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 2SJ484
Silicon P-Channel MOS FET High Speed Power Switching
ADE-208-501 A 2nd. Edition Features
* Low on-resistance R DS(on) = 0.18 typ. (at V GS = -10V, I D = -1A) * Low drive current * High speed switching * 4V gate drive devices.
Outline
2SJ484
Absolute Maximum Ratings (Ta = 25C)
Item Drain to source voltage Gate to source voltage Drain current Drain peak current Body to drain diode reverse drain current Channel dissipation Channel temperature Storage temperature Symbol VDSS VGSS ID I D(pulse)* I DR Pch* Tch Tstg
2 1
Ratings -30 20 -2 -4 -2 1 150 -55 to +150
Unit V V A A A W C C
Notes: 1. PW 100s, duty cycle 10 % 2. When using aluminium ceramic board (12.5 x 20 x 0.7 mm)
Electrical Characteristics (Ta = 25C)
Item Drain to source breakdown voltage Gate to source breakdown voltage Zero gate voltege drain current Gate to source leak current Symbol V(BR)DSS V(BR)GSS I DSS I GSS Min -30 20 -- -- -1.0 -- -- 1.2 -- -- -- -- -- -- -- -- -- Typ -- -- -- -- -- 0.18 0.3 2.0 230 140 50 10 30 35 30 -0.95 60 Max -- -- -10 10 -2.0 0.23 0.45 -- -- -- -- -- -- -- -- -- -- Unit V V A A V S pF pF pF ns ns ns ns V ns I F = -2A, VGS = 0 I F = -2A, VGS = 0 diF/ dt = 50A/s Test Conditions I D = -10mA, VGS = 0 I G = 100A, VDS = 0 VDS = -30 V, VGS = 0 VGS = 16V, VDS = 0 I D = -1mA, VDS = -10V I D = -1A, VGS = -10VNote3 I D = -1A, VGS = -4V*1 I D = -1A, VDS = -10V*1 VDS = -10V VGS = 0 f = 1MHz I D = -1A, RL = 30 VGS = -10V
Gate to source cutoff voltage VGS(off) Static drain to source on state RDS(on) resistance RDS(on) Forward transfer admittance Input capacitance Output capacitance |yfs| Ciss Coss
Reverse transfer capacitance Crss Turn-on delay time Rise time Turn-off delay time Fall time Body to drain diode forward voltage Body to drain diode reverse recovery time Notes: 1. Pulse test 2. Marking is "WY". t d(on) tr t d(off) tf VDF t rr
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2SJ484
Main Characteristics
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2SJ484
Package Dimensions
Unit: mm
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2SJ484
When using this document, keep the following in mind: 1. This document may, wholly or partially, be subject to change without notice. 2. All rights are reserved: No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without Hitachi's permission. 3. Hitachi will not be held responsible for any damage to the user that may result from accidents or any other reasons during operation of the user's unit according to this document. 4. Circuitry and other examples described herein are meant merely to indicate the characteristics and performance of Hitachi's semiconductor products. Hitachi assumes no responsibility for any intellectual property claims or other problems that may result from applications based on the examples described herein. 5. No license is granted by implication or otherwise under any patents or other rights of any third party or Hitachi, Ltd. 6. MEDICAL APPLICATIONS: Hitachi's products are not authorized for use in MEDICAL APPLICATIONS without the written consent of the appropriate officer of Hitachi's sales company. Such use includes, but is not limited to, use in life support systems. Buyers of Hitachi's products are requested to notify the relevant Hitachi sales offices when planning to use the products in MEDICAL APPLICATIONS.
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