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| MF799 Datacom, Video Link, Intra-Office Telecom, WDM Duplex Device DS5483 ISSUE 1 June 2001 Ordering Information MF799 13329.11, duplex package Description Used in combination with the MF699, the MF-799 Duplex Device is designed for WDM (Wavelength Division Multiplex), Datacom, Video Links, or Intra Office Telecom Applications. It emits optical power at 820nm and detects incoming optical power at 1320nm, allowing full Duplex Communication over one single fiber. The MF799 uses dichroic (wavelength-selective) beamsplitters for maximum power budget and minimum crosstalk. Minimum internal crosstalk is achieved by the use of wavelength-selective Detectors. The long wavelength path meets requirements for FDDI (ANSI X3T9.5 and ATM 155Mbps. The MF799 is designed for multi-mode fiber and optimized for 62.5/125m fiber. ST Assembly Applications * * * * * * * Ethernet 10 or 100Mbps Token Ring Fibre Channel 266Mbps FDDI ATM-SDH/SONET 155Mbps Intra-Office Telecom WDM Applications Features * * * * * * Full Duplex Communication Over One Fiber Dual Wavelengths 820/1300nm Very Small Size Very Low Internal Crosstalk Packaged in Industry-Standard ST(R) Receptacle Designed for 62.5/125m Fiber BOTTOM VIEW BOTTOM VIEW ANODE CATHODE ANODE PIN 1320nm 820nm PIN MF799 ANODE CASE FIBER MF699 1320nm CASE CATHODE LED 820nm LED ANODE CATHODE BOTTOM VIEW DICHROIC BEAMSPLITTER BOTTOM VIEW MF799 Functional Diagram 1 MF799 Absolute Maximum Ratings* Parameter Storage Temperature Operating Temperature (Fig 2) LED Power Dissipation (Fig 2) LED Continuous Forward Current (f10kHz) LED Peak Forward Current (Duty cycle 50%, f1MHz) LED Reverse Voltage PIN Reverse Voltage Solder Temperature (Note 1) Symbol Tstg Top Ptot IF IFRM VRL VRP Tsld Min. -55 -40 Max. +125 +85 250 110 180 1.5 20 260 Units C C mW mA mA V V C * Exceeding these values may cause permanent damage. Functional operation under these conditions is not implied. Note 1: 2mm from the case for 10s. LED Optical & Electrical Characteristics (Case Temperature -25 to +70C) Parameter Fiber-coupled-Power (Fig 1) Rise & Fall TIme (10-90% no bias) Bandwidth (3dBel) Peak Wavelength Spectral Width (FWHM) Forward Voltage (Fig 3) Reverse Current Capacitance Symbol Pfiber tr tf fc p VF IR C 20 800 Min. -19 1.5 250 820 50 840 60 2.1 20 2 Typ. Max. Unit dBm ns MHz nm nm V A pF Test Conditions IPeak=60mA (Note 1,2) IF=60mA (Note 2) IF=60mA (Note 2) IF=60mA IF=60mA IF=60mA VR=1V VR=0V, f=1MHz Note 1: Average power at 10MHz/50% duty cycle. Measured at the exit of 100m of fiber. Note 2: 62.5/125m graded index fiber (NA=0.275) PIN Optical & Electrical Characteristics (Case Temperature -25 to +70C) Parameter Responsivity (Fig 4) Bandwidth Capacitance (Fig 5) Dark Current Symbol R fc C Id Min. 0.5 500 1.6 5 100 75 Typ. Max. Unit A/W MHz pF nA Test Conditions VR=5V =1320nm (note 1) VR=5V RL=50 (note 1) VR=5V f=1MHz TCase=25C TCase=70C VR=5V ILED=0mA VR=5V ILED=60mA (note 2) Crosstalk Current ICr nA Note 1: 62.5/125m graded index fiber (NA=0.275) Note 2: Internal crosstalk with ceramic ferrule inserted but no power from the fiber. Total Current = Dark Current + Crosstalk Current. 2 MF799 LED Thermal Characteristics Parameter Thermal Resistance - Infinite Heat Sink Thermal Resistance - On PC Board Temperature Coefficient - Optical Power Temperature Coefficient - Wavelength Symbol Rthjc Rthjb dP/dTj dd/dTj -0.6 0.3 Min. Typ. Max. 200 300 Units C/W C/W %/C nm/C PIN Thermal Characteristics Parameter Temperature Coefficient - Dark Current Temperature Coefficient - Wavelength Symbol dld/dTj dlCr/dTj Min. Typ. 5 -0.6 Max. Units %/C %/C 3 MF799 % 100 mW 300 MAX. ELECTRICAL POWER DISSIPATION RELATIVE FIBER-COUPLED POWER A ATIVE 80 50% DUTY CYCLE INFINITE HEAT SINK 200 ON PC BOARD 60 DC 40 100 20 HEAT SINKED 0 0 40 80 120 160 200 mA 0 0 50 100 150 C FORW CURRENT OPERATING TEMPERATURE Figure 1 mA 200 Figure 2 % 100 RELATIVE RESPONSIVITY FORWARD CURRENT 100 50 0 0 1 2 3V 0 800 900 1000 1100 1200 1300 1400 1500 1600 1700 1800 nm FORWARD VOLTAGE WAVELENGTH Figure 3 pF 4.0 Figure 4 CAPACITANCE P PAC TANCE T 2.0 0 0 5 10 V REVERSE VOLTAGE Figure 5 4 MF799 4.1 r0.3 1.4 LED PIN DIODE 2-56 UNC - 2B 3/8" - 32 UNEF max. 1 MARKING/ SLOT SIDE 0.006 O2.502 +0.01 0 12.7 2.5 5.4 9.5 FIBER END O2.5 +0 -0.004 7.89 0.03 9.6 21 3.9 min. 12 6.8 20.1 MATING FERRULE (not included) Note: The LED chip is isolated from the case. All dimensions in mm. MF799 Mechanical Data 3/8 - 32 UNEF 2B THREAD 9.53 12.70 1.65 HEX-NUT 10.41 14.27 0.46 WASHER MF799 Packaging Hardware 5 For more information about all Zarlink products visit our Web Site at www.zarlink.com Information relating to products and services furnished herein by Zarlink Semiconductor Inc. trading as Zarlink Semiconductor or its subsidiaries (collectively "Zarlink") is believed to be reliable. However, Zarlink assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the application or use of any such information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or use. Neither the supply of such information or purchase of product or service conveys any license, either express or implied, under patents or other intellectual property rights owned by Zarlink or licensed from third parties by Zarlink, whatsoever. Purchasers of products are also hereby notified that the use of product in certain ways or in combination with Zarlink, or non-Zarlink furnished goods or services may infringe patents or other intellectual property rights owned by Zarlink. This publication is issued to provide information only and (unless agreed by Zarlink in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. The products, their specifications, services and other information appearing in this publication are subject to change by Zarlink without notice. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. Manufacturing does not necessarily include testing of all functions or parameters. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to Zarlink's conditions of sale which are available on request. Purchase of Zarlink's I2C components conveys a licence under the Philips I2C Patent rights to use these components in an I2C System, provided that the system conforms to the I2C Standard Specification as defined by Philips. Zarlink and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc. Copyright 2002, Zarlink Semiconductor Inc. All Rights Reserved. TECHNICAL DOCUMENTATION - NOT FOR RESALE |
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