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5 VOLT BOOT BLOCK FLASH MEMORY
28F002BC (x8)
High Performance Read 80/120 ns Max. Access Time 40 ns Max. Output Enable Time Low Power Consumption 20 mA Typical Read Current x8-Only Input/Output Architecture Space-Constrained 8-bit Applications Optimized Array Blocking Architecture One 16-KB Protected Boot Block Two 8-KB Parameter Blocks One 96-KB Main Block One 128-KB Main Block Top Boot Location Hardware Data Protection Feature Erase/Write Lockout during Power Transitions Absolute Hardware Protection for Boot Block Software EEPROM Emulation with Parameter Blocks
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Extended Cycling Capability 100,000 Block Erase Cycles Automated Byte Write and Block Erase Industry-Standard Command User Interface Status Registers Erase Suspend Capability SRAM-Compatible Write Interface Reset/Deep Power-Down Input 0.2 A ICC Typical Provides Reset for Boot Operations Industry-Standard Surface Mount Packaging 40-Lead TSOP 44-Lead PSOP 40-Lead PDIP ETOXTM IV Flash Technology 5 V Read 12 V Write and Block Erase VPP = 12 V 5% Standard VPP = 12 V 10% Option Independent Software Vendor Support
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The Intel(R) 2-Mbit flash memory is an extension of the Boot Block architecture which includes block-selective erasure, automated write and erase operations, and a standard microprocessor interface. The 2-Mbit flash memory enhances the Boot Block architecture by adding more density and blocks, x8 input/output control, very high-speed, low-power, and industry-standard ROM-compatible pinout and surface mount packaging. The Intel(R) 28F002BC is an 8-bit wide flash memory offering. This high-density flash memory provides userselectable bus operation for 8-bit applications. The 28F002BC is a 2,097,152-bit nonvolatile memory organized as 262,144 bytes of information. It is offered in 44-lead PSOP, 40-lead PDIP and 40-lead TSOP package, which is ideal for space-constrained portable systems or any application with board space limitations. This device uses an integrated Command User Interface (CUI) and Write State Machine (WSM) for simplified byte write and block erasure. The 28F002BC provides block locations compatible with the Intel(R) MCS(R)-186 family, 80286, 90860CA, and the Intel386TM, Intel486TM, Pentium(R), and Pentium Pro microprocessors. The boot block includes a data protection feature to protect the boot code in critical applications. With a maximum access time of 80 ns, this high-performance 2-Mbit flash memory interfaces at zero wait-state to a wide range of microprocessors and microcontrollers. A deep power-down mode lowers the total VCC power consumption to 1 W typical. This power savings is critical in hand-held battery powered systems. For very low-power applications using a 3.3 V supply, refer to the 3 Volt Advanced Boot Block Flash Memory datasheet (order number 290580). Manufactured on Intel(R) 0.6 micron ETOXTM IV process technology, the 28F002BC flash memory provides world-class quality, reliability, and cost-effectiveness at the 2-Mbit density. NOTE: This document formerly known as 28F002BC 2-Mbit (256K x 8) Boot Block Flash Memory.
December 1998 Order Number: 290578-005
Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. The 28F002BC may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be obtained from: Intel Corporation P.O. Box 5937 Denver, CO 80217-9808 or call 1-800-548-4725 or visit Intel's website at http://www.intel.com
COPYRIGHT (c) INTEL CORPORATION 1996, 1997, 1998 CG-041493
*Third-party brands and names are the property of their respective owners.
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CONTENTS
PAGE 1.0 INTRODUCTION............................................. 5 1.1 Designing for Density Upgradeability ........... 5 1.2 Main Features.............................................. 5 1.3 Applications ................................................. 6 1.4 Pinouts ........................................................ 7 1.5 Pin Descriptions......................................... 10 2.0 PRODUCT DESCRIPTION ........................... 11 2.1 Memory Organization ................................ 12 2.1.1 Blocking .............................................. 12 2.1.2 28F002BC-T Block Memory Map ........ 12 3.0 PRINCIPLES OF OPERATION..................... 12 3.1 Bus Operations.......................................... 13 3.2 Read Operations........................................ 13 3.2.1 Read Array.......................................... 13 3.2.2 Intelligent Identifiers ............................ 14 3.3 Write Operations........................................ 14 3.3.1 Command User Interface (CUI)........... 14 3.3.2 Status Register ................................... 17 3.3.3 Program Mode .................................... 17 3.3.4 Erase Mode ........................................ 18 3.3.5 Extended Cycling ................................ 19 3.4 Boot Block Locking .................................... 19 3.4.1 VPP = VIL for Complete Protection ....... 19 3.4.2 RP# = VHH for Boot Block Unlocking ... 19
28F002BC
PAGE 3.5 Power Consumption................................... 23 3.5.1 Active Power ....................................... 23 3.5.2 Standby Power.................................... 23 3.5.3 Deep Power-Down .............................. 23 3.6 Power-Up/Down Operation ........................ 23 3.6.1 RP# Connected to System Reset ........ 23 3.6.2 VCC, VPP and RP# Transitions............. 23 3.7 Power Supply Decoupling .......................... 24 3.7.1 VPP Trace on Printed Circuit Boards.... 24 4.0 ELECTRICAL SPECIFICATIONS ................. 25 4.1 Absolute Maximum Ratings ....................... 25 4.2 Operating Conditions ................................. 25 4.3 Capacitance............................................... 25 4.4 DC Characteristics ..................................... 26 4.5 AC Characteristics--Read Only Operations ................................................ 29 4.6 AC Characteristics--WE#--Controlled Write Operations ................................................ 30 4.7 AC Characteristics--CE#--Controlled Write Operations ................................................ 33 4.8 Erase and Program Timings ...................... 35 5.0 ORDERING INFORMATION ......................... 35 6.0 ADDITIONAL INFORMATION....................... 36 APPENDIX A: WSM Transition Table ............... 37
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REVISION HISTORY
Version -001 -002 Original version Pin 2 of 44-Lead PSOP changed from DU to NC Alternate program command (10H) removed WSM transition table added 40-Lead PDIP package added Description -003 -004 -005
Date of Revision 04/01/96 09/01/96
10/01/96 12/01/97 12/15/98
Erase Suspend/Resume Flowchart changed VCC and VPP ranges changed throughout document
Revised Section 1.1, Designing for Density Upgradeability, and 1.4, Pinouts, to reflect current product offering. Changed document title from 28F002BC 2-Mbit (256K x 8) Boot Block Flash Memory.
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1.0 1.1
28F002BC
28F002BX to the 28F002BC, the NOR gate can be removed. When considering upgrading, packaging is of paramount importance. Current and future market trends indicate TSOP and PSOP as the packages that will enable designs into the next century.
INTRODUCTION
This datasheet comprises the specifications for the 28F002BC 2-Mbit flash memory. Section 1.0 provides an overview of the 2-Mbit flash memory, including applications, pinouts, and pin descriptions. Section 2.0 describes the memory organization in detail. Section 3.0 defines a description of the memory's principles of operation. Section 4.0 details the memory's operating specifications. Finally, Sections 5.0 and 6.0 provide ordering and reference information.
1.2
Main Features
The 28F002BC Boot Block flash memory is a highperformance, 2-Mbit (2,097,152 bit) flash memory organized as 256 Kbytes (262,144 bytes) of eight bits each. The 28F002BC has separately erasable blocks, including a hardware-lockable boot block (16,384 bytes), two parameter blocks (8,192 bytes each) and two main blocks (one block of 98,304 bytes and one block of 131,072 bytes). An erase operation typically erases one of the main blocks in 2.4 seconds and the boot or parameter blocks in 1.0 second. Each block can be independently erased and programmed 100,000 times. The boot block is located at the top of the address map to match the protocol of many systems, including the Intel(R) MCS-186 family, 80960CA, i860TM microprocessors as well as Pentium and Pentium Pro microprocessors. The hardwarelockable boot block provides the most secure code storage. The boot block is intended to store the kernel code required for booting-up a system. When the RP# pin is at VHH, the boot block is unlocked and program and erase operations can be performed. When the RP# pin is at VPPLK, the boot block is locked and program and erase operations to the boot block are ignored. The Command User Interface (CUI) serves as the interface between the microprocessor or microcontroller and the internal operation of the 28F002BC. Program and Erase Automation allows program and erase operations to be executed using an industry standard two-write command sequence to the CUI. Data writes are performed in byte increments. Each byte in the flash memory can be programmed independently of other memory locations but is erased simultaneously with all other locations within the block.
Designing for Density Upgradeability
The 28F002BC has been optimized to meet market requirements. Applications currently using the 28F001BX and 28F002BX can migrate to this product. Of course, both the 28F001BX and the 28F002BX devices use an 8-bit wide bus. Those applications needing a 16-bit bus can convert to the 5 Volt Boot Block Flash memory 28F200B5, 28F400B5, 28F800B5 products. Low power applications using a 3.3 V supply can convert to the 3 Volt Advanced Boot Block Flash memory family. The 28F004B5 product is a natural migration path to the 4-Mbit density. Both the 28F002BC and the 28F004B5 are offered in identical packages to make upgrade seamless. A few simple considerations can smooth the migration path significantly: 1. Connect the NC pin of the 28F002BC to GND (this will retain boot block locking when a 28F004B5 is inserted). Design a switchable VPP to take advantage of the 5 V VPP option on the 28F004B5, device. If anticipating use of the 5 V VPP option, switch VPP to GND for complete write protection.
2. 3.
Previous designs with Intel(R) 28F002BX devices on occasion had to use a NOR gate (or some other scheme) to prevent issues with floating addresses latching incorrect data. The 28F002BC has corrected this issue and does not need the NOR gate. When migrating a design using the
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Host Bus PCI Bus ISA Bus X-Bus A[16:0] Main Memory CE# 74S245 BUFFER OE# Intel(R) 28F002BC WE# RP# DQ[7:0] 82430FX PCIset (82437FX) 82430FX PCIset (82371FX) XMEMW# XMEMR# Cache PWROK XDOR XOE# VPP
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Pentium(R) Processor 100/90 MHz
Figure 1. 28F002BC-T Interface to a Pentium(R) Microprocessor System The Status Register (SR) indicates the status of the internal Write State Machine (WSM), which reports critical information on program and/or erase sequences. The maximum access time of 80 ns (tACC) is guaranteed over the commercial temperature range (0 C to +70 C), 10% VCC supply voltage range (4.5 V to 5.5 V) and 100 pF output load. Typical ICC active current is 20 mA. IPP, the maximum program current, is 20 mA. The standard VPP voltage for erase and program is 11.4 V to 12.6 V (VPP = 12 V 5%). The 28F002BC flash memory is also designed with a standby mode to minimize system current drain and allow for low-power designs. When the CE# and RP# pins are at VCC, the CMOS standby mode is enabled and ICC drops to about 50 A. A deep power-down mode is enabled when the RP# pin is at ground. In addition to minimizing power consumption, the deep power-down mode also provides write protection during power-up conditions. ICC current during deep power-down mode is 0.20 A typical. An initial maximum access time or reset time of 300 ns is required from RP# switching high until outputs are valid. Equivalently, the device has a maximum wake-up time of 215 ns until writes to the CUI are recognized. 6 When RP# is at ground, the WSM is reset, the status register is cleared, and the entire device is write-protected. This feature prevents data corruption and protects the code stored in the device during system reset. The system Reset pin can be tied to RP# to reset the memory to read mode at power-up. With on-chip program/erase automation and RP# functionality for data protection, the device is protected against unwanted program and/or erase cycles, even during system reset.
1.3
Applications
2-Mbit Boot Block flash memory combines high density, high performance, and cost-effective flash memory with blocking and hardware protection capabilities. Its flexibility and versatility reduces cost throughout the product life cycle. Flash memory is ideal for Just-In-Time production flow, reducing system inventory and costs, and eliminating component handling during the production phase. During a product's life cycle, flash memory reduces costs by allowing userperformed code updates and feature enhancements via floppy disk or remote link.
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28F002BC
The 28F002BC is also an excellent design solution for analog and digital cellular phone and telecommunication switching applications requiring high-performance, high-density storage in a small form factor package (x8-only bus). The blocking structure allows for easy segmentation of embedded code for modular software designs. For example, the parameter block can be used for frequently updated data storage and diagnostic messages (e.g., phone numbers and authorization codes).
The 28F002BC is a full-function blocked flash product suitable for a wide range of applications, including extended PC BIOS, digital cellular phone program and data storage, telecommunication boot/firmware, and various embedded applications where both program and data storage are required. Reprogrammable systems, such as personal computers, are ideal applications for the 28F002BC. Portable and hand-held personal computer applications are becoming more complex with the addition of power management software to take advantage of the latest microprocessor technology, the availability of ROM-based application software, pen tablet code for electronic handwriting, and diagnostic code. Figure 1 shows an example 28F002BC application. The increase in software sophistication augments the probability that a code update will be required after the PC is shipped. The 28F002BC provides a safe and inexpensive update solution for desktop, notebook, and hand-held personal computers while extending the product lifetime. Furthermore, the deep power-down mode provides added flexibility for those battery-operated portable designs that require low power.
1.4
Pinouts
The 28F002BC in the 44-lead PSOP pinout follows the industry-standard ROM/EPROM pinout, as shown in Figure 4. The 28F200B5 pinout, indicating the WP# input, is also shown in the same diagram. The 40-lead TSOP package (shown in Figure 2) offers the smallest form factor possible. The lowcost 40-lead PDIP package diagram is shown in Figure 3.
A16 A15 A14 A13 A12 A11 A9 A8 WE# RP# VPP NC NC A7 A6 A5 A4 A3 A2 A1
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 E28F002BC Boot Block 40-Lead TSOP 10 mm x 20 mm TOP VIEW
40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21
A17 GND NC NC A10 DQ7 DQ6 DQ5 DQ4 VCC VCC NC DQ3 DQ2 DQ1 DQ0 OE# GND CE# A0
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Figure 2. The 40-Lead TSOP Offers the Smallest Form Factor for Space-Constrained Applications
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NC NC A0 CE# GND OE# DQ0 DQ1 DQ2 DQ3 VCC VCC DQ4 DQ5 DQ6 DQ7 A10 GND A17 NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 P28F002BC Boot Block 40-Lead PDIP 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 NC A1 A2 A3 A4 A5 A6 A7 VPP RP# WE# A8 A9 A11 A12 A13 A14 A15 A16 NC
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Figure 3. The 40-Lead PDIP Offers the Lowest Cost Package Solution
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28F200B5 VPP WP# NC A7 A6 A5 A4 A3 A2 A1 A0 CE# GND OE# DQ0 DQ8 DQ1 DQ9 DQ2 DQ10 DQ3 DQ11 VPP NC NC A7 A6 A5 A4 A3 A2 A1 A0 CE# GND OE# DQ0 NC DQ1 NC DQ2 NC DQ3 NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 PA28F002BC Boot Block 44-Lead TSOP 0.525" x 1.110" TOP VIEW 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 RP# WE# A8 A9 A10 A11 A12 A13 A14 A15 A16 NC GND A-1 DQ7 NC DQ6 NC DQ5 NC DQ4 VCC
28F002BC
28F200B5 RP# WE# A8 A9 A10 A11 A12 A13 A14 A15 A16 NC GND DQ15/A-1 DQ7 DQ14 DQ6 DQ13 DQ5 DQ12 DQ4 VCC
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Figure 4. The 44-Lead PSOP Offers a Convenient Upgrade from JEDEC ROM Standards
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1.5
Pin Descriptions
Table 1. 28F002BC Pin Descriptions Type INPUT Name and Function
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Symbol A-1, A0-A17 A9 DQ0- DQ7
ADDRESS INPUTS for memory addresses. Addresses are internally latched during a write cycle. A-1 is used on the PSOP package only. A 17 is used on the TSOP and PDIP packages. ADDRESS INPUT: When A9 is at V HH, the signature mode is accessed. During this mode, A0 decodes between the manufacturer and device IDs. DATA INPUTS/OUTPUTS: Inputs array data on the second CE# and WE# cycle during a program operation. Inputs commands to the Command User Interface when CE# and WE# are active. Data is internally latched during the write cycle. Outputs array, intelligent identifier and status register data. The data pins float to tri-state when the chip is de-selected or the outputs are disabled. CHIP ENABLE: Activates the device's control logic, input buffers, decoders and sense amplifiers. CE# is active low. CE# high deselects the memory device and reduces power consumption to standby levels. If CE# and RP# are high, but not at a CMOS high level, the standby current will increase due to current flow through the CE# and RP# input stages. OUTPUT ENABLE: Enables the device's outputs through the data buffers during a read cycle. OE# is active low. WRITE ENABLE: Controls writes to the command register and array blocks. WE# is active low. Addresses and data are latched on the rising edge of the WE# pulse. RESET/DEEP POWER-DOWN: Provides three-state control. Puts the device in deep power-down mode, locks, and unlocks the boot block from program/erase. When RP# is at logic high level (6.5 V maximum), the boot block is locked and cannot be programmed or erased. When RP# = VHH (10.8 V minimum), the boot block is unlocked and can be programmed or erased. When RP# is at a logic low level the boot block is locked, the deep power-down mode is enabled and the WSM is reset--preventing any blocks from being programmed or erased. When RP# transitions from logic low to logic high, the flash memory enters the read array mode.
INPUT INPUT/ OUTPUT
CE#
INPUT
OE# WE#
INPUT INPUT
RP#
INPUT
VCC VPP
DEVICE POWER SUPPLY: 5.0 V 10%, 5.0 V 5% PROGRAM/ERASE POWER SUPPLY: For erasing memory array blocks or programming data in each block. When VPP < VPPLK all blocks are locked and memory contents cannot be altered. GROUND: For all internal circuitry. NO CONNECT: Pin may be driven or left floating.
GND NC
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2.0
28F002BC
PRODUCT DESCRIPTION
DQ0 -DQ 7
Output Buffer
Input Buffer
I/O Logic
Output Multiplexer
Identifier Register Status Register
Data Register
Command User Interface
CE# WE# OE# RP#
Power Reduction Control A0 -A17 Input Buffer
Data Comparator
Y-Decoder
Y-Gating/Sensing
8-Kbyte Parameter Block
8-Kbyte Parameter Block
Write State Machine
Program/Erase Voltage Switch
V PP
96-Kbyte Main Block
Address Latch
X-Decoder
128-Kbyte Main Block
16-Kbyte Boot Block
V CC GND
Address Counter
044819
Figure 5. 28F002BC Internal Block Diagram
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2.1
2.1.1
Memory Organization
BLOCKING
2.1.1.2
Parameter Blocks - 8 KB (each)
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The 28F002BC features an asymmetrically-blocked architecture that provides system memory integration. Each block can be erased up to 100,000 times. The block sizes have been chosen to optimize their functionality for common applications of nonvolatile storage. For the address locations of the blocks, see the 28F002BC-T Memory Map, Figure 6. 2.1.1.1 Boot Block - 16 KB
The 28F002BC has two 8-Kbyte parameter blocks to facilitate storage of frequently updated system parameters that would normally require an EEPROM. The parameter blocks can also be used to store additional boot or main code. By using software techniques, the byte-rewrite functionality of EEPROMs can be emulated. These techniques are detailed in Intel's application note AP-604 Using Intel's Boot Block Flash Memory Parameter Blocks to Replace EEPROM. 2.1.1.3 Main Block - 96 KB and 128 KB
The boot block is intended to replace a dedicated boot PROM in a microprocessor or microcontrollerbased system. The 16-Kbyte (16,384 bytes) boot block is located at the top of the address map as shown in Figure 6. This boot block features hardware controllable write-protection to protect the crucial microprocessor boot code from accidental erasure. The boot block can be erased and written when RP# is held at 12 V for the duration of the erase or program operation. This feature allows customers to change the boot code when necessary while providing security at other times.
The 28F002BC contains one 96-Kbyte (98,304 byte) block and one 128-Kbyte (131,072 byte) block. These blocks are typically used for data or code storage. 2.1.2 28F002BC-T BLOCK MEMORY MAP
3FFFFH 3C000H 3BFFFH 3A000H 39FFFH 38000H 37FFFH 20000H 1FFFFH 128-Kbyte Main Block 00000H
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The 16-Kbyte boot block of the 28F002BC-T is located from 3C000H to 3FFFFH. The first 8-Kbyte parameter block resides in memory space from 3A000H to 3BFFFH. The second 8-Kbyte parameter block consumes the memory area from 38000H to 39FFFH. The 96-Kbyte main block extends from 20000H to 37FFFH, while the 128-Kbyte main block occupies the region from 00000H to 1FFFFH.
16-Kbyte Boot Block 8-Kbyte Parameter Block 8-Kbyte Parameter Block 96-Kbyte Main Block
3.0
PRINCIPLES OF OPERATION
Flash memory improves upon EPROM capability with in-circuit electrical write and erase. The Boot Block flash memory utilizes a Command User Interface (CUI) and automated algorithms to simplify write and erase operations. The CUI allows for 100% TTL-level control inputs, fixed power supplies during erasure and programming, and maximum EPROM compatibility. When VPP < VPPLK, the device will only successfully execute the following commands: Read Array, Read Status Register, Clear Status Register, and Intelligent Identifier. The device provides standard EPROM read, standby and output disable operations. Manufacturer identification and device identification data can be accessed through the CUI or through the standard EPROM A9 high voltage (VID) access for PROM programming equipment. High voltage on VPP allows write and erase of the device. With VPP active, all functions associated
Figure 6. 28F002BC-T Memory Map
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3.1
28F002BC
3.2.1 READ ARRAY
with altering memory contents are accessible via the CUI. The purpose of the Write State Machine (WSM) is to automate the write and erasure of the device completely. The WSM will begin operation upon receipt of a signal from the CUI and will report status back through the status register. The CUI will handle the WE# interface to the data and address latches, as well as system software requests for status while the WSM is in operation.
When RP# transitions from VIL (reset) to VIH, the device will be in read array mode and will respond to the read control inputs (CE#, OE#, and address inputs) without any commands being written to the CUI. When the device is in read array mode, four control signals must be manipulated to read data at the outputs. * WE# must be logic high (VIH) CE# must be logic low (VIL) OE# must be logic low (VIL) RP# must be logic high (VIH) * * *
Bus Operations
Flash memory reads, erases and writes in-system via the local CPU. All bus cycles to or from the flash memory conform to standard microprocessor bus cycles. These bus operations are summarized in Tables 2 and 4.
In addition, the address of the desired location must be applied to the address pins. Refer to AC Characteristics for the exact sequence and timing of these signals. If the device is not in read array mode, as would be the case after a program or erase operation, the Read Mode command (FFH) must be written to the CUI before array reads can take place.
3.2
Read Operations
The 28F002BC has three user read modes: read array, read intelligent identifier, and read status register.
During power-up conditions, it takes a maximum of 600 ns from when VCC is at 4.5 V to when valid data is available at the outputs. Table 2. 28F002BC Bus Operations Mode Read Output Disable Standby Deep Power-Down Intelligent Identifier (Mfr) Intelligent Identifier (Device) Write 8 4 4 5,6,7 Notes 1,2,3 RP# VIH VIH VIH VIL VIH VIH VIH CE# VIL VIL VIH X VIL VIL VIL OE# VIL VIH X X VIL VIL VIH WE# VIH VIH X X VIH VIH VIL A9 X X X X VID VID X A0 X X X X VIL VIH X VPP X X X X X X VPPH DQ0-7 DOUT High Z High Z High Z 89H 7CH DIN
NOTES: 1. Refer to DC Characteristics. 2. X can be VIL, VIH for control pins and addresses, VPPLK or VPPH for VPP. 3. See DC Characteristics for VPPLK, VPPH, VHH, VID voltages. 4. Manufacturer and device codes may also be accessed via a CUI write sequence, A1-A17 = X. 5. Refer to Table 3 for valid DIN during a write operation. 6. Command writes for program or block erase are only executed when VPP = VPPH. 7. To write or erase the boot block, hold RP# at VHH. 8. RP# must be at GND 0.2 V to meet the maximum deep power-down current specified.
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3.2.2 INTELLIGENT IDENTIFIERS 3.3.1
COMMAND USER INTERFACE (CUI)
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The manufacturer and device codes are read via the CUI or by taking the A9 pin to VID. Writing 90H to the CUI places the device into Intelligent Identifier read mode. A read of location 00000H outputs the manufacturer's identification code, 89H. Reading location 00001H outputs the device ID, 7CH. The 28F002BC device ID of 7CH is identical to the E28F002BX (40-lead TSOP). It differs from the PA28F200BX (44-lead PSOP), which has a device ID of 2274H. Designers using the PA28F200BX in the x8 mode who wish to migrate to the PA28F002BC need to be mindful of this device ID difference and modify software drivers as necessary. The 40-lead PDIP device ID is 7CH.
The Command User Interface (CUI) serves as the interface between the microprocessor and the internal chip controller. Commands are written to the CUI using standard microprocessor write timings. The available commands (summarized in Tables 3 and 4) are Read Array, Read Intelligent Identifier, Read Status Register, Clear Status Register, Program Setup, Erase Setup/Confirm, and Erase Suspend. For Read commands, the CUI points the read path at either the array, the intelligent identifier, or the status register depending on the command received. For Program or Erase commands, the CUI informs the Write State Machine (WSM) that a Program or Erase has been requested. During the execution of a Program command, the WSM controls the programming sequences and the CUI responds only to status register reads. During an erase cycle, the CUI responds only to status register reads and Erase Suspend. After the WSM has completed its task, it will set the WSM Status bit (bit 7 of the status register) to a "1," which will also allow the CUI to respond to its full command set. Note that after the WSM has returned control to the CUI, the CUI will stay in the read status register mode until it receives another command (see Appendix A). Table 3. Command Set Codes and Corresponding Device Mode Command Codes 00 20 40 50 70 90 B0 D0 FF Device Mode Invalid/Reserved Erase Setup Program Setup Clear Status Register Read Status Register Intelligent Identifier Erase Suspend Erase Resume/Erase Confirm Read Array
3.3
Write Operations
There are two commands that alter memory array contents: Program Setup and Erase Setup/Confirm. In addition, the Erase Suspend command suspends the WSM during an erase operation and releases the CUI to accept any Read command (so long as it is to a block other than the one being erased). Finally, there is a Clear Status Register command for resetting the contents of the status register. This command should be invoked following all operations that modify the status register. All commands written to the CUI will be interpreted, but for any write operation to be initiated, the VPP voltage must be at VHH. Depending on the application, the design may have a switchable VPP power supply or the VPP may be "hard-wired" to 12 V. The 28F002BC will function normally in either case. It is highly recommended that RP# is tied to the system RESET for data protection during unstable CPU reset and also for proper CPU / flash synchronization. Furthermore, when attempting to modify the contents of the 28F002BC's boot block area, VHH must be applied to both VPP and RP# for the operation to be valid. Whether attempting to alter the contents of the boot block or any other memory array area, if the proper voltages are not applied to the correct input signals the write operation will be aborted. Subsequently, the status register will respond with either Bit 3 (VPP low error), Bit 4 (program error) or Bit 5 (erase error) being set (refer to Table 5 for status register definitions).
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Command Read Array Intelligent Identifier Read Status Register Clear Status Register Program Setup Block Erase/Confirm Erase Suspend/Resume ADDRESS BA = Block Address IA = Identifier Address PA = Program Address X = Don't Care NOTES:
1. 2.
28F002BC
Table 4. Command Bus Definitions First Bus Cycle Notes Oper Write 1,2 Write Write Write Write Write Write Addr X X X X PA BA X Data FFH 90H 70H 50H 40H 20H B0H Write Write Write PA BA X PD D0H D0H Read Read IA X IID SRD Second Bus Cycle Oper Addr Data
DATA SRD = Status Register Data IID = Intelligent Identifier Data PD = Program Data
Bus operations are defined in Table 2. Following the Intelligent Identifier command, two read operations access manufacturer and device codes respectively.
3.3.1.1
Command Function Description
Device operations are selected by writing specific commands into the CUI. Tables 3 and 4 define the available commands. Status register (SR) bits are defined in Table 5. Invalid/Reserved These are unassigned commands and should not be used. Intel reserves the right to redefine these codes for future functions. Read Array (FFH) This single write cycle command points the read path at the array. If the host CPU performs a CE#/OE#-controlled Read immediately following a two-write sequence (i.e., a Program or Erase command) that started the WSM, then the device
will output status register contents. Writing two Read Array (FFH) commands to the CUI aborts the current operation and resets to read array mode. Executing Read Array after the Erase Setup command (instead of giving Erase Confirm) causes the status register erase and program status bits to be set. This indicates that an erase operation was initiated but not successfully confirmed (an Erase Confirm at this point would be ignored by the CUI). A subsequent Read Array command will point the data path at the array (see Appendix A). Intelligent Identifier (90H) After this command is executed, the CUI points the output path to the intelligent identifier circuits. Only intelligent identifier values at addresses 0 and 1 can be read (only address A0 is used in this mode; all other address inputs are ignored).
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28F002BC
Read Status Register (70H) This is one of three commands that is executable while the WSM is operating. After this command is written, a read of the device will output the contents of the status register, regardless of the address presented to the device. The device automatically enters this mode after program or erase has completed. Clear Status Register (50H) The WSM can set the program status and erase status bits in the status register to "1," but it cannot clear them to "0." The status register is operated in this fashion for two reasons, the first is synchronization. Since the WSM does not know when the host CPU has read the status register, it would not know when to clear the status bits. Second, if the CPU is programming a string of bytes, it may be more efficient to query the status register after programming the string. Thus, if any errors exist while programming the string, the status register will return the accumulated error status. The Clear Status Register command clears the program, erase, and VPP status bits to "0." Program Setup (40H) This command simply sets the CUI into a state such that the next write will load the Address and Data registers. After this command is executed, the outputs default to the status register. Two consecutive Read Array commands (FFH) are required to reset to Read Array after the Program Setup command. Program The write following the Program Setup command will latch address and data. Also, the CUI initiates the WSM to begin execution of the program algorithm. The device outputs status register data when OE# is enabled. To read array data after the program operation is completed, a Read Array command is required. Erase Setup (20H)
E
The Erase Setup command prepares the CUI for the Erase Confirm command. No other action is taken. If the next command is not an Erase Confirm command, then the CUI will set both the program status and erase status bits of the status register to a "1," place the device into read status register mode, and wait for another command. Erase Confirm (D0H) If the previous command was an Erase Setup command, then the CUI will enable the WSM to erase, at the same time closing the address and data latches, and respond only to the Read Status Register and Erase Suspend commands. While the WSM is executing, the device will output status register data when OE# is toggled low. Status register data can only be updated by toggling either OE# or CE#. If the previous command was not the Erase Setup command (20H), the Erase Confirm command is ignored. Status register bits 4 and 5 are both set to indicate an invalid command sequence. Erase Suspend (B0H) This command is only valid while the WSM is executing an erase operation. At all other times, this command is ignored. After this command has been executed, the CUI will set a signal that directs the WSM to suspend erase operations. While waiting for the erase to be suspended, the CUI responds only to the Read Status Register command or to the Erase Resume command. Once the WSM has reached the Suspend state, it will set an output in the CUI that allows the CUI to respond to the Read Array, Read Status Register, and Erase Resume commands. In this mode, the CUI will not respond to any other commands. The WSM will also set the WSM and erase suspend status bits to a "1." The WSM will continue to run, idling in the Suspend state, regardless of the state of all input control pins except VPP and RP#. If VPP is taken below VPPLK, the VPP low status bit (SR.3) will be set and the WSM will abort the suspended erase operation. If active, RP# will immediately shut down the WSM and the remainder of the chip. During a suspend operation, the data and address latches will remain closed, but the address pads are able to drive the address into the read path.
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3.3.2
28F002BC
written to the CUI. Then, any other command may be issued to the CUI. Note, again, that before a read cycle can be initiated, a valid read command must be written to the CUI to specify whether the read data is to come from the memory array, status register, or intelligent identifier. 3.3.3 PROGRAM MODE
Erase Resume (D0H) This command will cause the CUI to clear the Suspend state and clear the WSM status bit to a "0," but only if an Erase Suspend command was previously issued. Erase Resume will not have any effect under any other conditions. STATUS REGISTER
The 28F002BC contains a status register which may be read to determine when a program or erase operation is complete, and whether that operation completed successfully. The status register may be read at any time by writing the Read Status Register command to the CUI. After writing this command, all subsequent read operations output data from the status register until another command is written to the CUI. A Read Array command must be written to the CUI to return to read array mode. The status register bits are output on DQ[0:7]. The contents of the status register are latched on the falling edge of OE# or CE#, whichever occurs last in the read cycle. This prevents possible bus errors that might occur if the contents of the status register change while reading the status register. CE# or OE# must be toggled with each subsequent status read to insure the status register is updated; otherwise, the completion of a program or erase operation will not be evident from the status register. When the WSM is active, the status register will indicate the status of the WSM and upon command completion, it will indicate success or failure of the operation (see Table 5 for definition of status register bits). 3.3.2.1 Clearing the Status Register
Programming is executed using a two-write sequence. The Program Setup command is written to the CUI followed by a second write which specifies the address and data to be programmed. The WSM then executes a sequence of internallytimed events to: 1. Program the desired bits of the addressed memory byte. 2. Verify that the desired bits are sufficiently programmed. Programming of the memory results in specific bits within a byte being changed to a "0." If the user attempts to program "1"s, there will be no change in memory contents and no error is reported by the status register. Similar to erasure, the status register indicates whether programming is complete. While the program sequence is executing, bit 7 of the status register is a "0." The status register can be polled by toggling either CE# or OE# to determine when the program sequence is complete. Only the Read Status Register command is valid while programming is active. When programming is complete, the status bits, which indicate whether the program operation was successful, should be checked. If the programming operation was unsuccessful, bit 4 of the status register is set to a "1" to indicate a program failure. If bit 3 is set to a "1," then VPP was not within acceptable limits, and the WSM did not execute the programming sequence. If the program operation fails, bit 4 of the status register will be set within 1.5 ms, as determined by the timeout of the WSM. The status register should be cleared before attempting the next operation. Any CUI instruction can follow after programming is completed; however, reads from the memory array cannot be accomplished until the CUI is given the Read Array command. Figure 7 shows the Automated Programming Flowchart. 17
The WSM sets status bits "3" through "7" to "1," and clears bits "6" and "7" to "0," but cannot clear status bits "3" through "5" to "0." Bits 3 through 5 can only be cleared by the controlling CPU through the use of the Clear Status Register command. These bits can indicate various error conditions. By allowing the system software to control the resetting of these bits, several operations may be performed (such as cumulatively programming several bytes or erasing multiple blocks in sequence). The status register may then be read to determine if an error occurred during that programming or erasure series. This feature adds flexibility to the way the device may be programmed or erased. To clear the status register, the Clear Status Register command is
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28F002BC
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Table 5. Status Register Bit Definition ESS 6 ES 5 DWS 4 VPPS 3 R 2 NOTES: R 1 R 0 When erase suspend is issued, the WSM halts execution and sets both the WSMS and ESS bits to "1." The ESS bit remains set to "1" until an Erase Resume command is issued. When this bit is set to "1," the WSM has applied the maximum number of erase pulses to the block and is still unable to successfully verify block erasure. When this bit is set to "1," the WSM has attempted but failed to program a byte. The VPP status bit, unlike an A/D converter, does not provide continuous indication of VPP level, but it does check the VPP level intermittently. The WSM interrogates VPP level only after the program or erase command sequences have been entered, and informs the system if V PP has not been switched on. If VPP ever goes below VPPLK (even during an Erase Suspend), the status register will set this bit and abort the operation in progress, even if VPP is returned to a valid level. The VPP status bit is not guaranteed to report accurate feedback between VPPLK and VPPH. These bits are reserved for future use and should be masked out when polling the status register.
WSMS 7
SR.7 = WRITE STATE MACHINE STATUS (WSMS) The Write State Machine bit must first be checked to 1 = Ready determine program or block erase completion, before 0 = Busy the program or erase status bits are checked for success. SR.6 = ERASE-SUSPEND STATUS (ESS) 1 = Erase Suspended 0 = Erase In Progress/Completed SR.5 = ERASE STATUS 1 = Error In Block Erasure 0 = Successful Block Erase SR.4 = PROGRAM STATUS 1 = Error in Byte Program 0 = Successful Byte Program SR.3 = VPP STATUS 1 = VPP Low Detect, Operation Abort 0 = VPP OK
SR.2-SR.0 = RESERVED FOR FUTURE ENHANCEMENTS
3.3.4
ERASE MODE
The WSM then executes a sequence of internally timed events to: 1. Program all bits within the block to "0." 2. Verify that all bits within the block are sufficiently programmed to "0." 3. Erase all bits within the block (set all bits to "1"). 4. Verify that all bits within the block are sufficiently erased. While the erase sequence is executing, bit 7 of the status register is a "0."
Erase Setup and Erase Confirm commands to the CUI, along with the address identifying the block to be erased. This address is latched internally when the Erase Confirm command is issued. Block erasure results in all bits within the block being set to "1." If the Erase Confirm command does not follow the Erase Setup command, the status register responds by setting both SR.4 and SR.5 to "1" to indicate an invalid command sequence. The WSM returns to read status register mode. 18
PRELIMINARY
When the status register indicates that erasure is complete, the status bits, which indicate whether the erase operation was successful, should be checked. If the erase operation was unsuccessful, bit 5 of the status register will be set (within 1.5 ms) to "1," indicating an erase failure. If VPP is not within acceptable during the suspended period, the WSM does not execute the erase sequence; instead, bit 5 of the status register is set to a "1" to indicate an erase failure, and bit 3 is set to a "1" to indicate that the VPP supply voltage was outside acceptable limits. The status register should be cleared before attempting the next operation. Any CUI instruction can follow after erasure is completed; however, reads from the memory array cannot be accomplished until the CUI is given the Read Array command. Figure 8 details the Automated Block Erase Flowchart. 3.3.4.1 Suspending and Resuming Erase
E
28F002BC
erase sequence and finish erasing the block. As with the end of a standard erase operation, the status register must be read, cleared, and the next instruction issued in order to continue. Figure 9 highlights the Erase Suspend/Resume Flowchart. 3.3.5 EXTENDED CYCLING
Intel has designed extended cycling capability into its ETOX IV flash memory technology. The 28F002BC flash memory is designed for 100,000 program/erase cycles on each of the five blocks. At 10% VPP, the parameter blocks are capable of 10,000 program/erase cycles. The combination of low electric fields, clean oxide processing and minimized oxide area per memory cell subjected to the tunneling electric field results in very high cycling capability.
3.4
Since an erase operation may take a few seconds to complete, an Erase Suspend command is provided. This allows erase-sequence interruption in order to read data from another block of the memory array. Once the erase sequence is started, writing the Erase Suspend command to the CUI requests that the WSM pause the erase sequence at a predetermined point in the erase algorithm. The status register must then be read to determine if the erase operation has been suspended. Taking VPP below VPPLK latches the VPP low status and aborts the operation in progress. VPP should be maintained at valid levels, even during Erase Suspend. At this point, a Read Array command can be written to the CUI in order to read data from blocks other than that being erased. The only other valid commands at this time are Erase Resume and Read Status Register. During erase suspend mode, the chip can go into a pseudo-standby mode by taking CE# to VIH, which reduces active current draw. To resume the erase operation, the chip must be enabled by taking CE# to VIL, then issuing the Erase Resume command. When the Erase Resume command is given, the WSM will continue with the
Boot Block Locking
The Boot Block memory architecture features a hardware-lockable boot block so that the kernel code for the system can be kept secure while the parameter and main blocks are programmed and erased independently as necessary. Only the boot block can be locked independently from the other blocks. 3.4.1 VPP = VIL FOR COMPLETE PROTECTION
For complete write protection of all blocks in the flash device, the VPP programming voltage can be held low. When VPP is below VPPLK, any program or erase operation will cause the device to set an error bit in the status register. 3.4.2 RP# = VHH FOR BOOT BLOCK UNLOCKING
In the case of boot block modifications (write and erase), RP# and VPP are set to VHH (12 V). However, if RP# is not at VHH when a program or erase operation of the boot block is attempted, the corresponding status register bit (Bit 4 for Program and Bit 5 for Erase, refer to Table 5 for status register definitions) is set to indicate the failure to complete the specified operation.
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28F002BC
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Start
Bus Operation Write Write Command Program Setup Program Comments Data = 40H Addr = Byte to Program Data = Data to Program Addr = Location to Program Status Register Data Toggle CE# or OE# to Update SRD Check SR.7 1 = WSM Ready 0 = WSM Busy Read Standby Repeat for subsequent writes. SR Full Status Check can be done after each write, or after a sequence of writes. Write FFH after the last write operation to reset device to read array mode.
Write 40H and Byte Address Write Data and Data Address Read Status Register No
SR.7 = 1 ? Yes Full Status Check if Desired
Program Complete
FULL STATUS CHECK PROCEDURE Read Status Register Data (See Above) 1 SR.3 = 0 SR.4 = 0 Program Successful 1 Program Error VPP Range Error
Standby Bus Operation Standby Command Comments Check SR.3 1 = VPP Low Detect Check SR.4 1 = Program Error
SR.3 must be cleared, if set during a program attempt, before further attempts are allowed by the Write State Machine. SR.4 is only cleared by the Clear Status Register command, in cases where multiple bytes are programmed, before full status is checked. If an error is detected, clear the status register before attempting retry or other error recovery.
0578_07
Figure 7. Automated Programming Flowchart
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Start
Bus Operation Command
28F002BC
Comments Data = 20H Addr = Within Block to be Erased Data = D0H Addr = Within Block to be Erased Status Register Data Toggle CE# or OE# to Update SRD Check SR.7 1 = WSM Ready 0 = WSM Busy
Write 20H and Block Address Write D0H and Block Address Read Status Register Suspend Erase Loop SR.7 = Yes Full Status Check if Desired 0 Suspend Erase Yes
Write
Erase Setup Erase Confirm
Write
Read
Standby
Repeat for subsequent block erasures. Full Status Check can be done after each block erase, or after a sequence of block erasures. Write FFH after the last operation to reset device to read array mode.
Program Complete
FULL STATUS CHECK PROCEDURE Read Status Register Data (See Above) 1 SR.3 = 0 SR.4, 5 = 0 SR.5 = 0 Block Erase Successful
0578_08
Bus Operation Standby
Command
Comments Check SR.3 1 = VPP Low Detect Check SR.4, 5 Both 1 = Command Sequence Error Check SR.5 1 = Block Erase Error
VPP Range Error
Standby Standby
1
Command Sequence Error
SR.3 must be cleared, if set during an erase attempt, before further attempts are allowed by the Write State Machine. SR.5 is only cleared by the Clear Status Register command, in cases where multiple blocks areeased, before full status is checked. If an error is detected, clear the status register before attempting retry or other error recovery.
1
Block Erase Error
Figure 8. Automated Block Erase Flowchart
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28F002BC
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Bus Operation Write Command Program Erase Suspend Read Status Comments Data = B0H Addr = X Data =70H Addr =X Status Register Data Toggle CE# or OE# to Update Status Register Data Addr = X Check SR.7 1 = WSM Ready 0 = WSM Busy Check SR.6 1 = Erase Suspended 0 = Erase Completed Read Array Data = FFH Addr = X Read array data from block other than the one being programmed Erase Resume Data = D0H Addr = X Write Read Standby
Start
Write B0H
Write 70H
Read Status Register
SR.7 = 1 SR.6 = 1 Write FFH
0
Standby
Write
0
Erase Resumed
Read
Write
Read Array Data
Done Reading Yes Write D0H
No
Write FFH
Erase Resumed
Read Array Data
0578_09
Figure 9. Erase Suspend/Resume Flowchart
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3.5
3.5.1 3.5.2
28F002BC
required, since the device is indifferent as to which power supply, VPP or VCC, powers-up first. The CUI is reset to the read mode after power-up, but the system must drop CE# low or present a new address to ensure valid data at the outputs. A system designer must guard against spurious writes when VCC voltages are above VLKO and VPP = VHH. Since both WE# and CE# must be low for a command write, driving either signal to VIH will inhibit writes to the device. The CUI architecture provides additional protection since alteration of memory contents can only occur after successful completion of the two-step command sequences. The device is also disabled until RP# is brought to VIH, regardless of the state of its control inputs. By holding the device in reset (RP# connected to system PowerGood/Reset) during power-up/down, invalid bus conditions during power-up can be masked, providing yet another level of memory protection. 3.6.1 RP# CONNECTED TO SYSTEM RESET
Power Consumption
ACTIVE POWER
With CE# at a logic-low level and RP# at a logichigh level, the device is placed in the active mode. The device ICC current is a maximum of 60 mA at 10 MHz with TTL input signals. STANDBY POWER
With CE# at a logic-high level (VIH), the memory is placed in standby mode, where the maximum ICC standby current is 100 A. The standby operation disables much of the device's circuitry and substantially reduces device power consumption. The outputs (DQ[0:7]) are placed in a highimpedance state independent of the status of the OE# signal. When CE# is at a logic-high level during erase or program, the device will continue to perform the erase or program function and consume erase or program active power until erase or program is completed. 3.5.3 DEEP POWER-DOWN
The 28F002BC flash memory supports a typical ICC of 0.2 A in deep power-down mode. This mode is activated by the RP# pin when it is at a logic-low (GND 0.2 V); in this mode, all internal circuits are turned off to save power. Setting the RP# pin low de-selects the memory and places the output drivers in a high impedance state. Recovery from the deep power-down state requires a minimum access time of 300 ns (Section 4.5, AC Characteristics--Read-Only Operations, tPHQV parameter). During erase or program modes, RP# low will abort either erase or program operations, but the memory contents are no longer valid as the data has been corrupted. RP# transitions to VIL or turning power off to the device will clear the status register.
The use of RP# during system reset is important with automated write/erase devices because the system expects to read from the flash memory when it comes out of reset. If a CPU reset occurs without a flash memory reset, proper CPU initialization would not occur because the flash memory may be providing status information instead of array data. Intel's Flash memories allow proper CPU initialization following a system reset by connecting the RP# pin to the same RESET# signal that resets the system CPU. 3.6.2 VCC, VPP AND RP# TRANSITIONS
The CUI latches commands as issued by system software and is not altered by VPP, CE# transitions, or WSM actions. Its default state upon power-up, after exit from deep power-down mode, or after VCC transitions above VLKO, is read array mode. After any program or block erase operation is complete, and even after VPP transitions down to VPPLK, the CUI must be reset to read array mode via the Read Array command if access to the flash memory is desired.
3.6
Power-Up/Down Operation
The 28F002BC offers protection against accidental block erasure or programming during power transitions. Power supply sequencing is not
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28F002BC
3.7
Power Supply Decoupling
3.7.1
VPP TRACE ON PRINTED CIRCUIT BOARDS
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Flash memory's power switching characteristics require careful device decoupling methods. System designers should consider three supply current issues: 1. Standby current levels (ICCS) 2. Active current levels (I CCR) 3. Transient peaks produced by falling and rising edges of CE# Transient current magnitudes depend on the device outputs' capacitive and inductive loading. Two-line control and proper decoupling capacitor selection will suppress these transient voltage peaks. Each flash device should have a 0.1 F ceramic capacitor connected between each VCC and GND, and between its VPP and GND. These highfrequency, inherently low-inductance capacitors should be placed as close as possible to the package leads.
Designing for in-system writes to the flash memory requires special consideration of the VPP power supply trace by the printed circuit board designer. The VPP pin supplies the flash memory cells current for programming and erasing. One should use similar trace widths and layout considerations given to the VCC power supply trace. Adequate VPP supply traces and decoupling capacitors placed adjacent to the component will decrease spikes and overshoots.
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4.0 4.1
28F002BC
NOTICE: This datasheet contains preliminary information on new products in production. Do not finalize a design with this information. Revised information will be published when the product is available. Verify with your local Intel Sales office that you have the latest datasheet before finalizing a design.
ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings*
Operating Temperature During Read...............................0 C to +70 C During Write and Block Erase ....0 C to +70 C Temperature Bias................... -10 C to +80 C Storage Temperature ................. -65 C to +125 C Voltage on Any Pin (except V CC, VPP, A9 and RP#) with Respect to GND............-2.0 V to +7.0 V(1) Voltage on Pin RP# or Pin A9 with Respect to GND....... -2.0 V to +13.5 V(1, 2) VPP Program Voltage with Respect to GND during Write and Block Erase............. -2.0 V to +14.0 V(1, 2) VCC Supply Voltage with Respect to GND...........-2.0 V to +7.0 V (1) Output Short Circuit Current .................... 100 mA(3)
* WARNING: Stressing the device beyond the "Absolute Maximum Ratings" may cause permanent damage. These are stress ratings only. Operation beyond the "Operating Conditions" is not recommended and extended exposure beyond the "Operating Conditions" may effect device reliability.
NOTES: 1. Minimum DC voltage is -0.5 V on input/output pins. During transitions, this level may undershoot to -2.0 V for periods <20 ns. Maximum DC voltage on input/output pins is VCC + 0.5 V which, during transitions, may overshoot to VCC + 2.0 V for periods <20 ns. 2. Maximum DC voltage on VPP may overshoot to +14.0 V for periods <20 ns. Maximum DC voltage on RP# or A9 may overshoot to 13.5 V for periods <20 ns. 3. Output shorted for no more than one second. No more than one output shorted at a time.
4.2
Operating Conditions
Table 6. Temperature and VCC Operating Conditions Parameter Operating Temperature 5 V VCC Supply Voltage (10%) Notes Min 0 4.50 Max 70 5.50 Units C Volts
Symbol TA VCC
4.3
Capacitance
Symbol Parameter Input Capacitance Output Capacitance Notes 1 1, 2 Typ 6 10 Max 8 12 Unit pF pF Conditions VIN = 0 V VOUT = 0 V
TA = +25 C, f = 1 MHz
CIN COUT
NOTES: 1. Sampled, not 100% tested. 2. For the 28F002BC, address pin A10 follows the COUT capacitance numbers.
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28F002BC
4.4
Symbol IIL ILO ICCS
DC Characteristics
Parameter Input Load Current Output Leakage Current VCC Standby Current Notes 1 1 1,3 Min Typ Max 1.0 10 1.5 Units A A mA
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Test Conditions VCC = VCC Max VIN = VCC or GND VCC = VCC Max VIN = VCC or GND VCC = VCC Max CE# = RP# = WP# = VIH VCC = VCC Max CE# = RP# = VCC 0.2 V VCC = VCC Max VIN = VCC or GND RP# = GND 0.2 V CMOS INPUTS VCC = VCC Max CE# = GND f = 10 MHz IOUT = 0 mA CMOS Inputs: GND 0.2 V or VCC 0.2 V TTL INPUTS VCC = VCC Max CE# = VIL f = 10 MHz IOUT = 0 mA TTL Inputs: VIL or VIH Byte Prog. in Progress Block Erase in Progress CE# = VIH Block Erase Suspend VPP VCC RP# = GND 0.2 V VPP > VCC VPP = VPPH Byte Prog. in Progress VPP = VPPH Block Erase in Progress VPP = VPPH Block Erase Suspended 50 100 A 1 0.2 8.0 A 1,5 20 55 mA
ICCD
VCC Deep Power-Down Current VCC Read Current
ICCR
20
60
mA
ICCW ICCE ICCES IPPS IPPD IPPR IPPW IPPE
VCC Program Current VCC Erase Current VCC Erase Suspend Current VPP Standby Current VPP Deep Power-Down Current VPP Read Current VPP Program Current VPP Erase Current VPP Erase Suspend Current
1,4 1,4 1,2 1 1 1 1,4 1,4 5
50 30 10 10 5.0 200 20 15
mA mA mA A A A mA mA
IPPES
1
200
A
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4.4
Symbol IRP# IID VID VIL VIH VOL VOH
28F002BC
DC Characteristics (Continued)
Parameter RP# Boot Block Unlock Current A9 Intelligent Identifier Current A9 Intelligent Identifier Voltage Input Low Voltage Input High Voltage Output Low Voltage Output High Voltage (TTL) Output High Voltage (CMOS) 2.4 0.85 VCC VCC - 0.4V Notes 1,4 1,4 10.8 -0.5 2.0 Min Typ Max 500 500 13.2 0.8 VCC + 0.5V 0.45 Units A A V V V V V V VCC = VCC Min IOL = 5.8 mA VCC = VCC Min IOH = -2.5 mA VCC = VCC Min IOH = -1.5 mA VCC = VCC Min IOH = -100 A 6.5 12.0 12.0 12.6 13.2 V V V V 12.0 13.2 V Boot Block Unlock Voltage Complete Write Protection Test Conditions RP# = VHH A9 = VID
VPPLK VPPH VPPH VLKO VHH
VPP Lock-Out Voltage VPP (Program/ Erase Operations) VPP (Program/ Erase Operations) VCC Erase/Write Lock Voltage RP# Unlock Voltage
3 7 8
0.0 11.4 10.8 2.0
8
10.8
NOTES: 1. All currents are in RMS unless otherwise noted. Typical values at VCC = 5.0 V, VPP =12.0 V , T = +25 C. These currents are valid for all product versions (packages and speeds). 2. ICCES is specified with the device de-selected. If the device is read while in erase suspend mode, current draw is the sum of ICCES and ICCR. 3. Block erases and byte writes are inhibited when VPP = VPPLK, and not guaranteed in the range between VPPH and VPPLK. 4. Sampled, not 100% tested. 5. CMOS Inputs are either VCC 0.2 V or GND 0.2 V. TTL Inputs are either VIL or VIH. 6. VCC = 5.0 V 10% for applications requiring 100,000 block erase cycles. 7. VPP = 12.0 V 5% for applications requiring 100,000 block erase cycles. 8. VPP = 12.0 V 10% for applications requiring wider VPP tolerances: Parameter blocks can sustain 10,000 block erase cycles; main blocks support up to 100 block erase cycles. Note that erase times are close to maximum spec limits when using this option.
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2.0 INPUT 0.8 TEST POINTS 0.8
0578_10
2.4
2.0 OUTPUT
0.45
NOTE: AC test inputs are driven at VOH (2.4 VTTL) for a logic "1" and VOL (0.45 VTTL) for a logic "0." Input timing begins at VIH (2.0 VTTL) and VIL (0.8 VTTL). Output timing ends at VIH and VIL.
Figure 10. Inputs and Measurement Points
1.3V
1N914
RL DEVICE UNDER TEST CL
OUT
0578_11
NOTES: CL = 100 pF, includes Jig Capacitance RL = 3.3K
Figure 11. Standard Test Configuration
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4.5
Symbol tAVAV tAVQV tELQV tPHQV tGLQV tELQX tEHQZ tGLQX tGHQZ tOH
28F002BC
AC Characteristics--Read-Only Operations(1)
28F002BC-80 Parameter Notes VCC = 5 V 10% 100 pF Min Read Cycle Time Address to Output Delay CE# to Output Delay RP# to Output Delay OE# to Output Delay CE# to Output in Low Z CE# to Output in High Z OE# to Output in Low Z OE# to Output in High Z Output Hold from Address, CE#, or OE# Change, Whichever Occurs First 2 3 3 3 3 3 0 0 30 0 0 30 0 30 2 80 80 80 300 40 0 30 Max 28F002BC-120 VCC = 5 V 10% 100 pF Min 120 120 120 300 40 Max ns ns ns ns ns ns ns ns ns ns Units
NOTES: 1. See Inputs and Measurement Points (Figure 10). 2. OE# may be delayed up to tCE--tOE after the falling edge of CE# without impact on tCE. 3. Sampled, but not 100% tested. 4. See Standard Test Configuration (Figure 11).
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28F002BC
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Device and Address Selection Address Stable t AVAV t EHQZ Data Valid Standby VIH VIL t GHQZ t GLQX High Z t ELQX t AVQV t PHQV
0578_12
VIH ADDRESSES (A) VIL CE# (E)
VIH OE# (G) VIL VIH WE# (W) VIL VOH DATA (D/Q) VOL RP#(P) VIH VIL t GLQV t ELQV Valid Output t OH
High Z
Figure 12. AC Waveforms for Read Operations
4.6
AC Characteristics--WE#-Controlled Write Operations(1)
28F002BC-80 28F002BC-120 VCC = 5 V 10% 100 pF Min 120 215 0 100 100 50 50 50 0 0 0 Max ns ns ns ns ns ns ns ns ns ns ns Units
Symbol
Parameter
Notes
VCC = 5 V 10% 100 pF Min Max
tAVAV tPHWL tELWL tPHHWH tVPWH tAVWH tDVWH tWLWH tWHDX tWHAX tWHEH
Write Cycle Time RP# Setup to WE# Going Low CE# Setup to WE# Going Low Boot Block Lock Setup to WE# Going High VPP Setup to WE# Going High Address Setup to WE# Going High Data Setup to WE# Going High WE# Pulse Width Data Hold Time from WE# High Address Hold Time from WE# High CE# Hold Time from WE# High 4 3 6, 8 5, 8 3 4
80 215 0 100 100 50 50 50 0 0 0
30
PRELIMINARY
E
4.6
Symbol tWHWL tWHQV1 tWHQV2 tWHQV3 tWHQV4 tQVVL tQVPH tPHBR
28F002BC
AC Characteristics--WE#-Controlled Write Operations(1) (Continued)
28F002BC-80 Parameter Notes VCC = 5 V 10% 100 pF Min WE# Pulse Width High Duration of Programming Operation Duration of Erase Operation (Boot) Duration of Erase Operation (Parameter) Duration of Erase Operation (Main) VPP Hold from Valid SRD RP# VHH Hold from Valid SRD Boot Block Lock Delay 2, 5 2, 5, 6 2,5 2, 5 5, 8 6, 8 7, 8 20 6 0.3 0.3 0.6 0 0 100 Max 28F002BC-120 VCC = 5 V 10% 100 pF Min 20 6 0.3 0.3 0.6 0 0 100 Max ns s s s s ns ns ns Units
NOTES: 1. Read timing characteristics during write and erase operations are the same as during read-only operations. Refer to AC Characteristics--Read-Only Operations during read mode. 2. The on-chip WSM completely automates program/erase operations; program/erase algorithms are now controlled internally which includes verify and margining operations. 3. Refer to command definition table for valid AIN. 4. Refer to command definition table for valid DIN. 5. Program/erase durations are measured to valid SRD data (successful operation, SR.7 = 1). 6. For boot block program/erase, RP# should be held at VHH until operation completes successfully. 7. Time tPHBR is required for successful relocking of the boot block. 8. Sampled, but not 100% tested.
PRELIMINARY
31
28F002BC
E
A VIH VIL VIH CE# (E) VIL VIH OE# (G) VIL VIH VIL VIH
High Z
B
C
D
E
F
ADDRESSES (A)
AIN
AIN
tAVAV tELWL
tAVWH tWHEH
tWHAX
tWHWL tWLWH tDVWH tWHDX
DIN DIN
tWHQV1,2,3,4
WE# (W)
DATA (D/Q)
VIL VHH VIH VIL VIH VIL
Valid SRD
DIN
tPHHWH tPHWL
tQVPH
6.5V RP# (P) WP# ()
tVPWH
tQVVL
V2 VPP (V)VPPH1 PPH VPPLK VIL
0578_13
NOTES: A. VCC Power-Up and Standby B. Write Program Setup or Erase Setup Command C. Write Valid Address and Data (Program or Erase Confirm Command D. Automated Program or Erase Delay E. Read Status Register Data F. Write Read Array Command
Figure 13. AC Waveforms for Write and Erase Operations (WE#--Controlled Writes)
32
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E
4.7
Symbol tAVAV tPHEL tWLEL tPHHEH tVPEH tAVEH tDVEH tELEH tEHDX tEHAX tEHWH tEHEL tEHQV1 tEHQV2 tEHQV3 tEHQV4 tQVVL tQVPH tPHBR
28F002BC
AC Characteristics--CE#-Controlled Write Operations(1, 9)
28F002BC-80 Parameter Notes VCC = 5 V 10% 100 pF Min Write Cycle Time RP# High Recovery to CE# Going Low WE# Setup to CE# Going Low Boot Block Lock Setup to CE# Going High VPP Setup to CE# Going High Address Setup to CE# Going High Data Setup to CE# Going High CE# Pulse Width Data Hold Time from CE# High Address Hold Time from CE# High WE # Hold Time from CE# High CE# Pulse Width High Duration of Programming Operation Duration of Erase Operation (Boot) Duration of Erase Operation (Parameter) Duration of Erase Operation (Main) VPP Hold from Valid SRD RP# VHH Hold from Valid SRD Boot Block Lock Delay 2, 5 2, 5, 6 2, 5 2, 5 5, 8 6, 8 7, 8 4 3 6, 8 5, 8 3 4 80 215 0 100 100 50 50 50 0 0 0 30 6 0.3 0.3 0.6 0 0 100 Max 28F002BC-120 VCC= 5 V 10% 100 pF Min 120 215 0 100 100 50 50 50 0 0 0 30 6 0.3 0.3 0.6 0 0 100 Max ns ns ns ns ns ns ns ns ns ns ns ns s s s s ns ns ns Units
NOTES: See AC Characteristics--WE#-Controlled Write Operations for notes 1 through 8. 9. Chip-Enable controlled writes: write operations are driven by the valid combination of CE# and WE# in systems where CE# defines the write pulse-width (within a longer WE# timing waveform), all set-up, hold and inactive WE# times should be measured relative to the CE# waveform.
PRELIMINARY
33
28F002BC
E
A VIH VIL VIH CE# (E) VIL VIH OE# (G) VIL VIH VIL VIH
High Z
B
C
D
E
F
ADDRESSES (A)
AIN
AIN
tAVAV tWLEL
tAVEH tEHWH
tEHAX
tEHEL tELEH tDVEH tEHDX
DIN DIN
tEHQV1,2,3,4
WE# (W)
DATA (D/Q)
VIL VHH VIH VIL VIH VIL
Valid SRD
DIN
tPHHEH tPHWL
tQVPH
6.5V RP# (P) WP# ()
tVPEH
tQVVL
V2 VPP (V)VPPH1 PPH VPPLK VIL
0578_14
NOTES: A. VCC Power-Up and Standby B. Write Program Setup or Erase Setup Command C. Write Valid Address and Data (Program or Erase Confirm Command D. Automated Program or Erase Delay E. Read Status Register Data F. Write Read Array Command
Figure 14. Alternate AC Waveforms for Write and Erase Operations (CE#--Controlled Writes)
34
PRELIMINARY
E
4.8
TA = +25 C
28F002BC
Erase and Program Timings
VPP = 12 V 10%(2) Parameter(1) VCC = 5 V 10% Typ Boot/Parameter Block Erase Time Main Block Erase Time Main Block Write Time 5.8 14 6.0 Max 40 60 20
VPP = 12 V 5% VCC = 5 V 10% Typ 1.0 2.4 1.2 Max 7 14 4.2 s s s Units
NOTES: 1. All numbers are sampled, not 100% tested. 2. Erase times near max limits when the 10% VPP option is used.
5.0
ORDERING INFORMATION
E2 8 F 0 0 2 BC - T 1 2 0
Package E = 40-Lead TSOP P = 40-Lead PDIP PA = 44-Lead PSOP Product line designator for all Intel(R) Flash products Access Speed (ns) (80, 120)
T = Top Boot
Device/Organization 00X= x8-only (X = 2)
Architecture B = Boot Block
0578_14
VALID COMBINATIONS: 40-Lead TSOP Commercial 2 M E28F002BC-T80 E28F002BC-T120
40-Lead PDIP P28F002BC-T80 P28F002BC-T120
44-Lead PSOP PA28F002BC-T80 PA28F002BC-T120
PRELIMINARY
35
28F002BC
6.0
ADDITIONAL INFORMATION
Document
E
Order Number 290580 292161 292163 Note 3 Note 3 Note 3 Note 3 Note 3 Note 3 Note 3
3 Volt Advanced Boot Block Flash Memory; 28F004/400B3, 28F008/800B3, 28F016/160B3, 28F320B3 datasheet AP-608 Implementing a Plug and Play BIOS Using Intel's Boot Block Flash Memory AP-610 Flash Memory In-System Code and Data Update Techniques AB-57 Boot Block Architecture for Safe Firmware Updates AP-363 Extended Flash BIOS Concepts for Portable Computers AP-604 Using Intel's Boot Block Flash Memory Parameter Blocks to Replace EEPROM 28F002/200BX-T/B 2-Mbit Boot Block Flash Memory datasheet 28F004/400BX-T/B 4-Mbit Boot Block Flash Memory datasheet 28F002/200BV-T/B 2-Mbit SmartVoltage Flash Memory datasheet 28F004/400BV-T/B 4-Mbit SmartVoltage Flash Memory datasheet
NOTES: 1. Please call the Intel Literature Center at (800) 548-4725 to request Intel documentation. International customers should contact their local Intel or distribution sales office. 2. Visit Intel's World Wide Web home page at http://www.intel.com for technical documentation and tools. 3. These documents can be located at the Intel World Wide Web support site, http://www.intel.com/support/flash/memory
36
PRELIMINARY
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Current State
Read Array Program Setup Program* (Not Comp.) Program (Comp.) Erase Setup "0" Status SR.7 Data When Read "1" Array "1" Status
28F002BC
APPENDIX A WSM TRANSITION TABLE
Write State Machine Current/Next States Command Input (and Next State)
Read Array (FFH) Read Array Program Setup (40H) Program Setup Erase Setup (20H) Erase Setup Erase Confirm (D0H) Erase Susp. (B0H) Erase Resume (D0H) Read Status (70H) Read Status Clear Status (50H) Read Array Read ID (90H)
Read Array
Read ID
Program (Command Input = Byte Program Data)
Program
"1"
Status
Read Array
Program Setup
Erase Setup
Read Array Erase Cmd. Error
Read Status
Read Array
Read ID
Erase Command Error "1" Status Erase
Erase
Erase Command Error
Erase Cmd. Error Erase (Not Comp.) Erase (Comp.) Erase Suspend to Status Erase Suspend to Array Read Status Read Identifier
"1"
Status
Read Array
Program Setup
Erase Setup
Read Array
Read Status
Read Array
Read ID
"0"
Status
Erase
Erase Susp. to Status
Erase
"1"
Status
Read Array Erase Susp. to Array Erase Susp. to Array Read Array Read Array
Program Setup Erase Susp. to Array Erase Susp. to Array Program Setup Program Setup
Erase Setup Erase Susp. to Array Erase Susp. to Array Erase Setup Erase Setup
Read Array Erase Susp. to Array Erase Susp. to Array
Read Status
Read Array
Read ID
"1"
Status
Erase
Erase
Erase Erase Erase Susp. to Susp. to Susp. to Status Array Array Erase Erase Erase Susp. to Susp. to Susp. to Status Array Array Read Status Read Status Read Array Read Array
"1"
Array
Erase
Erase
"1"
Status
Read Array
Read ID
"1"
ID
Read Array
Read ID
NOTE: You cannot program "1"s to the flash. Writing FFH after the Program Setup command will initiate the program algorithm of the WSM machine. The WSM will attempt the program, realize you are trying to program "1"s, and exit to read status mode without changing memory contents. No error is returned. Writing another FFH while in read status mode will return the flash to Read Array.
PRELIMINARY
37

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