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| BTA26 BW/CW SNUBBERLESS TRIACS .HI .HI .V .BTAFami FEATURES GH COMMUTATION : (dI/dt)c > 22A/ms without snubber GH SURGE CURRENT : ITSM = 250A DRM UP TO 800V ly : INSULATING VOLTAGE = 2500V(RMS) (UL RECOGNIZED : E81734) DESCRIPTION The BTA26 BW/CW triac family are high performance glass passivated chips technology. The SNUBBERLESSTM concept offer suppression of RC network and it is suitable for application such as phase control and static switching on inductive or resistive load. ABSOLUTE RATINGS (limiting values) Symbol IT(RMS) ITSM RMS on-state current (360 conduction angle) Non repetitive surge peak on-state current ( Tj initial = 25C ) I2t value Critical rate of rise of on-state current Gate supply : IG = 500mA diG/dt = 1A/s Parameter Tc = 85 C tp = 8.3 ms tp = 10 ms I2t dI/dt tp = 10 ms Repetitive F = 50 Hz Non Repetitive Tstg Tj Tl Storage and operating junction temperature range Maximum lead temperature for soldering during 10 s at 4.5 mm from case Value 25 262 250 312.5 20 100 - 40 to + 150 - 40 to + 125 260 C C C A2s A/s Unit A A A1 A2 G TOP 3 (Plastic) Symbol Parameter 400 BTA26-... BW/CW 600 600 700 700 800 800 Unit VDRM VRRM Repetitive peak off-state voltage Tj = 125 C 400 V March 1995 1/5 BTA26 BW/CW THERMAL RESISTANCES Symbol Rth (j-a) Junction to ambient Parameter Value 50 1.5 ( F= 50 Hz) 1.1 Unit C/W C/W C/W Rth (j-c) DC Junction to case for DC Rth (j-c) AC Junction to case for 360 conduction angle GATE CHARACTERISTICS (maximum values) PG (AV) = 1W PGM = 40W (tp = 20 s) IGM = 8A (tp = 20 s) VGM = 16V (tp = 20 s). ELECTRICAL CHARACTERISTICS Symbol Test Conditions Quadrant Suffix BW IGT VD=12V (DC) RL=33 Tj=25C I-II-III MIN MAX VGT VGD tgt IL VD=12V (DC) RL =33 Tj=25C Tj=125C Tj=25C Tj=25C I-II-III I-II-III I-II-III I-III II I-II-III IH * VTM * IDRM IRRM dV/dt * IT= 500mA gate open ITM= 35A tp= 380s VDRM VRRM Rated Rated Tj=25C Tj=25C Tj=25C Tj=125C Tj=125C MAX MIN TYP TYP TYP MAX MAX MAX MAX MAX MIN TYP Tj=125C MIN TYP * For either polarity of electrode A2 voltage with reference to electrode A1. Unit CW 2 35 1.5 0.2 2 V V s 80 50 1.80 0.01 3 mA V mA mA mA 2 50 VD=VDRM R L=3.3k VD=VDRM IG = 500mA dIG/dt = 3A/s IG=1.2 IGT 50 90 75 Linear slope up to VD =67%VDRM gate open Without snubber 500 750 22 44 250 500 13 26 V/s (dI/dt)c * A/ms 2/5 BTA26 BW/CW ORDERING INFORMATION Package IT(RMS) A BTA (Insulated) 25 VDRM / VRRM V 400 600 700 800 Sensitivity Specification BW X X X X CW X X X X Fig.1 : Maximum RMS power dissipation versus RMS on-state current (F=50Hz). (Curves are cut off by (dI/dt)c limitation) Fig.2 : Correlation between maximum RMS power dissipation and maximum allowable temperatures (Tamb and Tcase) for different thermal resistances heatsink + contact. Fig.3 : RMS on-state current versus case temperature. Fig.4 : Relative variation of thermal impedance versus pulse duration. Zth/Rth 1.00 Zth( j-c) 0.10 Zt h( j-a) 0.01 tp (s) 1E-3 1E-2 1E-1 1E +0 1 E+1 1 E+2 1 E+3 3/5 BTA26 BW/CW Fig.5 : Relative variation of gate trigger current and holding current versus junction temperature. Fig.6 : Non Repetitive surge peak on-state current versus number of cycles. Fig.7 : Non repetitive surge peak on-state current for a sinusoidal pulse with width : t 10ms, and corresponding value of I2t. Fig.8 : On-state characteristics (maximum values). 4/5 BTA26 BW/CW PACKAGE MECHANICAL DATA TOP 3 Plastic REF. A R 4.6 I J H DIMENSIONS Millimeters Min. Max. 15.50 21.10 15.60 16.50 4.60 4.17 1.55 0.70 2.90 5.65 1.40 Inches Min. 0.594 0.814 0.561 0.632 0.133 0.173 0.161 0.057 0.019 0.106 0.212 0.047 Max. 0.611 0.831 0.615 0.650 0.182 0.164 0.062 0.028 0.115 0.223 0.056 A B G B D 15.10 20.70 14.30 16.10 3.40 4.40 4.08 1.45 0.50 2.70 5.40 1.20 C D G H I J P L M C L M N P N N Cooling method : C Marking : type number Weight : 4.7 g Recommended torque value : 0.8 m.N. Maximum torqur value : 1 m.N. Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. (c) 1995 SGS-THOMSON Microelectronics - Printed in Italy - All rights reserved. SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. 5/5 |
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