![]() |
|
If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
Datasheet File OCR Text: |
Philips Semiconductors Product specification Silicon Diffused Power Transistor BUT11AI GENERAL DESCRIPTION Enhanced performance, high speed switching npn transistor in TO220AB envelope specially suited for high frequency electronic lighting ballast applications and converters, inverters, switching regulators, motor control systems etc. QUICK REFERENCE DATA SYMBOL VCESM VCEO IC ICM Ptot VCEsat ICsat tf PARAMETER Collector-emitter voltage peak value Collector-emitter voltage (open base) Collector current (DC) Collector current peak value Total power dissipation Collector-emitter saturation voltage Collector Saturation current Inductive fall time CONDITIONS VBE = 0 V TYP. 2.5 0.08 MAX. 1000 450 5 10 100 1.5 0.15 UNIT V V A A W V A s Tmb 25 C IC = 2.5 A; IB = 0.33 A ICon = 2.5 A; IBon = 0.5 A PINNING - TO220AB PIN 1 2 3 tab base collector emitter collector DESCRIPTION PIN CONFIGURATION tab SYMBOL c b 1 23 e LIMITING VALUES Limiting values in accordance with the Absolute Maximum Rating System (IEC 134) SYMBOL VCESM VCEO IC ICM IB IBM Ptot Tstg Tj PARAMETER Collector-emitter voltage peak value Collector-emitter voltage (open base) Collector current (DC) Collector current peak value Base current (DC) Base current peak value Total power dissipation Storage temperature Junction temperature CONDITIONS VBE = 0 V MIN. -65 MAX. 1000 450 5 10 2 4 100 150 150 UNIT V V A A A A W C C Tmb 25 C THERMAL RESISTANCES SYMBOL Rth j-mb Rth j-a PARAMETER Junction to mounting base Junction to ambient in free air CONDITIONS TYP. MAX. 1.25 60 UNIT K/W K/W April 2002 1 Rev 2.000 Philips Semiconductors Product specification Silicon Diffused Power Transistor BUT11AI STATIC CHARACTERISTICS Tmb = 25 C unless otherwise specified SYMBOL ICES ICES IEBO VCEOsust VCEsat VBEsat hFE hFE hFEsat PARAMETER Collector cut-off current 1 CONDITIONS VBE = 0 V; VCE = VCESMmax VBE = 0 V; VCE = VCESMmax; Tj = 125 C VEB = 9.0 V; IC = 0 A IB = 0 A; IC = 100 mA; L = 25 mH IC = 2.5 A;IB = 0.33 A IC = 2.5 A;IB = 0.33 A IC = 5 mA; VCE = 5 V IC = 0.5 A; VCE = 5 V IC = 2.5 A; VCE = 5 V MIN. 450 10 14 9 TYP. 20 22 13 MAX. 1.0 2.0 10.0 1.5 1.3 35 35 17 UNIT mA mA mA V V V Emitter cut-off current Collector-emitter sustaining voltage Collector-emitter saturation voltage Base-emitter saturation voltage DC current gain DYNAMIC CHARACTERISTICS Tmb = 25 C unless otherwise specified SYMBOL PARAMETER Switching times resistive load ton ts tf Turn-on time Turn-off storage time Turn-off fall time Switching times inductive load ts tf ts tf Turn-off storage time Turn-off fall time Turn-off storage time Turn-off fall time ICon = 2.5 A; IBon = 0.5 A; LB = 1 H; -VBB = 5 V ICon = 2.5 A; IBon = 0.5 A; LB = 1 H; -VBB = 5 V; Tj = 100 C CONDITIONS ICon = 2.5 A; IBon = 0.5 A; -IBoff = 0.5 A 0.6 3.4 0.6 1.0 4.0 0.8 s s s TYP. MAX. UNIT 1.1 80 1.2 140 1.4 150 1.5 300 s ns s ns IC / mA + 50v 100-200R 250 Horizontal Oscilloscope Vertical 300R 30-60 Hz 6V 1R 200 100 0 VCE / V min VCEOsust Fig.1. Test circuit for VCEOsust. Fig.2. Oscilloscope display for VCEOsust. 1 Measured with half sine-wave voltage (curve tracer). April 2002 2 Rev 2.000 Philips Semiconductors Product specification Silicon Diffused Power Transistor BUT11AI VCC ICon 90 % IC RL VIM 0 tp IB RB T.U.T. ts toff IBon 10 % tf t T -IBoff t Fig.3. Test circuit resistive load. VIM = -6 to +8 V VCC = 250 V; tp = 20 s; = tp / T = 0.01. RB and RL calculated from ICon and IBon requirements. Fig.6. Switching times waveforms with inductive load. 90 % ICon 120 90 % % Normalised Derating with heatsink compound 110 100 90 IC 10 % ts ton toff IBon 10 % tr 30ns -IBoff tf 80 70 60 50 40 30 20 10 0 0 20 40 60 80 Ths / C 100 120 140 P tot IB Fig.4. Switching times waveforms with resistive load. Fig.7. Normalised power derating and second breakdown curves. VCC 6 5 4 IC / A BUT11AX LC 3 IBon LB T.U.T. 2 1 0 0 400 VCE / V 800 1200 -VBB Fig.5. Test circuit inductive load. VCC = 300 V; -VBE = 5 V; LC = 200 uH; LB = 1 uH Fig.8. Reverse bias safe operating area. Tj Tj max April 2002 3 Rev 2.000 Philips Semiconductors Product specification Silicon Diffused Power Transistor BUT11AI 100 h FE BUT11AX 10 Zth / (K/W) 5V 10 1V 1 D= 0.5 0.2 0.1 0.05 0.02 0 0.1 1 0.01 0.1 1 IC / A 10 100 P D tp D= tp T t Fig.9. Typical DC current gain. hFE = f(IC); parameter VCE T 0.01 1E-06 1E-04 1E-02 t/s 1E+00 100 IC / A Fig.11. Transient thermal impedance. Zth j-hs = f(t); parameter D = tp/T ICM max 10 IC max = 0.01 tp = 10 us II (1) 100 us 1 1 ms 10 ms I 0.1 (2) 500 ms DC III 0.01 1 10 100 VCE / V 1000 Fig.10. Forward bias safe operating area. Ths 25 C (1) (2) I II III NB: Ptot max and Ptot peak max lines. Second breakdown limits. Region of permissible DC operation. Extension for repetitive pulse operation. Extension during turn-on in single transistor converters provided that RBE 100 and tp 0.6 s. Mounted with heatsink compound and 30 5 newton force on the centre of the envelope. April 2002 4 Rev 2.000 Philips Semiconductors Product specification Silicon Diffused Power Transistor BUT11AI MECHANICAL DATA Dimensions in mm Net Mass: 2 g 4,5 max 10,3 max 1,3 3,7 2,8 5,9 min 15,8 max 3,0 max not tinned 3,0 13,5 min 1,3 max 1 2 3 (2x) 2,54 2,54 0,9 max (3x) 0,6 2,4 Fig.12. TO220AB; pin 2 connected to mounting base. Notes 1. Refer to mounting instructions for TO220 envelopes. 2. Epoxy meets UL94 V0 at 1/8". April 2002 5 Rev 2.000 Philips Semiconductors Product specification Silicon Diffused Power Transistor BUT11AI DEFINITIONS DATA SHEET STATUS DATA SHEET STATUS2 Objective data PRODUCT STATUS3 Development DEFINITIONS This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A Preliminary data Qualification Product data Production Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. Philips Electronics N.V. 2002 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. 2 Please consult the most recently issued datasheet before initiating or completing a design. 3 The product status of the device(s) described in this datasheet may have changed since this datasheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. April 2002 6 Rev 2.000 |
Price & Availability of BUT11AI2
![]() |
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |