR Channel dissipation Channel temperature Storage temperature Note: Pch Note2 Tch Tstg 1. PW 10s, duty cycle 1 % 2. When using the glass epoxy board (FR4 40 x 40 x 1.6 mm), PW 10s Electrical Characteristics (Ta = 25C) Item Drain to source breakdown voltage Gate to source breakdown voltage Gate to source leak current Zero gate voltege drain current IGSS IDSS -- -- -0.5 -- -- 9 -- -- -- -- -- -- -- -- -- -- -- 0.027 0.04 14 2250 1120 300 40 200 280 220 -0.9 10 -10 -1.5 0.04 0.06 -- -- -- -- -- -- -- -- -1.4 A A V S pF pF pF ns ns ns ns V IF = -7A, VGS = 0 Note3 VGS = 8V, VDS = 0 VDS = -20 V, VGS = 0 VDS = -10V, I D = -1mA ID = -4A, VGS = -4V Note3 ID = -4A, VGS = -2.5V Note3 ID = -4A, VDS = -10V Note3 VDS = -10V VGS = 0 f = 1MHz VGS = -4V, ID = -4A VDD A -10V V(BR)GSS 10 -- -- V IG = 100 A, VDS = 0 Symbol Min Typ -- Max -- Unit V Test Conditions ID = -10mA, VGS = 0 V(BR)DSS -20 Gate to source cutoff voltage VGS(off) Static drain to source on state resistance Forward transfer admittance Input capacitance Output capacitance RDS(on) RDS(on) |yfs| Ciss Coss Reverse transfer capacitance Crss Turn-on delay time Rise time Turn-off delay time Fall time Body-drain diode forward voltage Body-drain diode reverse recovery time trr td(on) tr td(off) tf VDF -- 75 -- ns IF = -7A, VGS = 0 diF/ dt =20A/s HAT1023R Main Characteristics Power vs. Temperature Derating 4.0 Pch (W) Maximum Safe Operation Area -100 I D (A) Test Condition : When using the glass epoxy board (FR4 40x40x1.6 mm), PW < 10 s 3.0 10 s PW 100 s 1m s -30 -10 -3 -1 -0.3 -0.1 Ta = 25 C 1 shot pulse DC = Op er 10 Channel Dissipation Drain Current ati m s 2.0 (P N W ote Operation in <4 10 this area is s) limited by R DS(on) on 1.0 -0.03 0 50 100 150 Ta (C) 200 Ambient Temperature -0.01 -0.1 -0.3 -1 -3 -10 -30 -100 Drain to Source Voltage V DS (V) Note 4 : When using the glass epoxy board (FR4 40 x 40 x 1.6 mm) Typical Output Characteristics -10 V -5 V -20 -4 V -3.5 V -3 V -2.5 V Typical Transfer Characteristics -20 Tc = -25 C 25 C ID I D (A) Pulse Test (A) -16 -16 75 C -12 -12 Drain Current -8 -2 V Drain Current -8 -4 VGS = -1.5 V 0 -2 -4 -6 Drain to Source Voltage -8 -10 V DS (V) -4 V DS = -10 V Pulse Test 0 -1 -2 -3 Gate to Source Voltage -4 -5 V GS (V) HAT1023R Drain to Source Saturation Voltage vs. Gate to Source Voltage Drain to Source Saturation Voltage V DS(on) (V) Pulse Test Drain to Source On State Resistance R DS(on) ( ) -0.5 Static Drain to Source on State Resistance vs. Drain Current 0.5 Pulse Test 0.2 0.1 VGS = -2.5 V -4 V -0.4 -0.3 0.05 -0.2 I D = -5 A -2 A -1 A 0.02 0.01 -0.1 0 -6 -2 -4 Gate to Source Voltage -10 V GS (V) -8 0.005 -0.2 -0.5 -1 -2 Drain Current -5 -10 -20 I D (A) Static Drain to Source on State Resistance R DS(on) ( ) Forward Transfer Admittance |y fs | (S) Static Drain to Source on State Resistance vs. Temperature 0.10 Pulse Test 0.08 I D = -5, -2, -1 A 0.06 V GS = -2.5 V 0.04 -5, -2 , -1 A 0.02 0 -40 -4 V Forward Transfer Admittance vs. Drain Current 50 20 10 75 C 5 25 C Tc = -25 C 2 1 0.5 -0.2 V DS = -10 V Pulse Test -0.5 -1 -2 -5 -10 -20 Drain Current I D (A) 0 40 80 120 160 Case Temperature Tc (C) HAT1023R Body-Drain Diode Reverse Recovery Time 1000 10000 3000 1000 300 100 30 10 0 Ciss Coss Crss Typical Capacitance vs. Drain to Source Voltage Reverse Recovery Time trr (ns) 500 200 100 50 20 10 -0.2 di / dt = 20 A / s VGS = 0, Ta = 25 C -0.5 -1 -2 -5 -10 -20 Reverse Drain Current I DR (A) Capacitance C (pF) VGS = 0 f = 1 MHz -4 -8 -12 -16 -20 Drain to Source Voltage V DS (V) Dynamic Input Characteristics V DS (V) Switching Time t (ns) -10 VDD = -5 V -10 V -20 V V GS (V) 0 0 1000 500 Switching Characteristics -2 t d(off) tf Drain to Source Voltage -20 V DS -4 V GS -6 Gate to Source Voltage 200 100 50 tr t d(on) -30 V DD = -20 V -10 V -5 V I D = -7 A 16 32 48 64 Gate Charge Qg (nc) -40 -50 0 -8 20 10 -0.2 -10 80 V GS = -4 V, V DD = -10 V PW = 3 s, duty < 1 % -0.5 -1 -2 Drain Current -5 -10 -20 I D (A) HAT1023R Reverse Drain Current vs. Source to Drain Voltage -20 Pulse Test Reverse Drain Current I DR (A) -16 -12 V GS = -5 V 0, 5 V -8 -4 0 -0.4 -0.8 -1.2 -1.6 -2.0 Source to Drain Voltage V SD (V) Normalized Transient Thermal Impedance vs. Pulse Width 10 Normalized Transient Thermal Impedance s (t) 1 D=1 0.5 0.1 0.2 0.1 0.05 0.02 0.01 0.01 ch - f(t) = s (t) * ch - f ch - f = 83.3 C/W, Ta = 25 C When using the glass epoxy board (FR4 40x40x1.6 mm) e uls PDM PW T 0.001 1sh ot D= p PW T 0.0001 10 100 1m 10 m 100 m 1 10 100 1000 10000 Pulse Width PW (S) HAT1023R Package Dimentions Unit: mm 5.0 Max 8 5 1 4 4.0 Max 1.75 Max 6.2 Max 0.25 Max 0 - 8 1.27 0.51 Max 0.25 Max 1.27 Max 0.15 0.25 M Hitachi code EIAJ JEDEC FP-8DA -- MS-012AA |
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